Double Layer Release Temporary Bond and Debond Processes and Systems
US-2016133486-A1 · May 12, 2016 · US
US11768465B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11768465-B2 |
| Application number | US-202016773473-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 27, 2020 |
| Priority date | Jun 3, 2014 |
| Publication date | Sep 26, 2023 |
| Grant date | Sep 26, 2023 |
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A substrate for forming timepiece components includes a first part based on photostructurable glass and at least a second part based on at least one second material. One surface of the first part is made integral with a surface of the second part so as to form a one-piece timepiece component.
Opening claim text (preview).
The invention claimed is: 1. A substrate comprising: a first wafer based on photostructurable glass, the first wafer having a first thickness and including a planar body with a plurality of first parts that are identically shaped and identically oriented in an interior of the planar body of the first wafer, the first parts formed by etching the first wafer and the first parts are connected to the first wafer by bridges after the etching; and a second wafer based on at least one second material, the second wafer having a second thickness and including a planar body with a plurality of second parts that are identically shaped and identically oriented in an interior of the planar body of the second wafer, the second parts formed by etching the second wafer and the second parts are connected to the second wafer by bridges after the etching, wherein the first wafer with the etched first parts and the second wafer with the etched second parts are joined, after the etching of the first wafer and the etching of the second wafer is completed, to adjoin only along a single surface, wherein, once the first wafer and the second wafer are joined, one surface of each of the first parts is made integral with a first surface of each of the second parts thereby forming a plurality of the one-piece timepiece components attached to the first wafer and the second wafer, and wherein the first parts are each a contrate toothing and the second parts are each an annular part including a central hole. 2. The substrate according to claim 1 , wherein the at least one second material is silicon-based and includes single crystal silicon, doped single crystal silicon, polycrystalline silicon, doped polycrystalline silicon, porous silicon, silicon oxide, quartz, silica, silicon nitride or silicon carbide. 3. The substrate according to claim 1 , wherein the at least one second material is ceramic-based and includes photostructurable glass, borosilicate, aluminosilicate, quartz glass, zerodur, single crystal corundum, polycrystalline corundum, alumina, aluminium oxide, aluminium nitride, single crystal ruby, polycrystalline ruby, zirconium oxide, titanium oxide, titanium nitride, titanium carbide, tungsten nitride, tungsten carbide, boron nitride or boron carbide. 4. The substrate according to claim 1 , wherein the at least one second material is metal-based and includes an iron alloy, a copper alloy, nickel or an alloy thereof, titanium or an alloy thereof, gold or an alloy thereof, silver or an alloy thereof, platinum or an alloy thereof, ruthenium or an alloy thereof, rhodium or an alloy thereof, or palladium or an alloy thereof. 5. The substrate according to claim 1 , wherein the at least one second material further includes at least a partial coating of silicon oxide, silicon nitride, silicon carbide or an allotrope of carbon. 6. The substrate according to claim 1 , wherein the first parts are arranged along a straight line on the first wafer and the second parts are arranged along a straight line on the second wafer. 7. A substrate comprising: a first wafer based on photostructurable glass, the first wafer having a first thickness and including a planar body with a plurality of first parts that are identically shaped in an interior of the planar body of the first wafer, the first parts formed by etching the first wafer and the first parts are connected to the first wafer by bridges after the etching; and a second wafer based on at least one second material, the second wafer having a second thickness and including a planar body with a plurality of second parts that are identically shaped in an interior of the planar body of the second wafer, the second parts formed by etching the second wafer and the second parts are connected to the second wafer by bridges after the etching, wherein the first wafer with the etched first parts and the second wafer with the etched second parts are joined, after the etching of the first wafer and the etching of the second wafer is completed, to adjoin only along a single surface, wherein, once the first wafer and the second wafer are joined, one surface of the first part is made integral with a surface of the second part thereby forming a one-piece timepiece component attached to the first wafer and the second wafer, wherein the one-piece timepiece component is permanently releasable from the substrate, and wherein the first parts are each asymmetrical columns and the second parts are each an annular part including a central hole and peripheral toothing. 8. The substrate according to claim 7 , wherein the at least one second material is silicon-based and includes single crystal silicon, doped single crystal silicon, polycrystalline silicon, doped polycrystalline silicon, porous silicon, silicon oxide, quartz, silica, silicon nitride or silicon carbide. 9. The substrate according to claim 7 , wherein the at least one second material is ceramic-based and includes photostructurable glass, borosilicate, aluminosilicate, quartz glass, zerodur, single crystal corundum, polycrystalline corundum, alumina, aluminium oxide, aluminium nitride, single crystal ruby, polycrystalline ruby, zirconium oxide, titanium oxide, titanium nitride, titanium carbide, tungsten nitride, tungsten carbide, boron nitride or boron carbide. 10. The substrate according to claim 7 , wherein the at least one second material is metal-based and includes an iron alloy, a copper alloy, nickel or an alloy thereof, titanium or an alloy thereof, gold or an alloy thereof, silver or an alloy thereof, platinum or an alloy thereof, ruthenium or an alloy thereof, rhodium or an alloy thereof, or palladium or an alloy thereof. 11. The substrate according to claim 7 , wherein the at least one second material further includes at least a partial coating of silicon oxide, silicon nitride, silicon carbide or an allotrope of carbon. 12. The substrate according to claim 7 , wherein the first parts are arranged along a straight line on the first wafer and the second parts are arranged along a straight line on the second wafer. 13. A substrate comprising: a first wafer based on photostructurable glass, the first wafer having a first thickness and including a planar body with a first part in an interior of the planar body of the first wafer, the first part being formed by etching the first wafer, the first part connected to the first wafer by at least one bridge after the etching; and a second wafer based on at least one second material, the second wafer having a second thickness and including a planar body with a second part in an interior of the planar body of the second wafer, the second part being formed by etching the second wafer, the second part connected to the second wafer by at least one bridge after the etching, wherein the first wafer and the second wafer are joined, after the etching of the first wafer and the etching of the second wafer is completed, to adjoin only along a single surface, wherein one surface of the first part is made integral with a first surface of the second part thereby forming a one-piece timepiece component, and wherein the first parts are each a contrate toothing and the second parts are each an annular part including a central hole. 14. The substrate according to claim 13 , wherein the at least one second material is silicon-based and includes single crystal silicon, doped single crystal silicon, polycrystalline silicon, doped polycrystalline silicon, porous silicon, silicon oxide, quartz, silica, silicon nitride or silicon carbide. 15. The substrate according to claim 13 , wherein the at least one second material is ceramic-based
Gearwork {(gearwork for driving the hands G04B19/02; calibers G04B33/00; dispositions and components for transmission in general F16H)} · CPC title
Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) · CPC title
Joining glass to glass by processes other than fusing (fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66) · CPC title
Composition and manufacture of the springs (compositions and manufacture of components, wheels, spindles, pivots, or the like G04B13/02; compositions of component escapements G04B15/14; composition and manufacture or hairsprings G04B17/066; compensation for the effects of variations of temperature of springs using alloys, especially for hairsprings G04B17/227; materials for bearings of clockworks G04B31/00; heat treatment and chemical or mechanical treatment for control of the structure C21D8/00; iron and steel alloys C22C; non-ferrous alloys C22C and B22F) · CPC title
characterised by the material used · CPC title
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