Dielectric thin film, capacitor including the dielectric thin film, and method for manufacturing the dielectric thin film

US11791373B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11791373-B2
Application numberUS-202117306310-A
CountryUS
Kind codeB2
Filing dateMay 3, 2021
Priority dateNov 24, 2020
Publication dateOct 17, 2023
Grant dateOct 17, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a method of preparing a dielectric film having a nanoscale three-dimensional shape and including an oxide, the oxide represented by R A M B O C where R is a divalent element and M is a pentavalent element, the method may include synthesizing a target material, the target material including the divalent element and the pentavalent element; and forming the oxide by depositing the divalent element and the pentavalent element, from the target material, onto a substrate such that the oxide includes a perovskite-type crystal structure, 1.3<B/A<1.7, and 9.0≤C<10.0.

First claim

Opening claim text (preview).

What is claimed is: 1. A dielectric having a three-dimensional nanoscale shape, the dielectric comprising: an oxide including a nanoscale three-dimensional (3D) perovskite-type crystal structure, the oxide represented by R A M B O C where R is a divalent element, M is a pentavalent element, 1.3<B/A<1.7, and 9.0≤C<10.0, wherein the dielectric is electrically neutral, and wherein the oxide is electrically neutral. 2. The dielectric of claim 1 , wherein, the divalent element comprises at least one of calcium (Ca), strontium (Sr), barium (Ba), or a combination thereof. 3. The dielectric of claim 1 , wherein, the pentavalent element comprises at least one of niobium (Nb), vanadium (V), tantalum (Ta), or a combination thereof. 4. The dielectric of claim 1 , wherein the oxide has a lattice constant of about 3.85 Å to about 3.95 Å. 5. The dielectric of claim 1 , wherein the oxide has a thickness of about 1.5 nm to about 1000 nm. 6. A capacitor comprising: a first electrode; a second electrode; and the dielectric of claim 1 between the first electrode and the second electrode. 7. The capacitor of claim 6 , further comprising: a seed layer between the second electrode and the oxide, the seed layer having a lattice misfit of 1% or less with respect to the oxide. 8. The capacitor of claim 6 , wherein the second electrode is a seed layer for the oxide, and the second electrode has a lattice misfit of about 1% or less with respect to the oxide.

Assignees

Inventors

Classifications

  • Electrodes · CPC title

  • H10D1/682Primary

    having dielectrics comprising perovskite structures · CPC title

  • H10D1/694Primary

    comprising noble metals or noble metal oxides · CPC title

  • H10D1/684Primary

    the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers · CPC title

  • Deposition from the gas or vapour phase · CPC title

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What does patent US11791373B2 cover?
Provided is a method of preparing a dielectric film having a nanoscale three-dimensional shape and including an oxide, the oxide represented by R A M B O C where R is a divalent element and M is a pentavalent element, the method may include synthesizing a target material, the target material including the divalent element and the pentavalent element; and forming the oxide by depositing the div…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10D1/682. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 17 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).