Printed circuit board and electronic device including the same

Patent metadata

Field	Value
Publication number	US-11770897-B2
Application number	US-202117545374-A
Country	US
Kind code	B2
Filing date	Dec 8, 2021
Priority date	Nov 10, 2020
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A printed circuit board and an electronic device including the printed circuit board are provided. The electronic device includes a housing, and a printed circuit board located in an inner space of the housing, wherein the printed circuit board includes a component disposition area in which at least one component is disposed, a pre-forming area in which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and a flexible area having flexible characteristics and on which the plastic deformation material is not laminated.

First claim

The invention claimed is:

1. An electronic device comprising:
a housing; and
a printed circuit board disposed at an inner space of the housing,
wherein the printed circuit board comprises:
a component disposition area on which at least one component is disposed,
a pre-forming area on which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and
a flexible area on which the plastic deformation material is not laminated, the flexible area comprising flexible characteristics,

wherein the pre-forming area is pre-bent to correspond to a bent area at a corner part of the inner space of the housing.

2. The electronic device of claim 1 , wherein the flexible area is disposed adjacent to a connector disposition area on which a connector of the printed circuit board is disposed.

3. The electronic device of claim 1 ,
wherein the plastic deformation material causes an elastic deformation to occur in a region in which an elongation is less than 10%, and
wherein the plastic deformation material causes the plastic deformation to occur in a region in which the elongation is within 10% to 80%.

4. The electronic device of claim 3 , wherein the plastic deformation material has characteristics in that a modulus value is equal to or smaller than 15 MPa in the region in which the elongation is within 10% to 80%.

5. The electronic device of claim 3 , wherein the plastic deformation material has characteristics in that a break occurs in a region in which the elongation is equal to or larger than 80%.

6. The electronic device of claim 1 ,
wherein the printed circuit board is formed in a 4-layer structure comprising four copper layers, and
wherein the plastic deformation material is laminated between a first copper layer and a second copper layer and between a third copper layer and a fourth copper layer of the printed circuit board.

7. The electronic device of claim 1 ,
wherein the printed circuit board is formed in a 4-layer structure comprising four copper layers, and
wherein the plastic deformation material is laminated between a first copper layer and a second copper layer, between the second copper layer and a third copper layer, and between the third copper layer and a fourth copper layer of the printed circuit board.

8. The electronic device of claim 7 ,
wherein the plastic deformation material is not laminated in the flexible area of the printed circuit board, and
wherein a shielding film is laminated on a same layer as the plastic deformation material.

9. The electronic device of claim 7 ,
wherein the plastic deformation material is not laminated in the flexible area of the printed circuit board, and
wherein an air gap is formed on a same layer as the plastic deformation material.

10. The electronic device of claim 1 , wherein the electronic device comprises a bar type shape.

11. The electronic device of claim 1 ,
wherein the housing comprises a foldable housing that is foldable based on a hinge module, and
wherein the flexible area of the printed circuit board is disposed adjacent to the hinge module.

12. The electronic device of claim 1 , further comprising:
a slide plate configured to slide in a designated direction from the housing based on a movement of a roller located inside the housing; and
a flexible display supported by the housing and the slide plate,
wherein the printed circuit board is disposed to pass through the roller, and electrically connects different components located inside the housing to each other, and
wherein the flexible area of the printed circuit board is disposed adjacent to the roller.

13. A printed circuit board electrically connecting different components of an electronic device to each other, the printed circuit board comprising:
a component disposition area on which at least one component is disposed;
a pre-forming area on which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board; and
a flexible area on which the plastic deformation material is not laminated, the flexible area comprising flexible characteristics,
wherein the pre-forming area is pre-bent to correspond to a bent area at a corner part of an inner space of a housing of the electronic device.

14. The printed circuit board of claim 13 , wherein the flexible area is disposed adjacent to a connector disposition area on which a connector of the printed circuit board is disposed.

15. The printed circuit board of claim 13 ,
wherein the plastic deformation material causes an elastic deformation to occur in a region in which an elongation is less than 10%, and
wherein the plastic deformation material causes the plastic deformation to occur in a region in which the elongation is within 10% to 80%.

16. The printed circuit board of claim 15 , wherein the plastic deformation material has characteristics in that a modulus value is equal to or smaller than 15 MPa in the region in which the elongation is within 10% to 80%.

17. The printed circuit board of claim 15 , wherein the plastic deformation material has characteristics in that a break occurs in a region in which the elongation is equal to or larger than 80%.

18. The printed circuit board of claim 13 ,
wherein the printed circuit board is formed in a 4-layer structure comprising four copper layers, and
wherein the plastic deformation material is laminated between a first copper layer and a second copper layer and between a third copper layer and a fourth copper layer of the printed circuit board.

19. The printed circuit board of claim 13 ,
wherein the printed circuit board is formed in a 4-layer structure comprising four copper layers, and
wherein the plastic deformation material is laminated between a first copper layer and a second copper layer, between the second copper layer and a third copper layer, and between the third copper layer and a fourth copper layer of the printed circuit board.

20. The printed circuit board of claim 19 ,
wherein the plastic deformation material is not laminated in the flexible area of the printed circuit board, and
wherein a shielding film is laminated, or an air gap is formed, on a same layer as the plastic deformation material.

21. The printed circuit board of claim 13 , wherein the pre-forming area comprises at least two separate areas disposed between the component disposition area and the flexible area of the printed circuit board.

22. The printed circuit board of claim 13 ,
wherein the printed circuit board is configured to pass through a roller, and
wherein a bending configuration of the printed circuit board is based on a position state of the roller.

23. The printed circuit board of claim 13 , wherein the flexible area comprises a structure in which polyimide flexible copper clad laminate (FCCL)/coverlay is laminated.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Youngsun
• Park Sungwon
• Lee Sunghyup
• Min Byeonguk

Classifications

• H05K1/148 Primary

  Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means · CPC title

• H05K1/036

  Multilayers with layers of different types · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title

• H05K2201/0999

  Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing · CPC title

• H05K2201/10128

  Display · CPC title