Method of preparing hierarchically porous polymers and hierarchically porous polymers prepared thereby
US-2019153190-A1 · May 23, 2019 · US
US11787987B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11787987-B2 |
| Application number | US-201816042627-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 23, 2018 |
| Priority date | Jul 23, 2018 |
| Publication date | Oct 17, 2023 |
| Grant date | Oct 17, 2023 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A pair of bonded substrates having a first substrate of a first material, a second substrate of the first material, and an adhesive bonding the first substrate to the second substrate, wherein the adhesive has chemically linked compatibilizing particles compatible with the first and second substrates. A composition of matter has an adhesive having a chemically linked particle network forming a bond between a first substrate and a second substrate, wherein compatibilizing particles in the particle network are compatible with the first and second substrates. A method of joining two structures of identical materials includes preparing first and second structures to expose bare material, applying an adhesive to the bare material on the first and second structures, the adhesive containing compatibilizing particles compatible with the material and the preparing allows interaction between the material and the compatibilizing particles, and curing the adhesive.
Opening claim text (preview).
What is claimed is: 1. A pair of bonded substrates, comprising: a first substrate of a first material; a second substrate of the first material; and an adhesive bonding the first substrate to the second substrate, wherein the adhesive has a matrix and substrate compatibilizing chemically linked particles, each compatibilizing chemically linked particle directly bonded to the first and second substrates, comprising a metal oxide of the first material, the compatibilizing chemically linked particles comprising: a primary particle having primary functional groups comprising at least one of carboxyl groups or hydroxyl groups on a surface of the primary particle; and functional groups bonded to the primary functional groups that allow the compatibilizing particle to be similar to, compatible with, and directly bonded to the first and second substrates, and cause the particle to form a chemically linked particle network between the particles and chemical bonds to the matrix. 2. The pair of bonded substrates of claim 1 , wherein the compatibilizing chemically linked particles comprise particles having thermomechanical properties that match the thermomechanical properties of the first and second substrates. 3. The pair of bonded substrates of claim 1 , wherein the first material consists of carbon fiber reinforced polymer (CFRP) and the particles consist of graphene oxide functionalized particles. 4. The pair of bonded substrates of claim 1 , wherein the first material consists of aluminum and the particles consist of aluminum oxide. 5. The pair of bonded substrates of claim 1 , wherein the first material consists of one of either fiberglass reinforced polymers (FRP) or glass, and the particles consist of silicon oxide. 6. The pair of bonded substrates of claim 1 , wherein the first material consists of titanium and the particles consist of titanium oxide. 7. The pair of bonded substrates of claim 1 , wherein the first material consists of magnesium and the particles consist of magnesium oxide. 8. The pair of bonded substrates of claim 1 wherein the compatibilizing chemically linked particles are surface functionalized with epoxy groups and have a linker material that contains either amino or epoxy groups. 9. The pair of bonded substrates of claim 1 wherein the compatibilizing chemically linked particles are surface functionalized with vinyl bonds and have a linker material that contains vinyl groups.
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title
using interposed adhesives or interposed materials with bonding properties · CPC title
comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title
comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title
as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.