Method for adhesively bonding rubber-based thermoplastic substrates

Patent metadata

Field	Value
Publication number	US-11773294-B2
Application number	US-202017422487-A
Country	US
Kind code	B2
Filing date	Mar 19, 2020
Priority date	Mar 20, 2019
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

A method for adhesively bonding two substrates by means of a moisture-curable adhesive composition, wherein at least one of the substrates includes at least 40 wt.-% of a mixture, said mixture consisting of: between 15 and 99 wt.-% of at least one thermoplastic polymer; between 1 and 85 wt.-% of at least one elastomer; and wherein the moisture-curable adhesive composition includes: at least one polymer containing silane groups; between 10 and 40 wt.-% of at least one polymeric plasticizer; between 0.1 and 5 wt.-% of at least one amino-functional alkoxysilane; between 0 and 5 wt.-% of at least one C1-C12-alkyl-functional alkoxysilane. The method yields adhesively bonded substrates without the requirements of using migrating plasticizers and pre-treating of the substrates.

First claim

The invention claimed is:

1. A method for adhesively bonding two substrates S, comprising the steps:
a) applying a moisture-curable adhesive composition A onto at least one of the two substrates S;
b) joining the two substrates S together such that the applied moisture-curable adhesive composition A forms an interlayer between the two substrates S such that the substrates S are directly connected by the interlayer; and
c) curing the moisture-curable adhesive composition A by means of moisture; wherein
at least one of the substrates S is a substrate S1, the substrate S1 comprising:
at least 40 wt.-%, based on the total weight of substrate S1, of a mixture E, said mixture E consisting of:
between 15 and 99 wt.-% of at least one thermoplastic polymer E1,
between 1 and 85 wt.-% of at least one elastomer E2, the proportions being based on the total weight of mixture E;

and wherein
the moisture-curable adhesive composition A comprises:
at least one polymer P containing silane groups,
between 10 and 40 wt.-%, based on the total composition, of at least one polymeric plasticizer PL,
between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric amino-functional alkoxysilane AS1,
between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric C3-C20-alkyl-functional alkoxysilane AS2.

2. The method according to claim 1 , wherein the at least one elastomer E2 is selected from the group consisting of butyl rubber and halogenated butyl rubber and/or the at least one thermoplastic polymer E1 is at least one thermoplastic polyolefin elastomer (TPE-O).

3. The method according to claim 1 , wherein the thermoplastic polymer E1 and the elastomer E2 elastomer form a co-continuous phase.

4. The method according to claim 1 , wherein the substrate S1 is a membrane or sheet having a thickness of at least 0.1 mm.

5. The method according to claim 1 , wherein the substrate S1 is not pre-treated by a chemically reactive primer, flame, oxofluorination, plasma, or corona pre-treatment prior to step a).

6. The method according to claim 1 , wherein the polymer P containing silane groups is an organic polymer containing silane groups.

7. The method according to claim 1 , wherein the polymeric plasticizer PL is a polyether, having end groups independently selected from hydrocarbon, alkoxy, hydroxyl, or amino groups.

8. The method according to claim 1 , wherein the moisture-curable adhesive composition A does not contain any further plasticizers other than the polymeric plasticizer PL.

9. The method according to claim 1 , wherein the moisture-curable adhesive composition A comprises the polymer P with an amount of between 10 and 30 wt.-%, based on the total composition A.

10. The method according to claim 1 , wherein the moisture-curable adhesive composition A comprises the C3-C20-alkyl-functional alkoxysilane AS2 with an amount of at least 0.5 wt.-%, based on the total composition A and/or the C3-C20-alkyl-functional alkoxysilane AS2 is a monomeric or oligomeric C6-C8-alkyl-functional alkoxysilane.

11. The method according to claim 1 , wherein the moisture-curable adhesive composition A is a two-component composition consisting of two components A1 and A2, wherein the first component A1 comprises the polymer P and the second component A2 comprises water.

12. The method according to claim 1 , wherein the second one of the substrates S is a substrate S2, the substrate S2 being selected from the list consisting of: glass, glass ceramic, concrete, mortar, brick, tile, gypsum, natural stone, metals and alloys, textiles, wood, wood-resin composites, resin-textile composites, resin-glass- or carbon-fiber composites, polyvinyl chloride (PVC), acrylonitrile-butadiene-styrene copolymers (ABS), polycarbonate (PC), polyamide (PA), polyesters, poly(methyl methacrylate) (PMMA), epoxy resins, paints, varnishes, coated substrates, and bitumen.

13. Use of Two substrates S adhesively bonded by curing a moisture-curable adhesive composition A comprising:
at least one polymer P containing silane groups,
between 10 and 40 wt.-%, based on the total composition, of at least one polymeric plasticizer PL,
between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric amino-functional alkoxysilane AS1,
between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric C3-C20-alkyl-functional alkoxysilane AS2,
wherein at least one of the substrates S is a substrate S1, the substrate S1 comprising:
at least 40 wt.-%, based on the total weight of substrate S1, of a mixture E, said mixture E consisting of:
between 15 and 99 wt.-% of at least one thermoplastic polymer E1,
between 1 and 85 wt.-% of at least one elastomer E2, the proportions being based on the total weight of mixture E.

14. A kit-of-parts comprising:
i) a moisture-curable adhesive composition A comprising:
at least one polymer P containing silane groups,
between 10 and 40 wt.-%, based on the total composition, of at least one polymeric plasticizer PL,
between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric amino-functional alkoxysilane AS1;
between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric C3-C20-alkyl-functional alkoxysilane AS2; and

ii) at least two substrates S, wherein at least one of the substrates S is a substrate S1, said substrate S1 comprising:
at least 40 wt.-%, based on the total weight of substrate S1, of a mixture E, said mixture E consisting of:
between 15 and 99 wt.-% of at least one thermoplastic polymer E1,
between 1 and 85 wt.-% of at least one elastomer E2;

said proportions being based on the total weight of mixture E.

15. Adhesively bonded substrates S, obtained by the method according to claim 1 .

Assignees

• Sika Tech Ag

Inventors

• Oertli Marcel
• Roskamp Robert
• Wallimann Helena
• Fäh Christoph
• Choffat Fabien

Classifications

• C09J5/00 Primary

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B25/042

  of natural rubber or synthetic rubber · CPC title

• B32B37/12

  characterised by using adhesives · CPC title

• C08J5/124

  using adhesives based on a macromolecular component · CPC title