Accelerometer having an over travel stop with a stop gap less than a minimum etch size

Patent metadata

Field	Value
Publication number	US-11768220-B2
Application number	US-202117470073-A
Country	US
Kind code	B2
Filing date	Sep 9, 2021
Priority date	Sep 9, 2021
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A microelectromechanical systems (MEMS) accelerometer comprises a compliant spring structure with a first beam, a second beam, and a rigid structure. One end of the first beam and one end of the second beam are coupled to the rigid structure and a proof mass is coupled to another end of the second beam. Further, a spring anchor is coupled to another end of the first beam. In response to the proof mass moving, an extension coupled to the rigid structure moves in an opposite direction to motion of the proof mass to contact the proof mass and stop the movement of the proof mass.

First claim

What is claimed is:

1 . A microelectromechanical systems (MEMS) accelerometer comprising:
a compliant spring structure comprising a first beam, a second beam, and a rigid structure, wherein one end of the first beam and one end of the second beam are coupled to the rigid structure and the rigid structure is arranged in between the one end of the first beam and the one end of the second beam; a proof mass coupled to another end of the second beam; and a spring anchor coupled to another end of the first beam; wherein in response to the proof mass moving, an extension coupled to the rigid structure moves in an opposite direction to the motion of the proof mass to contact the proof mass and stop the movement of the proof mass, wherein the ends of the first beam and the second beam are along a longitudinal direction of the first beam and the second beam.

2 . The MEMS accelerometer of claim 1 , wherein the rigid structure rotates in an orthogonal direction to the motion of the proof mass which causes the extension to move in the opposite direction.

3 . The MEMS accelerometer of claim 1 , wherein a maximum displacement of the proof mass is less than a minimum etch size of a fabrication process of the MEMS accelerometer.

4 . The MEMS accelerometer of claim 1 , wherein a sum of maximum displacement of the proof mass and maximum displacement of the extension is less than or equal to a minimum etch size.

5 . The MEMS accelerometer of claim 1 , further comprising a sense finger to sense a capacitance between the sense finger and the proof mass, wherein a differential of the capacitance is indicative of an acceleration of the proof mass.

6 . The MEMS accelerometer of claim 5 , wherein a sense gap between the sense finger and the proof mass is greater than a minimum etch size of a fabrication process of the MEMS accelerometer.

7 . The MEMS accelerometer of claim 1 , wherein the spring anchor is anchored to a substrate.

8 . The MEMS accelerometer of claim 1 , wherein a length of the extension determines a displacement of the extension based on the motion of the proof mass.

9 . The MEMS accelerometer of claim 8 , wherein a length of the extension is inversely proportional to a displacement of the proof mass before the extension contacts the proof mass.

10 . The MEMS accelerometer of claim 1 , wherein the spring anchor is directly coupled to the other end of the first beam and not directly coupled to any end of the second beam.

Assignees

• Nxp Usa Inc

Inventors

• Geisberger Aaron A
• Tang Jun

Classifications

• G01P15/125 Primary

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• G01P2015/0871

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