Systems and methods for coupling a metal core PCB to a heat sink

Patent metadata

Field	Value
Publication number	US-11774082-B2
Application number	US-202217734105-A
Country	US
Kind code	B2
Filing date	May 1, 2022
Priority date	May 3, 2017
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

First claim

We claim:

1. A heat sink, comprising:
a rib extending along a central longitudinal axis of the heat sink;
a plurality of fins extending from first and second side of the rib, each of the plurality of fins having a first section proximate to the rib and an overhang section distal from the rib, the first section having a first height, and the overhang section having a second height longer than the first height; and
a base coupled to the rib, the base being positioned between the overhang section of the plurality of fins on the first side of the rib and the overhang section of the plurality of fins on the second side of the rib, the base having a plurality of orifices configured to let heat flow through the base into the plurality of fins.

2. The heat sink of claim 1 , wherein the plurality of orifices are located on either side of the central longitudinal axis of the heat sink.

3. The heat sink of claim 1 , wherein the plurality of orifices are distributed symmetrically around the central longitudinal axis of the heat sink.

4. The heat sink of claim 1 , wherein the plurality of orifices are distributed asymmetrically around the central longitudinal axis of the heat sink.

5. The heat sink of claim 1 , wherein the base is planar.

6. The heat sink of claim 1 , wherein the base comprises a metal core printed circuit board.

7. The heat sink of claim 1 , wherein a lower surface of the plurality of fins is adjacent to an upper surface of the base.

8. The heat sink of claim 1 , wherein the rib and the plurality of fins are formed from a unitary block of metal.

9. A light fixture, comprising:
the heat sink of claim 1 ; and
a plurality of light sources on the base of the heat sink.

Assignees

• Fluence Bioengineering Inc

Inventors

• Duong Dung
• Johnson Randall
• Klase Nicholas

Classifications

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• F21V29/502 Primary

  characterised by the adaptation for cooling of specific components · CPC title

• A01G9/20

  Forcing-frames; Lights {, i.e. glass panels covering the forcing-frames} · CPC title

• A01G9/249

  Lighting means (with special arrangements for promoting growth A01G7/045) · CPC title

• F21V23/009

  the casing being inside the housing of the lighting device · CPC title