Cationically curable composition and cured product production method

Patent metadata

Field	Value
Publication number	US-11773208-B2
Application number	US-201917055350-A
Country	US
Kind code	B2
Filing date	Jun 7, 2019
Priority date	Jun 13, 2018
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

A cationic curable composition that generates a silanol group by light irradiation and is cured by heat, the cationic curable composition including: a cationic curable component; porous particles holding an aluminum chelate; and a photodegradable silicon compound that generates a silanol group by photodegradation.

First claim

The invention claimed is:

1. A cationic curable composition that generates a silanol group by light irradiation and is cured by heat, the cationic curable composition comprising:
a cationic curable component;
porous particles holding an aluminum chelate; and
a photodegradable silicon compound that generates a silanol group by photodegradation,
wherein the photodegradable silicon compound has at least one selected from the group consisting of a peroxysilyl group, and an o-nitrobenzyloxy group bonded directly to a silicon atom, and
wherein the photodegradable silicon compound having the o-nitrobenzyloxy group bonded directly to the silicon atom includes a silicon compound represented by following General Formula (II),

wherein in the General Formula (II), R 1 , R 2 , and R 3 represent an unsubstituted aryl group, R 4 represents a hydrogen atom, an unsubstituted or substituted alkyl group having from 1 to 10 carbon atoms, or an unsubstituted or substituted phenyl group, R 5 , R 6 , R 7 , and R 8 , which may be identical or different, each represent a hydrogen atom, a nitro group, a cyano group, a hydroxy group, a mercapto group, a halogen atom, an acetyl group, an allyl group, an unsubstituted or substituted alkyl group having from 1 to 5 carbon atoms, an unsubstituted or substituted alkoxy group having from 1 to 5 carbon atoms, an unsubstituted or substituted aryl group, or an unsubstituted or substituted aryloxy group, and p, q, and r represent integers that satisfy conditions: 0≤p≤3, 0≤g≤3, 0≤r≤3, and 1≤p+q+r≤3.

2. The cationic curable composition according to claim 1 , wherein the porous particles comprise a polyurea resin.

3. The cationic curable composition according to claim 2 , wherein the porous particles further comprise a vinyl resin as a constituting component thereof.

4. The cationic curable composition according to claim 1 , wherein the cationic curable component comprises an epoxy resin.

5. The cationic curable composition according to claim 4 , wherein the epoxy resin comprises at least one selected from the group consisting of an alicyclic epoxy resin and a glycidyl ether epoxy resin.

6. The cationic curable composition according to claim 4 , wherein the cationic curable component further comprises an oxetane compound.

7. The cationic curable composition according to claim 1 , wherein a quantity of heat (H 0 ) generated in differential scanning calorimetry after light irradiation for 1 minute with a mercury xenon lamp at 50 mW/cm 2 and a quantity of heat (H 48 ) generated in the differential scanning calorimetry after 48 hours pass from the light irradiation satisfy formula (1) below:
−30≤[( H 0 −H 48 )/ H 0 ]×100≤30  Formula (1).

8. The cationic curable composition according to claim 1 , wherein a heat-generation onset temperature in differential scanning calorimetry after light irradiation for 1 minute with a mercury xenon lamp at 50 mW/cm 2 is 45° C. or higher but 80° C. or lower.

9. The cationic curable composition according to claim 1 , wherein an exothermic peak temperature in differential scanning calorimetry after light irradiation for 1 minute with a mercury xenon lamp at 50 mW/cm 2 is 60° C. or higher but 130° C. or lower.

10. A method for producing a cured product, the method including:
irradiating the cationic curable composition according to claim 1 with light to photodegrade the photodegradable silicon compound to generate the silanol group, followed by heating.

11. The method according to claim 10 , wherein the heating is performed at 60° C. or higher but 180° C. or lower.

Assignees

• Dexerials Corp

Inventors

• Kamiya Kazunobu
• Shibuya Hiroki

Classifications

• C08G59/70 Primary

  Chelates · CPC title

• C08G59/4021

  Ureas; Thioureas; Guanidines; Dicyandiamides · CPC title

• C08J3/24

  Crosslinking, e.g. vulcanising, of macromolecules (mechanical aspects B29C35/00; crosslinking agents C08K) · CPC title

• C08J3/28

  Treatment by wave energy or particle radiation · CPC title

• C08K7/22

  Expanded, porous or hollow particles · CPC title