Method of controlling the placement of micro-objects on a micro-assembler

US11772964B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11772964-B2
Application numberUS-202217665305-A
CountryUS
Kind codeB2
Filing dateFeb 4, 2022
Priority dateDec 31, 2018
Publication dateOct 3, 2023
Grant dateOct 3, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: detecting a current state of a set of micro-objects located on a surface of a micro-assembler comprising a plurality of force generating pixels; determining a next mode for a control component based on the current state of the set of micro-objects, wherein the control component is in a current mode; identifying a set of control patterns based on the next mode; and manipulate the set of micro-objects using the set of control patterns, wherein each control pattern of the set of control patterns indicates a voltage pattern on a portion of the plurality of force generating pixels; wherein a second set of control patterns is used to manipulate the set of micro-objects when the control component is in the current mode. 2. The method of claim 1 , wherein the current mode of the control component comprises one or more of: a rotating mode; an unsticking mode; an anchoring mode; a translating mode; a pulling down mode; a transferring mode; and an unassigned mode. 3. The method of claim 1 , wherein the next mode is determined further based on a desired state for the set of micro-objects. 4. The method of claim 1 , wherein the current state of the set of micro-objects is determined when the control component is in a translation mode. 5. The method of claim 1 , wherein the set of control patterns are one or more of: automatically generated by a computing device; based on user input; and based on previous testing of the set of control patterns. 6. The method of claim 1 , wherein the set of control patterns indicates at least one refresh rate for a first control pattern of the set of control patterns. 7. The method of claim 1 , wherein different control patterns of the set of control patterns are used at different time periods. 8. The method of claim 1 , wherein manipulating the set of micro-objects comprises: identifying a set of target areas; associating the set of micro-objects with the set of target areas; and moving the set of micro-objects to the set of target areas. 9. The method of claim 1 , wherein the set of control patterns cause one or more of electrophoretic forces or dielectrophoretic forces to be exerted on the set of micro-objects.

Assignees

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Classifications

  • using identification means, e.g. labels on substrates or labels on containers · CPC title

  • Sorting devices · CPC title

  • batch processes · CPC title

  • Means to assemble electrical device · CPC title

  • by utilizing optical sighting device · CPC title

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Frequently asked questions

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What does patent US11772964B2 cover?
Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patt…
Who is the assignee on this patent?
Palo Alto Res Ct Inc, Xerox Corp
What technology area does this patent fall under?
Primary CPC classification B81C99/002. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 03 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).