Matrix addressable, line laser, marking system using laser additives

Patent metadata

Field	Value
Publication number	US-11766874-B2
Application number	US-202117531098-A
Country	US
Kind code	B2
Filing date	Nov 19, 2021
Priority date	Nov 19, 2021
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

Apparatus and method for using a line laser (LL) to quickly mark a substrate or media by utilizing a laser additive on/within the substrate/media, which greatly reduces the power requirement for marking the substrate/media. The combination of the LL wide swath (>305 mm) and the improved media/surface sensitivity to laser wavelength allows the LL marking system to achieve faster marking than other systems. The LL is mounted over a transport which transports the sensitized substrate/media past the LL for marking. The desired image is projected from the LL line by line in synch with the moving media and once the media passes the beam path of the LL, marking is complete. In this case, the media has been physically-altered via the heat generated by the LL interacting with the photosensitized media and is permanent. A second method would use a photosensitizing agent coated on top of the media to be marked.

First claim

What is claimed is:

1. A device for rapidly marking a substrate using a laser, said device comprising:
a transport for conveying the substrate to be marked, said substrate comprising a laser additive that photosensitizes said substrate;
a laser that emits a line laser beam that is addressable at a pixel level and is positioned over the transport for directing said line laser beam at said substrate as the substrate moves on said transport, said laser being synchronized with said transport movement to rapidly mark said substrate in a line by line pattern.

2. The device of claim 1 wherein said laser comprises a plurality of laser diode arrays that are reflected off of a corresponding plurality of digital micro mirror devices to generate said laser line beam.

3. The device of claim 2 wherein said plurality of laser diode arrays comprises fifteen laser diode arrays and said corresponding plurality of digital micro mirror devices comprises fifteen digital micro mirror devices.

4. The device of claim 2 wherein said each one of said plurality of laser diode arrays has in the range of 10 watts-200 watts of input power.

5. The device of claim 1 wherein said line laser beam is addressable in x and y dimensions.

6. The device of claim 1 wherein said line laser beam comprises a line length in the range of 0.75 inches-20 inches and a line width in the range of 10 μm-300 μm.

7. The device of claim 1 wherein said laser operates using a wavelength in the range of 300 nm-2000 nm.

8. The device of claim 1 wherein a surface of said substrate is treated with a surface coating comprising said laser additive prior to conveying said substrate on said transport, said surface coating being marked by said line laser.

9. The device of claim 1 wherein said substrate is formed with said laser additive therein, prior to conveying said substrate on said transport, said substrate being marked by said laser below a top surface of said substrate.

10. A method for rapidly marking a substrate using a laser, said method comprising:
conveying said substrate to be marked on a transport and wherein said substrate comprises a laser additive that photosensitizes said substrate;
positioning a laser over said transport and synchronized with movement of said transport, said laser directing a line laser beam at said substrate in a line by line pattern as said substrate passes thereunder to rapidly mark said substrate, said laser line beam being addressable at a pixel level.

11. The method of claim 10 further comprising the step of treating said surface of said substrate with a surface coating comprising said laser additive prior to conveying said substrate on said transport and wherein said laser marks said surface coating.

12. The method of claim 10 further comprising the step of forming said substrate with said laser additive therein prior to conveying said substrate on said transport and wherein said laser marks said substrate below a surface of said substrate.

13. The method of claim 10 wherein said step of positioning said laser comprises providing a plurality of laser diode arrays that are reflected off of a corresponding plurality of digital micro mirror devices to generate said laser line beam.

14. The method of claim 13 wherein said plurality of laser diode arrays comprises fifteen laser diode arrays and said corresponding plurality of digital micro mirror devices comprises fifteen digital micro mirror devices.

15. The method of claim 13 wherein said each one of said plurality of laser diode arrays has in the range of 10 watts-200 watts of input power.

16. The method of claim 10 wherein said line laser beam is addressable in x and y dimensions.

17. The method of claim 10 wherein said line laser beam comprises a line length in the range of 0.75 inches-20 inches and a line width in the range of 10 μm-300 μm.

18. The method of claim 10 wherein said laser operates using a wavelength in the range of 300 nm-2000 nm.

19. The method of claim 10 wherein movement of said transport comprises stepped motion.

20. The method of claim 19 wherein said stepped motion is defined by a width of said line laser beam.

21. The method of claim 10 wherein movement of said transport is continuous and wherein said line laser beam comprises image scrolling.

22. A device for rapidly embedding a marking within an optically clear substrate using a laser, said device comprising:
a transport for conveying the substrate to be marked, said substrate being optically clear and said substrate comprising a laser additive that photosensitizes said substrate;
a laser that emits a line laser beam that is addressable at a pixel level and is positioned over the transport for directing said line laser beam at said substrate and focusing said line laser beam to generate sub-surface marking, as the substrate moves on said transport, said laser being synchronized with said transport movement to rapidly generate said sub-surface mark in a line by line pattern.

23. A method for rapidly embedding a marking within an optically clear substrate using a laser, said method comprising:
conveying said substrate to be embeddedly marked on a transport, said substrate being optically clear and said substrate comprising a laser additive that photosensitizes said substrate;
positioning a laser over said transport and synchronized with movement of said transport, said laser directing a line laser beam at said substrate and focusing said line laser beam to generate sub-surface marking, as said substrate moves on said transport, said laser being synchronized with said transport movement to rapidly generate said sub-surface mark in a line by line pattern, said laser line beam being addressable at a pixel level.

Assignees

• Xerox Corp

Inventors

• Knausdorf Peter J
• Condello Anthony S
• Lestrange Jack T
• Ramesh Palghat S
• Sheflin Joseph C

Classifications

• B41J2/471 Primary

  using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror · CPC title

• B41M5/267

  Marking of plastic artifacts, e.g. with laser · CPC title

• G02B7/1815

  with cooling or heating systems (cooling arrangements for laser mirrors H01S3/0401) · CPC title

• G02B26/0833 Primary

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• B41J2/442

  using lasers · CPC title