Apparatus, system, and method for transferring radio frequency signals between waveguides and radiating elements in antennas

Patent metadata

Field	Value
Publication number	US-11777201-B2
Application number	US-202117408195-A
Country	US
Kind code	B2
Filing date	Aug 20, 2021
Priority date	Sep 3, 2020
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

A radio frequency coupling structure comprising (1) a substrate that forms a top side of a waveguide, (2) a first conductive layer disposed on a bottom side of the substrate, (3) a second conductive layer incorporated within the substrate, (4) a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate, and/or (5) a ring slot formed around the through via in the first conductive layer. Various other apparatuses, systems, and methods are also disclosed.

First claim

What is claimed is:

1. A radio frequency coupling structure comprising:
a substrate that forms a top side of a waveguide;
a first conductive layer disposed on a bottom side of the substrate;
a second conductive layer incorporated within the substrate;
a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate; and
a ring slot formed around the through via in the first conductive layer.

2. The radio frequency coupling structure of claim 1 , further comprising a plurality of cavity vias communicatively coupled between the first conductive layer and the second conductive layer.

3. The radio frequency coupling structure of claim 2 , wherein the cavity vias are arranged radially around the ring slot and the through via within the substrate.

4. The radio frequency coupling structure of claim 2 , wherein the top side of the substrate is coupled to a radiating element configured to radiate energy in accordance with radio frequency signals traversing the waveguide.

5. The radio frequency coupling structure of claim 1 , wherein the ring slot exposes the substrate to the waveguide.

6. The radio frequency coupling structure of claim 1 , wherein the ring slot comprises a whole annular slot that completely encompasses the through via in the first conductive layer.

7. The radio frequency coupling structure of claim 1 , wherein the ring slot:
encompasses a majority of the through via in the first conductive layer; and
includes a break in which conductive material from the first conductive layer remains.

8. The radio frequency coupling structure of claim 7 , further comprising an additional ring slot formed around the through via and the ring slot in the first conductive layer, wherein the additional ring slot exposes the substrate to the waveguide.

9. The radio frequency coupling structure of claim 8 , wherein the additional ring slot:
encompasses a majority of the through via in the first conductive layer;
encompasses a majority of the ring slot; and
includes an additional break in which conductive material from the first conductive layer remains.

10. The radio frequency coupling structure of claim 9 , wherein:
the ring slot is oriented such that the break faces a specific direction relative to the through via; and
the additional ring slot is oriented such that the additional break faces the specific direction relative to the through via.

11. The radio frequency coupling structure of claim 9 , wherein:
the ring slot is oriented such that the break faces a specific direction relative to the through via; and
the additional ring slot is oriented such that the additional break faces an additional direction relative to the through via, wherein the additional direction is substantially opposite the specific direction.

12. An antenna comprising:
a bottom Radio Frequency (RF) guide plate rotatably coupled to a base via a first shaft controlled by an azimuth motor;
a top array plate rotatably coupled to the base via a second shaft controlled by an elevation motor, the top array plate and the bottom RF guide plate collectively forming a waveguide configured to direct radio frequency signals in a specific direction; and
a plurality of radio frequency coupling structures disposed on a substrate of the top array plate, the plurality of radio frequency coupling structures comprising:
a first conductive layer disposed on a bottom side of the substrate;
a second conductive layer incorporated within the substrate;
a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate; and
a ring slot formed around the through via in the first conductive layer.

13. The antenna of claim 12 , wherein the plurality of radio frequency coupling structures comprise a plurality of cavity vias communicatively coupled between the first conductive layer and the second conductive layer.

14. The antenna of claim 13 , wherein the cavity vias are arranged radially around the ring slot and the through via within the substrate.

15. The antenna of claim 12 , wherein the top side of the substrate is coupled to a radiating element configured to radiate energy in accordance with radio frequency signals traversing the waveguide.

16. The antenna of claim 12 , wherein the ring slot exposes the substrate to the waveguide.

17. A method comprising:
fabricating, on a substrate that forms a top side of a waveguide, a through via that is communicatively coupled to a first conductive layer disposed on a bottom side of the substrate;
extending the through via from the first conductive layer through an opening in a second conductive layer incorporated within the substrate toward a top side of the substrate;
fabricating, in the first conductive layer, a ring slot that substantially surrounds the through via and exposes the substrate to the waveguide; and
fabricating a plurality of cavity vias that:
are communicatively coupled between the first conductive layer and the second conductive layer; and
are arranged radially around the ring slot and the through via within the substrate.

18. The method of claim 17 , further comprising coupling the top side of the substrate to a radiating element configured to radiate energy in accordance with radio frequency signals traversing the waveguide.

19. The method of claim 17 , wherein fabricating the ring slot comprises fabricating a whole annular slot that completely encompasses the through via in the first conductive layer.

20. The method of claim 17 , wherein fabricating the ring slot comprises fabricating the ring slot to:
encompass a majority of the through via in the first conductive layer; and
include a break in which conductive material from the first conductive layer remains.

Assignees

• Meta Platforms Inc

Inventors

• Tang Qi
• Saraswat Srishti
• Tabatabai Farbod

Classifications

• H01Q1/38 Primary

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q13/10

  Resonant slot antennas · CPC title

• H01Q21/0006

  Particular feeding systems · CPC title

• H01Q23/00

  Antennas with active circuits or circuit elements integrated within them or attached to them · CPC title

• H01P5/028 Primary

  between strip lines · CPC title