Printed metal gasket

Patent metadata

Field	Value
Publication number	US-11793059-B2
Application number	US-202117394769-A
Country	US
Kind code	B2
Filing date	Aug 5, 2021
Priority date	Jan 11, 2018
Publication date	Oct 17, 2023
Grant date	Oct 17, 2023

Abstract

Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.

First claim

We claim:

1. A device comprising:
a die comprising one or more vias;
a metal gasket disposed on and non-removably attached to a surface of the die around the one or more vias, the metal gasket comprising a metal deposited via a metal-containing ink; and
a metal manifold;
wherein the gasket removably connects the die to the metal manifold.

2. The device of claim 1 , wherein the gasket forms a closed contour around the one or more vias.

3. The device of claim 1 , wherein the die comprises a plurality of vias including the one or more vias.

4. The device of claim 1 , further comprising a plurality of non-intersecting metal gaskets including the metal gasket.

5. The device of claim 4 , wherein each gasket of the plurality of non-intersecting metal gaskets forms a contour around at least one of the plurality of vias.

6. The device of claim 1 , wherein the die is removable from the metal manifold by removal of a compressive force.

7. The device of claim 1 , wherein the die comprises silicon.

8. The device of claim 1 , wherein the metal gasket is formed from a plurality of traces of the metal-containing ink and at least two of the plurality of traces intersect.

9. The device of claim 1 , wherein the metal-containing ink comprises a compound selected from the group consisting of: a suspension of metallic nanoparticles in an organic solvent; and a solution of organometallic precursors.

10. The device of claim 9 , wherein the metal-containing ink comprises at least one metal selected from the group consisting of: silver, gold, copper, titanium.

11. The device of claim 1 , wherein the gasket has a thickness of not more than 100 μm.

12. A method of connecting a first component of a device to a second component of a device, the method comprising:
depositing a metal-containing ink on a first component of a device to form a gasket;
placing the gasket in direct physical contact with a second component of a device to which the first component is to be attached; and
applying a compressive force to the first component against the second component to form a sealed connection between the first component and the second component.

13. The method of claim 12 , wherein the first component is removable from the second component by removing the compressive force.

Assignees

• Universal Display Corp

Inventors

• Quinn William E
• Paynter Jason
• Mcgraw Gregory
• King Matthew

Classifications

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K71/00 Primary

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K71/611 Primary

  using printing deposition, e.g. ink jet printing · CPC title

• H10K50/8426

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K71/811

  Controlling the atmosphere during processing (H10K71/40 takes precedence) · CPC title