Adhesive with substrate compatibilizing particles

US11787987B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11787987-B2
Application numberUS-201816042627-A
CountryUS
Kind codeB2
Filing dateJul 23, 2018
Priority dateJul 23, 2018
Publication dateOct 17, 2023
Grant dateOct 17, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pair of bonded substrates having a first substrate of a first material, a second substrate of the first material, and an adhesive bonding the first substrate to the second substrate, wherein the adhesive has chemically linked compatibilizing particles compatible with the first and second substrates. A composition of matter has an adhesive having a chemically linked particle network forming a bond between a first substrate and a second substrate, wherein compatibilizing particles in the particle network are compatible with the first and second substrates. A method of joining two structures of identical materials includes preparing first and second structures to expose bare material, applying an adhesive to the bare material on the first and second structures, the adhesive containing compatibilizing particles compatible with the material and the preparing allows interaction between the material and the compatibilizing particles, and curing the adhesive.

First claim

Opening claim text (preview).

What is claimed is: 1. A pair of bonded substrates, comprising: a first substrate of a first material; a second substrate of the first material; and an adhesive bonding the first substrate to the second substrate, wherein the adhesive has a matrix and substrate compatibilizing chemically linked particles, each compatibilizing chemically linked particle directly bonded to the first and second substrates, comprising a metal oxide of the first material, the compatibilizing chemically linked particles comprising: a primary particle having primary functional groups comprising at least one of carboxyl groups or hydroxyl groups on a surface of the primary particle; and functional groups bonded to the primary functional groups that allow the compatibilizing particle to be similar to, compatible with, and directly bonded to the first and second substrates, and cause the particle to form a chemically linked particle network between the particles and chemical bonds to the matrix. 2. The pair of bonded substrates of claim 1 , wherein the compatibilizing chemically linked particles comprise particles having thermomechanical properties that match the thermomechanical properties of the first and second substrates. 3. The pair of bonded substrates of claim 1 , wherein the first material consists of carbon fiber reinforced polymer (CFRP) and the particles consist of graphene oxide functionalized particles. 4. The pair of bonded substrates of claim 1 , wherein the first material consists of aluminum and the particles consist of aluminum oxide. 5. The pair of bonded substrates of claim 1 , wherein the first material consists of one of either fiberglass reinforced polymers (FRP) or glass, and the particles consist of silicon oxide. 6. The pair of bonded substrates of claim 1 , wherein the first material consists of titanium and the particles consist of titanium oxide. 7. The pair of bonded substrates of claim 1 , wherein the first material consists of magnesium and the particles consist of magnesium oxide. 8. The pair of bonded substrates of claim 1 wherein the compatibilizing chemically linked particles are surface functionalized with epoxy groups and have a linker material that contains either amino or epoxy groups. 9. The pair of bonded substrates of claim 1 wherein the compatibilizing chemically linked particles are surface functionalized with vinyl bonds and have a linker material that contains vinyl groups.

Assignees

Inventors

Classifications

  • C09J163/00Primary

    Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title

  • comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

  • as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title

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What does patent US11787987B2 cover?
A pair of bonded substrates having a first substrate of a first material, a second substrate of the first material, and an adhesive bonding the first substrate to the second substrate, wherein the adhesive has chemically linked compatibilizing particles compatible with the first and second substrates. A composition of matter has an adhesive having a chemically linked particle network forming a …
Who is the assignee on this patent?
Palo Alto Res Ct Inc, Xerox Corp
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 17 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).