Electronic module

Patent metadata

Field	Value
Publication number	US-11776937-B2
Application number	US-201817253076-A
Country	US
Kind code	B2
Filing date	Jul 4, 2018
Priority date	Jul 4, 2018
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

An electronic module has a first substrate 11; a first electronic element 13 provided on one side of the first substrate 11; a first connection body 60 provided on the one side of the first electronic element 13; a second electronic element 23 provided on the one side of the first connection body 60; and a second connection body 70 provided on the one side of the second electronic element 23. The first electronic element 13 and the second electronic element 23 do not overlap in a plane direction.

First claim

The invention claimed is:

1. An electronic module comprising:
a first substrate which is a ceramic substrate, an insulating resin layer or a metal substrate;
a first electronic element provided on upper side of the first substrate;
a first connection body provided on upper side of the first electronic element;
a second electronic element provided on upper side of the first connection body; and
a second connection body provided on upper side of the second electronic element, wherein
the first electronic element and the second electronic element do not overlap in a plane direction,
the first connection body has a first head part including a first head area on lower side of the first connection body where the first electronic element is provided, a second head area on upper side of the first connection body where the second electronic element is provided, and a bent part provided between the first head area and the second head area in the plane direction, and
the first connection body has a plurality of first support parts extending from the first head part and abutting on the first substrate, or the second connection body has a second head part and a plurality of second support parts extending from the second head part and abutting on the first substrate,
the first connection body has a plurality of first pillar parts extending from the first head part to lower side,
the second connection body has a second head part and a second pillar part extending from the second head part to lower side, and
the second electronic element is sandwiched between one of the first pillar parts and the second pillar part, wherein the second electronic element, the one of the first pillar parts and the second pillar part overlap in the plane direction, and
at least another one of the first pillar parts and the second pillar part do not overlap in the plane direction.

2. The electronic module according to claim 1 further comprising:
a sealing part sealing the first electronic element, the first connection body, the second electronic element and the second connection body; and
a second substrate provided on the upper side of the second connection body, wherein
only the first connection body and the sealing part, or only the first connection body, the sealing part and a second conductor layer provided on lower side of the second substrate are provided between the second substrate and the first electronic element in a thickness direction.

3. The electronic module according to claim 1 further comprising a second substrate provided on the upper side of the second connection body, wherein
a spacer is provided between the second substrate and the first connection body.

4. The electronic module according to claim 1 , wherein
the first connection body has a first head part and a plurality of first support parts extending from the first head part,
the second connection body has a second head part and a plurality of second support parts extending from the second head part, and
an angle between a direction in which the first support part extends from the first head part in the plane direction and a direction in which the second support part extends from the second head part in the plane direction is within a range from 0 degrees to ±45 degrees.

5. An electronic module comprising:
a first substrate which is a ceramic substrate, an insulating resin layer or a metal substrate;
a first electronic element provided on upper side of the first substrate;
a first connection body provided on upper side of the first electronic element;
a second electronic element provided on upper side of the first connection body; and
a second connection body provided on upper side of the second electronic element, wherein
the first electronic element and the second electronic element do not overlap in a plane direction,
the first connection body has a first head part including a first head area on lower side of the first connection body where the first electronic element is provided, a second head area on upper side of the first connection body where the second electronic element is provided, and a bent part provided between the first head area and the second head area in the plane direction, and
(1) the first connection body has a plurality of first support parts extending from the first head part and abutting on the first substrate, at least one of the first support parts functions electrically and at least one of the first support parts does not function electrically, or (2) the second connection body has a second head part and a plurality of second support parts extending from the second head part and abutting on the first substrate,
at least one of the second support parts functions electrically- and at least one of the second support parts does not function electrically.

6. An electronic module comprising:
a first substrate which is a ceramic substrate, an insulating resin layer or a metal substrate;
a first electronic element provided on upper side of the first substrate;
a first connection body provided on upper side of the first electronic element;
a second electronic element provided on upper ene side of the first connection body; and
a second connection body provided on upper side of the second electronic element, wherein
the first electronic element and the second electronic element do not overlap in a plane direction,
the first connection body has a first head part including a first head area on lower side of the first connection body where which the first electronic element is provided, a second head area on upper side of the first connection body where the second electronic element is provided, and a bent part provided between the first head area and the second head area in the plane direction,
the first connection body has a plurality of first pillar parts extending from the first head part to lower side, and a plurality of first support parts extending from the first head part,
the second connection body has a second head part, a second pillar part extending from the second head part to lower side, and a plurality of second support parts extending from the second head part to lower side,
the second electronic element, one of the first pillar parts and the second pillar part overlap in the plane direction, and at least another one of the first pillar parts and the second pillar part do not overlap in the plane direction,
at least one of the first support parts functions electrically, and at least one of the first support parts does not function electrically, and
at least one of the second support parts functions electrically, and at least one of the second support parts does not function electrically.

Assignees

• Shindengen Electric Mfg

Inventors

• Ikeda Kosuke

Classifications

• H10W72/886

  Die-attach connectors and strap connectors · CPC title

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W72/07652

  changes in structures or sizes · CPC title

• H10W72/627

  Multiple strap connectors having different structures or shapes · CPC title