Circuit board and manufacturing method thereof and electronic device

Patent metadata

Field	Value
Publication number	US-11785707-B2
Application number	US-202117496791-A
Country	US
Kind code	B2
Filing date	Oct 8, 2021
Priority date	Jan 21, 2021
Publication date	Oct 10, 2023
Grant date	Oct 10, 2023

Abstract

Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

First claim

What is claimed is:

1. A circuit board, comprising a first substrate, a second substrate, a third substrate, a fourth substrate, a plurality of conductive structures, and a conductive via structure, wherein,
the first substrate comprises a first core layer, a first external circuit layer, a first circuit layer, and a plurality of first conductive vias of the plurality of conductive structures, the first external circuit layer and the first circuit layer are respectively disposed on two opposite sides of the first core layer, and the plurality of first conductive vias penetrate the first core layer and are electrically connected to the first external circuit layer and the first circuit layer;
the second substrate is disposed between the first substrate and the third substrate;
the third substrate is disposed between the second substrate and the fourth substrate;
the third substrate has an opening and comprises a first dielectric layer, the opening penetrates the third substrate, and the first dielectric layer fills the opening;
the third substrate further comprises a second core layer, a second circuit layer, a third circuit layer, and a conductive connection layer, the second circuit layer and the third circuit layer are respectively disposed on two opposite sides of the second core layer, the second core layer has the opening, the conductive connection layer is disposed on an inner wall of the opening and is located between the first dielectric layer and the second core layer, and the conductive connection layer is electrically connected to the second circuit layer and the third circuit layer;
the fourth substrate comprises an insulation layer, a second external circuit layer, and a plurality of second conductive vias of the plurality of conductive structures, the insulation layer is located between the second external circuit layer and the third circuit layer of the third substrate, and the plurality of second conductive vias penetrate the insulation layer and are electrically connected to the third circuit layer and the second external circuit layer;
the conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path;
the conductive via structure comprises a through via and a conductive material layer, the through via penetrates the first core layer of the first substrate, the second substrate, the first dielectric layer of the third substrate, and the insulation layer of the fourth substrate, and the conductive material layer covers an inner wall of the through via and is electrically connected to the first external circuit layer and the second external circuit layer; and
the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the plurality of conductive structures to define a ground path, and the ground path surrounds the signal path.

2. The circuit board according to claim 1 , wherein the second substrate comprises a base and a plurality of conductive pillars penetrating the base, and the plurality of conductive pillars are electrically connected to the first circuit layer and the second circuit layer.

3. The circuit board according to claim 2 , wherein the first external circuit layer comprises a first signal circuit and a first ground circuit, the second external circuit layer comprises a second signal circuit and a second ground circuit, the first signal circuit, the conductive material layer, and the second signal circuit define the signal path, and the first ground circuit, the plurality of first conductive vias, the first circuit layer, the plurality of conductive pillars, the second circuit layer, the conductive connection layer, the third circuit layer, the plurality of second conductive vias, and the second ground circuit define the ground path.

4. The circuit board according to claim 1 , wherein a plurality of third conductive vias of the plurality of conductive structures penetrate the first core layer of the first substrate and the second substrate, and are electrically connected to the first external circuit layer and the second circuit layer.

5. The circuit board according to claim 4 , wherein the first external circuit layer comprises a first signal circuit and a first ground circuit, the second external circuit layer comprises a second signal circuit and a second ground circuit, the first signal circuit, the conductive material layer, and the second signal circuit define the signal path, and the first ground circuit, the plurality of third conductive vias, the second circuit layer, the conductive connection layer, the third circuit layer, the plurality of second conductive vias, and the second ground circuit define the ground path.

6. The circuit board according to claim 1 , wherein the conductive via structure further comprises a second dielectric layer filling the through via, and a first surface and a second surface of the second dielectric layer opposite to each other are respectively aligned with an upper surface of the first external circuit layer and a lower surface of the second external circuit layer.

7. The circuit board according to claim 1 , wherein the conductive via structure further comprises a second dielectric layer filling the through via, and the first external circuit layer and the second external circuit layer respectively cover a first surface and a second surface of the second dielectric layer opposite to each other.

8. An electronic device, comprising:
a circuit board, comprising a first substrate, a second substrate, a third substrate, a fourth substrate, a plurality of conductive structures, and a conductive via structure, wherein,
the first substrate comprises a first core layer, a first external circuit layer, a first circuit layer, and a plurality of first conductive vias of the plurality of conductive structures, the first external circuit layer and the first circuit layer are respectively disposed on two opposite sides of the first core layer, and the plurality of first conductive vias penetrate the first core layer and are electrically connected to the first external circuit layer and the first circuit layer;
the second substrate is disposed between the first substrate and the third substrate;
the third substrate is disposed between the second substrate and the fourth substrate;
the third substrate has an opening and comprises a first dielectric layer, the opening penetrating the third substrate, and the first dielectric layer filling the opening;
the third substrate further comprises a second core layer, a second circuit layer, a third circuit layer, and a conductive connection layer, the second circuit layer and the third circuit layer are respectively disposed on two opposite sides of the second core layer, the second core layer has the opening, the conductive connection layer is disposed on an inner wall of the opening and is located between the first dielectric layer and the second core layer, and the conductive connection layer is electrically connected to the second circuit layer and the third circuit layer;
the fourth substrate comprises an insulation layer, a second external circuit layer, and a plurality of second conductive vias of the plurality of conductive structures, the insulation layer is located between the second external circuit layer and the third circuit layer of the third substrate, and the plurality of second conductive vias penetrate the insulation layer and are electrically connected to the third circuit layer and the second external circuit layer;
the conductive via structure penetrates the first substrate, the second subs

Assignees

• Unimicron Technology Corp

Inventors

• Lu Chih-Chiang
• Nien Heng-Ming
• Chen Ching-Sheng
• Chang Ching
• Chang Ming-Ting
• Chang Chi-Min
• Lee Shao-Chien
• Huang jun-rui
• Cheng Shih-Lian

Classifications

• H05K1/0222 Primary

  for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence · CPC title

• H05K1/113

  Via provided in pad; Pad over filled via · CPC title

• H05K1/119

  Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence) · CPC title

• H05K3/429

  Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers · CPC title

• H05K3/462

  characterized by laminating only or mainly similar double-sided circuit boards · CPC title