Printed circuit board and display connection structure

Patent metadata

Field	Value
Publication number	US-11792934-B2
Application number	US-201917272655-A
Country	US
Kind code	B2
Filing date	May 24, 2019
Priority date	Nov 9, 2018
Publication date	Oct 17, 2023
Grant date	Oct 17, 2023

Abstract

This application relates to a printed circuit board, including: a plurality of bonding pad areas configured to be electrically connected to a display; a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area. The contact pad area includes a plurality of contact pads configured to be electrically connected to an external input connector. A width of the plurality of contact pads is 0.3 mm, and a distance between the plurality of contact pads is 0.2 mm. A length of the contact pad is the same as a length of a bonding pad in the bonding pad area.

First claim

What is claimed is:

1. A printed circuit board, comprising:
a plurality of bonding pad areas configured to be electrically connected to a display;
a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and
a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area.

2. The printed circuit board according to claim 1 , wherein the contact pad area comprises a plurality of contact pads configured to be electrically connected to an external input connector, a width of the plurality of contact pads being 0.3 mm.

3. The printed circuit board according to claim 1 , wherein the contact pad area comprises a plurality of contact pads configured to be electrically connected to an external input connector, a distance between the plurality of contact pads being 0.2 mm.

4. The printed circuit board according to claim 1 , wherein the contact pad area comprises a plurality of contact pads, a length of the contact pad being the same as a length of a bonding pad in the bonding pad area.

5. The printed circuit board according to claim 1 , further comprising a gold finger area.

6. A display connection structure, comprising:
a display area comprising a fanout area;
a printed circuit board (PCB) configured to be electrically connected to the fanout area and comprising:
a plurality of bonding pad areas configured to be electrically connected to the fanout area; and
a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and
a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area.

7. The display connection structure according to claim 6 , wherein the contact pad area comprises a plurality of contact pads configured to be electrically connected to an external input connector, a width of the plurality of contact pads being 0.3 mm.

8. The display connection structure according to claim 6 , wherein the contact pad area comprises a plurality of contact pads configured to be electrically connected to an external input connector, a distance between the plurality of contact pads being 0.2 mm.

9. The display connection structure according to claim 6 , wherein the contact pad area comprises a plurality of contact pads, a length of the contact pad being the same as a length of a bonding pad in the bonding pad area.

10. The display connection structure according to claim 6 , wherein the fanout area comprises a turn-on voltage and a turn-off voltage electrically connected to a first switch and a second switch, to control turn-on or turn-off of the first switch and the second switch.

11. The display connection structure according to claim 6 , wherein a first switch and a second switch are electrically connected to the bonding pad area of the PCB.

12. The display connection structure according to claim 10 , wherein in the fanout area, a resistance exists between the turn-on voltage and the turn-off voltage, the resistance being greater than 100 KΩ.

13. The display connection structure according to claim 6 , wherein the fanout area comprises a first Schottky diode electrically connected between a first switch and the ground and a second Schottky diode electrically connected between a second switch and the ground.

14. The display connection structure according to claim 6 , wherein a first switch and a second switch are metal-oxide-semiconductor field-effect diode switches.

15. The display connection structure according to claim 13 , wherein when there is Electro-Static discharge outside, the first Schottky diode and the second Schottky diode are capable of absorbing the Electro-Static discharge.

16. A display connection structure, comprising:
a display area comprising a fanout area;
a printed circuit board (PCB) configured to be electrically connected to the fanout area and comprising:
a plurality of bonding pad areas configured to be electrically connected to the fanout area; and
a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and
a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area, wherein
the fanout area comprises a turn-on voltage and a turn-off voltage electrically connected to a first switch and a second switch, to control turn-on or turn-off of the first switch and the second switch;
the first switch and the second switch are electrically connected to the bonding pad area of the PCB, and a resistance exists between the turn-on voltage and the turn-off voltage, the resistance being greater than 100 KΩ; and
the fanout area comprises a first Schottky diode electrically connected between the first switch and the ground and a second Schottky diode electrically connected between the second switch and the ground.

17. The display connection structure according to claim 16 , wherein the contact pad area comprises a plurality of contact pads configured to be electrically connected to an external input connector, a width of the plurality of contact pads being 0.3 mm.

18. The display connection structure according to claim 16 , wherein the contact pad area comprises a plurality of contact pads configured to be electrically connected to an external input connector, a distance between the plurality of contact pads being 0.2 mm.

19. The display connection structure according to claim 16 , wherein the PCB has a gold finger area.

20. The display connection structure according to claim 19 , wherein the gold finger area comprises: the plurality of bonding pad areas and the plurality of dummy pad areas.

Assignees

• Chongqing Advance Display Tech Research
• Chongqing Hkc Optoelectronics Tech Co Ltd

Inventors

• Huang Xiaoyu

Classifications

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• G02F1/136286

  Wiring, e.g. gate line, drain line · CPC title

• H05K2201/0738

  Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials · CPC title

• H05K2201/09409

  Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components · CPC title

• H05K2201/10136

  Liquid Crystal display [LCD] · CPC title