Wire feeding and attaching system for camera lens suspensions

Patent metadata

Field	Value
Publication number	US-11769977-B2
Application number	US-202017099481-A
Country	US
Kind code	B2
Filing date	Nov 16, 2020
Priority date	Apr 2, 2015
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.

First claim

The invention claimed is:

1. A wire feeding and bonding tool, comprising:
a support configured to hold a component to which a wire is to be attached, the component has at least first and second spaced-apart wire attach structures to which the wire can be attached, and a first wire axis extends between the first and second wire attach structures; and
a wire clamp assembly adjacent to the support, the wire clamp assembly including:
a capillary having an end portion with a feed opening and configured to receive a wire that extends from the feed opening;
a stage for moving the capillary with respect to the support to position the capillary and the wire extending from the feed opening;

an attachment component adjacent to the support and configured to attach the wire to the first and second wire attach structures; and
a controller electrically coupled to the stage and the attachment tool, wherein the controller is configured to cause the stage to actuate to position the capillary with portions of the wire extending from the feed opening along a wire feed path and feed the wire from the first wire attach structure to the second wire attach structure with the wire emerging from the feed opening coaxially with the wire axis; and
wherein the controller is also configured to actuate the attachment component to attach the wire to the first and second attach structures.

2. The wire feeding and bonding tool of claim 1 , wherein the component has at least one bonding area, and
the controller is configured to cause the stage to actuate to position the capillary with portions of the wire extending from the feed opening extending into the bonding areas; and
the attachment component includes at least one soldering tool to attach the wire to the first and second wire attach structures.

3. The wire feeding and bonding tool of claim 1 , wherein the component has at least one bonding area, and
the controller is configured to cause the stage to actuate to position the capillary with portions of the wire extending from the feed opening extending into the bonding areas; and
the attachment component includes at least one welding tool to attach the wire to the first and second wire attach structures.

4. The wire feeding and bonding tool of claim 1 , wherein the component has at least one bonding area, and
the controller is configured to cause the stage to actuate to position the capillary with portions of the wire extending from the feed opening extending into the bonding areas; and
the attachment component includes at least one conductive adhesive dispensing tool to attach the wire to the first and second wire attach structures.

5. The wire feeding and bonding tool of claim 1 , wherein:
the capillary includes a linear end portion; and
the controller is configured to the stage to actuate to move the capillary with the linear end portion coaxially with the wire axis to reduce damage to the wire.

6. The wire feeding and bonding tool of claim 1 , wherein:
the controller is configured to cause the stage to actuate to move the capillary away from the first wire attach structure along a first portion of the wire feed path that is generally linear; and
the controller is configured to cause the stage to actuate to move the capillary during a second portion of the wire feed path that is generally perpendicular to the first portion of the wire feed path, and the second portion of the wire feed path is shorter than the first portion of the wire feed path.

7. The wire feeding and bonding tool of claim 6 , wherein the controller is configured to actuate the stage to move the capillary through a looping path during the second portion of the wire feed path.

8. The wire feeding and bonding tool of claim 1 comprising a cutting tool positioned with respect to the support to cut the wire and the controller is configured to cause the cutting tool to actuate to cut the wire.

9. The wire feeding and bonding tool of claim 8 , wherein the controller is configured to:
cause the stage to actuate to position the capillary with an end of the wire extending from the feed opening adjacent to the first wire attach structure;
cause the attachment component to actuate to attach the end of the wire adjacent to the first wire attach structure to the first wire attach structure;
cause the stage to actuate to move the capillary along the wire feed path after the wire is attached to the first attach structure, and to position a portion of the wire extending from the capillary adjacent to the second wire attach structure;
cause the attachment component to actuate to attach the portion of the wire adjacent to the second wire attach structure to the second wire attach structure; and
cause the cutting tool to actuate to cut the portion of the wire attached to the second attach structure from a portion extending from the feed opening.

10. The wire feeding and bonding tool of claim 9 wherein the component has first and second attach structures, each with a bonding area, and the controller is configured to cause the stage to actuate to position the capillary with the wire extending from the feed opening into the bonding areas; and
the attachment component includes at least one soldering tool to attach the wires within bonding areas of the first and second attach structures.

11. The wire feeding and bonding tool of claim 9 , wherein the component has first and second attach structures, each with a bonding area, and
the controller is configured to cause the stage to actuate to position the capillary with the wire extending from the feed opening into the bonding areas; and
the attachment component includes at least one welding tool to attach the wires within bonding areas of the first and second attach structures.

12. The wire feeding and bonding tool of claim 9 , wherein the component has first and second attach structures, each with a bonding area, and
the controller is configured to cause the stage to actuate to position the capillary with the wire extending from the feed opening into the bonding areas; and
the attachment component includes at least one conductive adhesive dispensing tool to attach the wires within the bonding areas of the first and second attach structures.

13. The wire feeding and bonding tool of claim 9 , wherein the component has at least third and fourth wire attach structures, each with a bonding area, and wherein a second wire attach axis that is non-collinear with the first wire attach axis extends between the third and fourth bonding areas, and
the wire feeding and bonding tool includes a support actuator coupled to the controller to rotate the support with respect to the wire feed system; and
the controller is configured to:
cause the support actuator to actuate to rotate the support and component held thereon;
cause the stage to actuate to position the capillary with an end of the wire extending from the feed opening into to the third bonding area;
cause the attachment component to actuate to attach the wire to the third bonding area;
cause the stage to actuate to move the capillary along the wire feed path after the wire is attached to the third bonding area, and to position a portion of the wire extending from the capillary into the fourth bonding area;
cause the attachment component to actuate to attach the wire to the fourth bonding area; and
cause the cutting tool to actuate to cut the portion of the wire attached to the fourth bonding area from a portion extending from the feed opening.

14. The wire feeding and bonding tool of claim 13 , wherein:
the controller is configured cause the stage to actuate to move the capilla

Assignees

• Hutchinson Technology

Inventors

• Davis Michael W
• Scheele Bryan J
• Scheele Daniel W
• Ashwill Andrew H
• Crane Matthew D

Classifications

• F03G7/06143

  Wires · CPC title

• F03G7/067

  Safety arrangements · CPC title

• F03G7/0665

  controlled displacement, e.g. by using a lens positioning actuator · CPC title

• H01R43/052 Primary

  with wire-feeding mechanism · CPC title

• B21F15/10 Primary

  wire with sheet metal · CPC title