Poppet valve

US11767774B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11767774-B2
Application numberUS-201816759745-A
CountryUS
Kind codeB2
Filing dateOct 17, 2018
Priority dateOct 30, 2017
Publication dateSep 26, 2023
Grant dateSep 26, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A poppet valve includes: a valve body comprising a valve stem body, a valve head body with a valve combustion face, and a valve fillet body interconnecting the valve stem body and the valve head body. The valve fillet body surface has an increased thermal resistance compared to the valve combustion face.

First claim

Opening claim text (preview).

The invention claimed is: 1. A poppet valve, comprising: a valve body comprising a valve stem body, a valve head body with an uncoated valve combustion face provided on a first side of the valve head body, a cavity arranged in one or both of the valve stem body and the valve head body, and a valve fillet body interconnecting the valve stem body to a second side of the valve head body, the second side being opposite the first side, wherein an exterior surface of the valve fillet body has an increased thermal resistance compared to the valve combustion face, and wherein a thermal barrier coating is arranged on the valve fillet body to provide the increased thermal resistance, the thermal barrier coating comprising ferrite particles arranged by crystal growth, a silica based inorganic compound, spray painting of hollow ceramic balls, or a thermal spray of Yttria-stabilized zirconia. 2. The poppet valve according to claim 1 , wherein a bond coating is interposed between the thermal barrier coating and the valve fillet body. 3. The poppet valve according to claim 1 , wherein a coating thickness is between 0.1 mm and 0.6 mm. 4. The poppet valve according to claim 1 , wherein the valve combustion face is uncoated. 5. The poppet valve according to claim 1 , wherein the cavity is filled with a heat conducting material. 6. The poppet valve according to claim 5 , wherein the heat conducting material comprises sodium. 7. A method for manufacturing the poppet valve according to claim 1 , which method comprises the steps of: providing the poppet valve having the valve body comprising the valve stem body, the valve head body with the uncoated valve combustion face, the cavity arranged in one or both of the valve stem body and the valve head body, and the valve fillet body interconnecting the valve stem body and the valve head body; and using either atmospheric plasma spraying (APS) or high velocity oxygen fuel spraying (HVOF) to arrange a thermal barrier coating on at least part of the exterior surface of the valve fillet body. 8. The method according to claim 7 , wherein the poppet valve is rotated around a longitudinal axis thereof while the thermal barrier coating is arranged. 9. The method of claim 7 , further comprising filling the cavity with a heat conducting material. 10. The poppet valve according to claim 1 , wherein the uncoated valve combustion face is provided on an entirety of the first side of the valve head body.

Assignees

Inventors

Classifications

  • F01L3/04Primary

    Coated valve members or valve-seats · CPC title

  • poppet valves, e.g. for internal-combustion engines · CPC title

  • poppet valves · CPC title

  • Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated · CPC title

  • Pretreatment of the material to be coated, e.g. for coating on selected surface areas · CPC title

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Frequently asked questions

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What does patent US11767774B2 cover?
A poppet valve includes: a valve body comprising a valve stem body, a valve head body with a valve combustion face, and a valve fillet body interconnecting the valve stem body and the valve head body. The valve fillet body surface has an increased thermal resistance compared to the valve combustion face.
Who is the assignee on this patent?
Eaton Intelligent Power Ltd
What technology area does this patent fall under?
Primary CPC classification F01L3/04. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Sep 26 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).