Array substrate, manufacturing method thereof and display apparatus

Patent metadata

Field	Value
Publication number	US-11776971-B2
Application number	US-202017059231-A
Country	US
Kind code	B2
Filing date	Mar 26, 2020
Priority date	Mar 27, 2019
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

The present disclosure provides an array substrate, a method for manufacturing the array substrate, and a display apparatus. The array substrate includes a plurality of substrates spaced apart from each other; a plurality of display units which are provided on the plurality of substrates, respectively; a plurality of connection lines each of which is configured to connect two adjacent display units; a plurality of stretchable connection bridges each of which is configured to connect two adjacent substrates of the plurality of substrates; and a length of the connection line is greater than a length of the stretchable connection bridge.

First claim

What is claimed is:

1. An array substrate, comprising:
a plurality of substrates spaced apart from each other;
a plurality of display units provided on the plurality of substrates, respectively;
a plurality of connection lines, each of which is configured to connect two adjacent display units of the plurality of display units; and
a plurality of stretchable connection bridges, each of which is configured to connect two adjacent substrates of the plurality of substrates, wherein a length of each connection line is greater than a length of each stretchable connection bridge,
wherein a cross-sectional area of the connection line gradually increases as the connection line approaches the display unit, and a cross-sectional area of the stretchable connection bridge gradually increases as the stretchable connection bridge approaches the substrate.

2. The array substrate of claim 1 , further comprising hollow-out regions which are between the plurality of display units by the connection lines and the stretchable connection bridges.

3. The array substrate of claim 2 , wherein two adjacent substrates of the plurality of substrates are connected by at least one of the plurality of stretchable connection bridges.

4. The array substrate of claim 3 , wherein the stretchable connection bridge has a length greater than or equal to a distance between two adjacent substrates.

5. The array substrate of claim 4 , wherein straight lines formed by connecting connection points of the stretchable connection bridge between the two corresponding adjacent substrates on the two adjacent substrates are parallel to straight lines formed by connecting connection points of the connection line between the two display units on the two adjacent substrates on the two display units.

6. The array substrate of claim 1 , wherein a Young's modulus of each of the plurality of substrates is greater than a Young's modulus of the stretchable connection bridge.

7. The array substrate of claim 6 , wherein the connection line comprises a first straight line portion, a first arc portion, a second straight line portion, a second arc portion, and a third straight line portion that are sequentially connected.

8. The array substrate of claim 7 , wherein the connection line comprises a conductive material.

9. The array substrate of claim 8 , wherein the conductive material comprises at least one of molybdenum, silver, copper, aluminum, magnesium, neodymium, indium tin oxide, indium gallium zinc oxide, indium zinc oxide.

10. The array substrate of claim 9 , wherein a material of the stretchable connection bridge comprises any one of polydimethylsiloxane, polyethylene naphthalate, polyimide, polyetherimide, polyethylene terephthalate, and polyphenylene sulfide.

11. The array substrate of claim 10 , further comprising each of an optically clear adhesive, an acryl-based adhesive, a silicon-based adhesive, a polyurethane-based adhesive configured to adhere each of the plurality of substrates to the display unit provided on the substrate.

12. The array substrate of claim 11 , wherein each of the plurality of substrates has a shape of any of a square, an oval, a circle, a rectangle, a parallelogram, and a hexagon.

13. The array substrate of claim 12 , further comprising a film package layer on a side of the plurality of display units distal to the plurality of substrates.

14. A display apparatus, comprising the array substrate of claim 1 and an integrated circuit connected to the array substrate.

15. A method for manufacturing an array substrate, comprising:
forming a plurality of substrates spaced apart from each other and a plurality of stretchable connection bridges each of which is configured to connect two adjacent substrates of the plurality of substrates;
forming a plurality of display units spaced apart from each other and a plurality of connection lines each of which is configured to connect two adjacent display units of the plurality of display units, wherein a length of the connection line is greater than a length of the stretchable connection bridge; and
aligning and assembling the plurality of substrates spaced apart from each other and the plurality of display units spaced apart from each other in a one-to-one correspondence manner by a transferring process,
wherein a cross-sectional area of the connection line gradually increases as the connection line approaches the display unit, and a cross-sectional area of the stretchable connection bridge gradually increases as the stretchable connection bridge approaches the substrate.

16. The method of claim 15 , wherein the forming a plurality of substrates spaced apart from each other and a plurality of stretchable connection bridges each of which is configured to connect two adjacent substrates of the plurality of substrates comprises performing an etching process or a laser cutting process on a flexible film to form the plurality of substrates arranged in an array and the plurality of stretchable connection bridges each of which is configured to connect two adjacent substrates of the plurality of substrates.

17. The method of claim 16 , wherein the forming a plurality of substrates spaced apart from each other and a plurality of stretchable connection bridges each of which is configured to connect two adjacent substrates of the plurality of substrates further comprises performing a heating process or a laser process on the plurality of substrates.

18. The method of claim 15 , wherein the forming a plurality of display units and a plurality of connection lines each of which is configured to connect two adjacent display units of the plurality of display units comprises:
forming the plurality of display units spaced apart from each other and the plurality of connection lines each of which is configured to connect two adjacent display units of the plurality of display units on a substrate such that the substrate with the plurality of display units and the plurality of connection lines comprises a display unit region and a non-display unit region; and
cutting off a part of the non-display unit region other than the plurality of connecting lines by an etching process or a laser cutting process.

19. The method according to claim 15 , wherein the aligning and assembling the plurality of substrates spaced apart from each other and the plurality of display units spaced apart from each other in a one-to-one correspondence manner by a transferring process comprises adhering the plurality of substrates to the plurality of display units in a one-to-one correspondence manner.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Sui Kai
• Xue Jinxiang
• Sun Zhongyuan
• Dong Chao
• Wang Xiaofen
• Jin Qian

Classifications

• H10D86/60

  wherein the TFTs are in active matrices · CPC title

• H10D86/441 Primary

  Interconnections, e.g. scanning lines · CPC title

• H10D86/0212

  comprising manufacture, treatment or coating of substrates · CPC title

• H10D86/443

  adapted for preventing breakage, peeling or short circuiting · CPC title

• H10D86/411

  characterised by materials, geometry or structure of the substrates · CPC title