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US-12171741-B2 · Dec 24, 2024 · US
Compound, pattern forming substrate, coupling agent, and pattern formation method
US11767327B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11767327-B2 |
| Application number | US-202016744949-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 16, 2020 |
| Priority date | Jul 19, 2017 |
| Publication date | Sep 26, 2023 |
| Grant date | Sep 26, 2023 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
What is provided is a compound, a pattern forming substrate, a coupling agent, and a pattern formation method. The compound is represented by Formula (1).[in the formula, X01 represents a group exhibiting semiconductor characteristics and Y represents a divalent linking group]
First claim
Opening claim text (preview).
The invention claimed is: 1. A compound represented by Formula (1), [in the formula, X 01 represents a group exhibiting semiconductor characteristics and Y represents a divalent linking group], wherein the X 01 represents a group having a thiophene skeleton. 2. A pattern forming substrate, which has a surface chemically modified by the compound according to claim 1 . 3. A coupling agent which is formed of the compound according to claim 1 .
Assignees
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Classifications
- C07D495/04Primary
Ortho-condensed systems · CPC title
- C07D409/12Primary
linked by a chain containing hetero atoms as chain links · CPC title
Compounds having one or more O-Si linkage (for compounds with C-O-Si linkages see C07F7/18) · CPC title
Silicon-containing compounds · CPC title
Providing a shape to conductive layers, e.g. patterning or selective deposition · CPC title
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Frequently asked questions
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- What does patent US11767327B2 cover?
- What is provided is a compound, a pattern forming substrate, a coupling agent, and a pattern formation method. The compound is represented by Formula (1).[in the formula, X01 represents a group exhibiting semiconductor characteristics and Y represents a divalent linking group]
- Who is the assignee on this patent?
- Nikon Corp, Univ Kanagawa
- What technology area does this patent fall under?
- Primary CPC classification C07D495/04. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Sep 26 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).