Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith

Patent metadata

Field	Value
Publication number	US-11772230-B2
Application number	US-202117154787-A
Country	US
Kind code	B2
Filing date	Jan 21, 2021
Priority date	Jan 21, 2021
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

The present invention provides CMP polishing pads or layers having a unfilled Shore D (2 second) hardness of from 57-77 or a filled Shore D (2 second) hardness of from 18-50, made from a two-component reaction mixture of (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer having an unreacted isocyanate (NCO) concentration of from 18 to 47 wt. %, based on the total solids weight of the aromatic isocyanate component, and (ii) a liquid polyol component including one or more curatives selected from the group of amines defined by Formulas (I) and (II).

First claim

We claim:

1. A chemical mechanical (CMP) polishing pad for polishing a substrate chosen from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate, the polishing pad comprising a polishing layer adapted for polishing the substrate, the polishing layer comprising a thermoset polyurethane foam having roughly spherical hollow cells that are isolated or partially connected forming small isolated clusters, the polyurethane form is a product of an organic solvent free two-component reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer having an unreacted isocyanate (NCO) concentration of 18 to 47 wt. %, based on the total solids weight of the aromatic isocyanate component, (ii) a liquid polyol component, and (iii) one or more curatives selected from the group of amines having Formulas (I) and (II)

wherein each R 1 and R 2 are independently C 1 -C 6 alkyl, C 1 -C 4 alkyl substituted with one or more C 1 -C 4 alkyl or one or more halogens, —(CR 5 R 6 ) p —S—(CR 5 R 6 ) q — or —(CR 5 R 6 ) p —O—(CR 5 R 6 ) q —; R 3 is C 1 -C 6 alkyl or C 1 -C 4 alkyl substituted with one or more C 1 -C 4 alkyl; each R 4 is independently H or —R 1 —OH; each R 5 and R 6 are independently H or C 1 -C 6 alkyl; each p and q are independently an integer from 1 through 5; and n is in the range of 1 to 4, wherein the reaction mixture comprises 55 to 75 wt. % of hard segment materials, based on the total weight of the reaction mixture, the total amount of the curatives (I) and/or (II) range from 9 to 26.8 wt %, based on the total weight of the reaction mixture, the CMP polishing layer has a unfilled Shore D (2 second) hardness of 57-77 or a filled Shore D (2 second) hardness of 18-50, and densities of 0.43 to 0.78 g/mL.

2. The CMP polishing pad as claimed in claim 1 , wherein the liquid aromatic isocyanate component comprises a linear aromatic isocyanate-terminated urethane prepolymer.

3. The CMP polishing pad as claimed in claim 2 , wherein the one or more curatives are selected from the group of amines having Formula (II).

4. The CMP polishing pad as claimed in claim 3 , wherein n is 2.

5. The CMP polishing pad as claimed in claim 4 , wherein the CMP polishing layer has densities of 0.50 to 0.78 g/mL.

6. The CMP polishing pad as claimed in claim 1 , wherein the one or more curatives are selected from the group of amines having Formula (II).

7. The CMP polishing pad as claimed in claim 6 , wherein n is 2.

Assignees

• Rohm & Haas Elect Materials Cmp Holdings Inc

Inventors

• Ren Jing
• Tettey Kwadwo
• Barton Bryan E

Classifications

• B24B37/24 Primary

  characterised by the composition or properties of the pad materials · CPC title

• C08G18/12

  using two or more compounds having active hydrogen in the first polymerisation step · CPC title

• C08G18/1825

  having hydroxy or primary amino groups · CPC title

• C08G18/3206

  aliphatic · CPC title

• C08G18/4854

  Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group · CPC title