Bonding system and bonding method

Patent metadata

Field	Value
Publication number	US-11787126-B2
Application number	US-201816499220-A
Country	US
Kind code	B2
Filing date	Mar 23, 2018
Priority date	Mar 29, 2017
Publication date	Oct 17, 2023
Grant date	Oct 17, 2023

Abstract

A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.

First claim

The invention claimed is:

1. A bonding system comprising:
a supporting jig having a mounting surface including a plurality of bonding supporting surfaces on which bonding substrates are mounted, wherein at least two of the bonding supporting surfaces have different normal directions angled relative to each other at 90 degrees or less;
a stand configured to support a portion of the supporting jig;
a turning bearing disposed between the stand and the supporting jig;
a spring-loaded ball roller disposed between the stand and the supporting jig, the spring-loaded ball roller spaced a distance from the turning bearing;
a bonding device that sandwiches and welds the bonding substrates between the bonding device and the mounting surface;
an articulated robot to which the bonding device is attached, the articulated robot configured to move the bonding device;
a temperature adjustment device that adjusts a temperature of the mounting surface; and
a control unit configured to control the articulated robot and the bonding device to move the bonding device to the plurality of bonding supporting surfaces and weld the bonding substrates thereon.

2. The bonding system according to claim 1 , wherein
the system further comprises temperature sensors to detect a temperature of the supporting jig.

3. The bonding system according to claim 1 , further comprising an operating device that operates the supporting jig.

4. The bonding system according to claim 1 , wherein the mounting surface of the supporting jig comprises:
a first horizontal surface;
a first inclined surface that extends upwards and obliquely from an end of the first horizontal surface;
a second horizontal surface that extends horizontally from an end of the first inclined surface; and
a second inclined surface that extends upwards and obliquely from an end of the second horizontal surface;
wherein the first inclined surface defines a first normal direction that extends diagonally upwards; and
wherein the second inclined surface defines a second normal direction that extends diagonally downwards.

5. The bonding system according to claim 4 , wherein the mounting surface of the supporting jig further comprises:
a first vertical surface that extends vertically from an end of the second inclined surface; and
a third horizontal surface that extends horizontally from an end of the first vertical surface.

6. The bonding system according to claim 1 , wherein:
the bonding device comprises an electromagnetic induction heat welding device and utilizes a coil configured to generate an induction current; and
the bonding substrates have an electrical conductivity and are configured to be heated via the induction current.

7. The bonding system according to claim 1 , wherein the bonding device includes a distal end portion, and wherein the bonding system further comprises:
a load sensor configured to detect a pressure applied by the distal end portion of the bonding device to the bonding substrates;
a distal end position control device configured to control a position of the distal end portion of the bonding device; and
a thermal camera configured to measure a surface temperature of the bonding substrates.

8. The bonding system according to claim 1 , wherein
the supporting jig is rotatable via the spring-loaded ball roller and the turning bearing.

9. The bonding system according to claim 1 , wherein the control unit further controls the temperature adjustment device, and the plurality of bonding supporting surfaces are configured to be heated prior to welding via the temperature adjustment device.

10. The bonding system according to claim 1 , wherein the bonding device does not use ultrasonic welding.

11. The bonding system according to claim 1 , wherein the bonding device uses electromagnetic induction heat welding.

12. A bonding method comprising:
welding bonding substrates, which include a thermoplastic resin material, using a bonding system, the bonding system comprising:
a supporting jig having a mounting surface including a plurality of bonding supporting surfaces on which the bonding substrates are mounted, wherein at least two of the bonding supporting surfaces have different normal directions angled relative to each other at 90 degrees or less;
a stand configured to support a portion of the supporting jig;
a turning bearing disposed between the stand and the supporting jig;
a spring-loaded ball roller disposed between the stand and the supporting jig, the spring-loaded ball roller spaced a distance from the turning bearing;
a bonding device that sandwiches and welds the bonding substrates between the bonding device and the mounting surface;
an articulated robot to which the bonding device is attached, the articulated robot configured to move the bonding device;
a temperature adjustment device that adjusts a temperature of the mounting surface; and
a control unit configured to control the articulated robot and the bonding device to move the bonding device to the plurality of bonding supporting surfaces and weld the bonding substrates thereon.

13. The bonding method according to claim 12 , wherein
the bonding system further comprises temperature sensors to detect a temperature of the supporting jig.

14. The bonding method according to claim 12 , wherein the bonding system further comprises an operating device that operates the supporting jig.

Assignees

• Toyota Customizing & Dev Co Ltd
• Honda Motor Co Ltd
• Aisin Seiki
• Toyota Motor Co Ltd
• Univ Nagoya Nat Univ Corp
• Toray Industries
• Teijin Ltd
• Komatsu Mfg Co Ltd
• Subaru Corp

Inventors

• Furuyashiki Kenji
• Yuchi Hiroshi
• Hirawaki Satoshi
• Yamamori Yoshinori
• Mori Takayuki
• Iwano Yoshihiro
• Amaoka Kazuaki

Classifications

• B29C66/863 Primary

  Robotised, e.g. mounted on a robot arm · CPC title

• B29C65/02

  by heating, with or without pressure · CPC title

• B29C65/08

  using ultrasonic vibrations {(non-plastics element to plastics elements B29C65/645)} · CPC title

• B29C65/32

  Induction · CPC title

• B29C65/7841

  Holding or clamping means for handling purposes (clamping means for the purpose of applying pressure on the parts to be joined, in the area to be joined B29C66/81; work holders in general B25B; devices for holding or positioning work for welding metal B23K37/04) · CPC title