Heat transferring device and method for making thereof

Patent metadata

Field	Value
Publication number	US-11774183-B2
Application number	US-202117463567-A
Country	US
Kind code	B2
Filing date	Sep 1, 2021
Priority date	Sep 1, 2020
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

The present invention provides a heat transferring device and a method for making thereof. The heat transferring device has a thermal conducting substrate and a porous layer. The thermal conducting substrate has a plurality of protrusions and concave bottom surfaces. The concave bottom surfaces are located between the protrusions. The porous layer is embedded between the protrusions. The present invention also provides a high temperature material transferring system comprising a cylindrical container and the heat transferring device disposed on the surface of the cylindrical container.

First claim

What is claimed is:

1. A heat transferring device, including:
a thermal conducting substrate having a plurality of protrusions and concave bottom surfaces, wherein the concave bottom surfaces are located between the protrusions, and the thermal conducting substrate comprises one or more of iron, nickel, cobalt, zirconium, titanium, tungsten, rhenium, molybdenum, niobium, metal-ceramics, silicon nitride, carbon nitride, tantalum carbide, or hafnium carbide; and
a super-hydrophilic porous layer embedded between the protrusions, wherein the super-hydrophilic porous layer has a plurality of thermally insulating nanofibers interwoven together to form a fibrous structure, having pores configured to receive water droplets at low contact angles, wherein the thermally insulating nanofibers have a thermal conductivity that is N times smaller than a thermal conductivity of a material of the protrusions, and N is a number within a range from approximately 100 to 1,000;
wherein the concave bottom surfaces of the thermal conducting substrate form a plurality of first grooves and second grooves, the first grooves intersect the second grooves, wherein the first and second grooves have U-shape profiles with the super-hydrophilic porous layer suspended above the concave bottom surfaces, creating gap spaces between a lower surface of the super-hydrophilic porous layer and the concave bottom surfaces, so as to create tunnels beneath the super-hydrophilic porous layer for vapor exhausting from received water droplets such that the heat transferring device suppresses a Leidenfrost effect, and wherein the protrusions extend higher than an upper surface of the super-hydrophilic porous layer with respect to the concave bottom surfaces.

2. The heat transferring device of claim 1 , wherein the protrusions form an array.

3. The heat transferring device of claim 1 , wherein circumference of each of the protrusions increases in a direction towards its bottom.

4. The heat transferring device of claim 1 , wherein a material of the porous layer is inorganic.

5. The heat transferring device of claim 1 , wherein the porous layer is fabricated via electrospinning technique.

6. A method of forming a heat transferring device, comprising:
providing a thermal conducting substrate comprising one or more of iron, nickel, cobalt, zirconium, titanium, tungsten, rhenium, molybdenum, niobium, metal-ceramics, silicon nitride, carbon nitride, tantalum carbide, or hafnium carbide;
forming a plurality of protrusions and concave bottom surfaces at the thermal conducting substrate, wherein the concave bottom surfaces are located between the protrusions and form a plurality of first grooves and second grooves, and the first grooves intersecting the second grooves; and
embedding a super-hydrophilic porous layer between the protrusions such that the super-hydrophilic porous layer is suspended above U-shape profiles of the first and second grooves of the concave bottom surfaces, so as to create gap spaces between a lower surface of the super-hydrophilic porous layer and the concave bottom surfaces that create tunnels beneath the super-hydrophilic porous layer for vapor exhausting from received water droplets such that the heat transferring device suppresses a Leidenfrost effect, and such that top ends of the protrusions are higher than an upper surface of the super-hydrophilic porous layer with respect to the concave bottom surfaces, wherein the super-hydrophilic porous layer has a plurality of thermally insulating nanofibers interwoven together to form a fibrous structure, having pores configured to receive water droplets at low contact angles, the thermally insulating nanofibers has a thermal conductivity that is N times smaller than a thermal conductivity of a material of the protrusions, N is a number within a range from approximately 100 to 1,000.

7. The method of claim 6 , wherein the step of forming the protrusions comprises:
wire-cutting the thermal conducting substrate with a Molybdenum wire or micro-milling the thermal conducting substrate.

8. The method of claim 6 , wherein the porous layer is fabricated via electrospinning technique.

9. The method of claim 6 further comprising:
sintering the protrusions and the porous layer.

10. A high temperature material transferring system, comprising:
a cylindrical container configured to transfer air flow; and
the heat transferring device of claim 1 , wherein the heat transferring device is located within the cylindrical container and connected to an interior surface of the cylindrical container.

11. The high temperature material transferring system of claim 10 further comprising a plurality of blades disposed in the cylindrical container.

12. A heat transferring device, comprising:
a thermally conducting substrate having a plurality of protrusions and concave bottom surfaces, wherein the concave bottom surfaces are located between the protrusions, the thermally conducting substrate comprising one or more of iron, nickel, cobalt, zirconium, titanium, tungsten, rhenium, molybdenum, niobium, metal-ceramics, silicon nitride, carbon nitride, tantalum carbide, or hafnium carbide; and
a super-hydrophilic porous layer positioned between the protrusions, the super-hydrophilic porous layer having a plurality of thermally insulating nanofibers interwoven together to form a fibrous structure, having pores configured to receive water droplets at low contact angles, the thermally insulating nanofibers having a thermal conductivity that is N times smaller than a thermal conductivity of a material of the protrusions, N being a number within a range from approximately 100 to 1,000;
wherein the concave bottom surfaces of the thermally-conducting substrate form a plurality of first grooves and second grooves, the first grooves intersecting the second grooves, the first and second grooves having U-shape profiles with the super-hydrophilic porous layer positioned above the concave bottom surfaces to create gap spaces between a lower surface of the porous layer and the concave bottom surfaces that create tunnels beneath the porous layer for vapor exhausting from received water droplets such that the heat transferring device suppresses a Leidenfrost effect; and
wherein a height of the plurality of protrusions extends beyond a height of the super-hydrophilic porous layer.

13. The heat transferring device of claim 12 , wherein the nanofibers of the super-hydrophilic porous layer include one or more of carbon, aramid, glass, basalt, polybenzimidazole, ultra-high-molecular-weight-polyethylene, silicon dioxide, titanium dioxide, mullite, aluminum oxide, zirconium dioxide, yttrium oxide, or asbestos.

14. The heat transferring device of claim 12 , wherein the protrusions form a thermal bridge to direct thermal flow away from the thermally-conducting substrate to reduce thermal transfer to the received water droplets in the super-hydrophilic porous layer.

Assignees

• Univ City Hong Kong

Inventors

• Wang Zuankai
• Jiang Mengnan
• Wang Yang

Classifications

• F28D17/02 Primary

  using rigid bodies, e.g. of porous material · CPC title

• H05K7/2029 Primary

  using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• F28F13/187 Primary

  especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• F28D2021/0021

  for aircrafts or cosmonautics · CPC title