Auxiliary power unit power compressor health state diagnostic system and method
US-2020263560-A1 · Aug 20, 2020 · US
US11773744B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11773744-B2 |
| Application number | US-202117471298-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2021 |
| Priority date | Jan 29, 2021 |
| Publication date | Oct 3, 2023 |
| Grant date | Oct 3, 2023 |
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A system and a method include an engine having one or more vanes. An actuator is coupled to the one or more vanes. The actuator is configured to move the one or more vanes between different positions. A control unit is coupled to the actuator. The control unit is configured to operate the actuator to move the one or more vanes between the different positions. The control unit is disposed on or within the engine.
Opening claim text (preview).
What is claimed is: 1. A system comprising: an engine having one or more vanes; an actuator coupled to the one or more vanes, wherein the actuator is configured to move the one or more vanes between different positions; and a control unit coupled to the actuator, wherein the control unit comprises a ceramic insulator directly mounted on the actuator, and wherein the control unit is configured to operate the actuator to move the one or more vanes between the different positions, wherein the control unit is mounted on the actuator on or within the engine. 2. The system of claim 1 , wherein the control unit is secured to a housing of the engine. 3. The system of claim 1 , wherein the control unit comprises at least one silicon-on-insulator (SoI) system-on-chip (SoC). 4. The system of claim 3 , wherein the at least one SoI SoC comprises: a first SoI SoC; and a second SoI SoC. 5. The system of claim 4 , wherein the first SoI SoC is a digital fully depleted SoI, and the second SoI SoC is a mixed signal partially depleted SoI SoC. 6. The system of claim 4 , wherein the first SoI SoC comprises: a microcontroller and an associated memory; a clock generator; a bus protocol interface circuit; and a bus transceiver. 7. The system of claim 6 , wherein the second SoI SoC comprises: an analog-to-digital converter; a low voltage linear variable differential transducer (LVDT) excitation and demodulation unit; a solenoid driver; a multiplex switch; and a DC-DC power supply circuit. 8. The system of claim 1 , further comprising a heat sink coupled to the control unit. 9. The system of claim 8 , wherein the heat sink is a ceramic heat sink. 10. The system of claim 1 , wherein the control unit further comprises one or more processors. 11. A method for controlling one or more vanes of an engine, the method comprising: coupling an actuator to the one or more vanes, wherein the actuator is configured to move the one or more vanes between different positions; and coupling a control unit to the actuator, wherein the control unit comprises a ceramic insulator directly mounted on the actuator, and wherein the control unit is configured to operate the actuator to move the one or more vanes between the different positions, wherein the control unit is on the actuator on or within the engine. 12. The method of claim 11 , wherein the control unit is secured to a housing of the engine. 13. The method of claim 11 , wherein the control unit comprises at least one silicon-on-insulator (SoI) system-on-chip (SoC). 14. The method of claim 13 , wherein the at least one SoI SoC comprises: a digital fully depleted SoI SoC; and a mixed signal partially depleted SoI SoC. 15. The method of claim 14 , wherein the digital fully depleted SoI SoC comprises: a microcontroller and an associated memory; a clock generator; a bus protocol interface circuit; and a bus transceiver. 16. The method of claim 15 , wherein the mixed signal partially depleted SoI SoC comprises: an analog-to-digital converter; a low voltage linear variable differential transducer (LVDT) excitation and demodulation unit; a solenoid driver; a multiplex switch; and a DC-DC power supply circuit. 17. The method of claim 11 , further comprising a heat sink coupled to the control unit. 18. The method of claim 17 , wherein the heat sink is a ceramic heat sink. 19. The method of claim 11 , wherein the control unit further comprises one or more processors. 20. An aircraft comprising: an engine having one or more vanes; an actuator coupled to the one or more vanes, wherein the actuator is configured to move the one or more vanes between different positions; a control unit coupled to the actuator, wherein the control unit comprises a ceramic insulator directly mounted on the actuator, and wherein the control unit is configured to operate the actuator to move the one or more vanes between the different positions; a heat sink coupled to the control unit, wherein the control unit is mounted on the actuator on or within the engine, and wherein the control unit comprises a digital fully depleted silicon-on-insulator (SoI) system-on-chip (SoC), and a mixed signal partially depleted SoI Soc.
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