Cable assemblies for headphone devices

US11778359B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11778359-B2
Application numberUS-202318149716-A
CountryUS
Kind codeB2
Filing dateJan 4, 2023
Priority dateJun 17, 2020
Publication dateOct 3, 2023
Grant dateOct 3, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Headphone playback devices can include a cable assembly including a plurality of conductors extending between a first earpiece and a second earpiece. The cable assembly includes a jacket, a power conductor disposed within the jacket and coupled between a power source in the first earpiece and a wireless transceiver in the second earpiece. The cable assembly further includes a microphone conductor at least partially disposed within the jacket and coupled to a microphone in one of the earpieces. A shield is at least partially disposed between the power conductor and the microphone conductor to reduce electromagnetic interference between the two.

First claim

Opening claim text (preview).

The invention claimed is: 1. A headphone device comprising: a first earpiece; a first audio transducer housed within the first earpiece; a second earpiece; a second audio transducer housed within the second earpiece; a plurality of electrical components including a wireless transceiver and a power source, a first subset of the plurality of electrical components being at least partially disposed in the first earpiece and a second subset of the plurality of electrical components being at least partially disposed in the second earpiece; and a cable assembly extending between the first earpiece and the second earpiece, the cable assembly comprising a plurality of conductors electrically connecting the first subset of the plurality of electrical components to the second subset of the plurality of electrical components, a jacket at least partially enclosing the plurality of conductors, and a first termination assembly disposed in the first earpiece, wherein the first termination assembly includes a flexible circuit board including a plurality of conductive traces, and a plurality of terminals coupled to the plurality of conductive traces. 2. The headphone device of claim 1 , wherein at least one of the plurality of conductors is soldered to at least one of the plurality of terminals. 3. The headphone device of claim 1 , wherein the cable assembly further comprises a second termination assembly disposed in the second earpiece. 4. The headphone device of claim 1 , wherein the wireless transceiver is configured to facilitate communication via at least one data network, wherein the at least one data network comprises at least one of: a wireless local area network (WLAN) or a personal area network (PAN). 5. The headphone device of claim 1 , wherein the wireless transceiver is configured to operate in a plurality of operation modes including a first operation mode and second operation mode, wherein the wireless transceiver facilitates communication via at least one WIFI network in the first operation mode, and wherein the wireless transceiver facilitates communication via at least one BLUETOOTH network in the second operation mode. 6. The headphone device of claim 1 , further comprising a housing including the first earpiece and the second earpiece, wherein the housing is an over-ear housing, an on-ear housing, or an in-ear housing. 7. The headphone device of claim 1 , further comprising a headband attached to the first earpiece and the second earpiece, and wherein the cable assembly further comprises: a first end portion coupled to the first subset of the plurality of electrical components; a second end portion coupled to the second subset of the plurality of electrical components; and an intermediate portion between the first end portion and the second end portion, wherein the intermediate portion is at least partially disposed in the headband. 8. The headphone device of claim 7 , wherein at least part of the intermediate portion is in a configuration that comprises a plurality of bends. 9. The headphone device of claim 1 , further comprising at least one analog microphone at least partially disposed in at least one of the first earpiece or the second earpiece. 10. The headphone device of claim 9 , wherein the first subset of the plurality of electrical components includes the wireless transceiver, and wherein the second subset of the plurality of electrical components includes the power source. 11. The headphone device of claim 10 , wherein the plurality of conductors comprises: one or more power conductors at least partially disposed within the jacket and coupled between the power source and the wireless transceiver; one or more microphone conductors at least partially disposed within the jacket and coupled to the at least one analog microphone; and a shield at least partially disposed between the one or more power conductors and the one or more microphone conductors. 12. The headphone device of claim 11 , wherein the shield comprises one or more conductors helically extending around at least one of the one or more power conductors or at least one of the one or more microphone conductors. 13. The headphone device of claim 11 , wherein the shield comprises a spiral shield. 14. A wearable device comprising: a housing configured to be worn about a head of a subject; a power source at least partially disposed in the housing and disposed on a first side of the subject when the wearable device is worn about the head; at least one analog sensor at least partially disposed in the housing; a wireless radio at least partially disposed in the housing; and a cable assembly at least partially disposed in the housing and comprising a plurality of conductors, a jacket at least partially enclosing the plurality of conductors, and a termination assembly at least partially disposed in the housing, wherein the termination assembly includes a flexible circuit board including a plurality of conductive traces, and a plurality of terminals coupled to the plurality of conductive traces and to one or more of the plurality of conductors. 15. The wearable device of claim 14 , wherein the at least one analog sensor comprises at least one analog microphone, wherein the wireless radio is disposed on a second, opposite side of the subject when the wearable device is worn about the head, and wherein the plurality of conductors includes: one or more power conductors coupled between the power source and the wireless radio; one or more sensor conductors coupled to the at least one analog sensor; and a shield at least partially separating the one or more power conductors from the one or more sensor conductors, wherein the shield comprises one or more conductors helically extending around at least one of the one or more power conductors. 16. The wearable device of claim 14 , wherein the housing comprises a frame front, a first temple rotatable coupled to the frame front, and a second temple rotatably coupled to the frame front. 17. The wearable device of claim 14 , wherein the housing comprises a first earpiece and a second earpiece. 18. A cable assembly for a headphone device including a first earpiece and a second earpiece, the cable assembly comprising: a jacket having an outer diameter between 4 millimeters (mm) and 6 mm; a plurality of conductors at least partially disposed within the jacket and configured to electrically couple one or more electrical components disposed at least partially within the first earpiece to one or more electrical components disposed at least partially within the second earpiece; an inner coaxial cable at least partially disposed within the jacket, wherein the inner coaxial cable comprises a first end configured to electrically couple to an antenna at least partially disposed in the second earpiece and a second end configured to electrically couple to a wireless transceiver at least partially disposed in the first earpiece; and a termination assembly disposed in the first earpiece, wherein the termination assembly includes a flexible circuit board including a plurality of conductive traces, and a plurality of terminals coupled to the plurality of conductive traces and to one or more of the plurality of conductors. 19. The cable assembly of claim 18 , wherein the plurality of conductors comprises: one or more power conductors at least partially disposed within the jacket, wherein the one or more power conductors comprises a first end configured to electrically couple to a battery at least partially disposed in t

Assignees

Inventors

Classifications

  • H04R1/1033Primary

    Cables or cables storage, e.g. cable reels (cord reels per se H02G11/02; arrangements for storing and repeatedly paying-out and re-storing lengths of conductors or cables B65H75/34; extensible conductors or cables, e.g. self-coiling cords H01B7/06) · CPC title

  • Reduction of losses in sheaths or armouring · CPC title

  • Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

  • Headphones for stereophonic communication {(details thereof, e.g. relating to batteries, cables or control elements H04R1/10)} · CPC title

  • composed of a helicoidally wound wire-conductor · CPC title

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What does patent US11778359B2 cover?
Headphone playback devices can include a cable assembly including a plurality of conductors extending between a first earpiece and a second earpiece. The cable assembly includes a jacket, a power conductor disposed within the jacket and coupled between a power source in the first earpiece and a wireless transceiver in the second earpiece. The cable assembly further includes a microphone conduct…
Who is the assignee on this patent?
Sonos Inc
What technology area does this patent fall under?
Primary CPC classification H04R1/1033. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 03 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).