Thermosetting resin composition for lds and method for manufacturing semiconductor device
US-2022064402-A1 · Mar 3, 2022 · US
US11765872B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11765872-B2 |
| Application number | US-202017786056-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 19, 2020 |
| Priority date | Dec 24, 2019 |
| Publication date | Sep 19, 2023 |
| Grant date | Sep 19, 2023 |
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A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.
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The invention claimed is: 1. An electromagnetic wave shielding housing comprising: a cured product of a thermosetting resin composition, wherein the thermosetting resin composition is phenol resin composition; and a plating layer provided on a surface of the cured product, wherein the phenol resin composition includes the following components (A) and (B); (A) a phenol resin including a resol-type phenol resin and a novolac-type phenol resin, and (B) core-shell-type elastomer particles, the plating layer includes a Cu layer, and a thickness of the Cu layer is 2 μm or more and 30 μm or less. 2. The electromagnetic wave shielding housing according to claim 1 , wherein, for the cured product obtained by molding and then curing the thermosetting resin composition, a linear expansion coefficient in a range of 40° C. to 150° C., as measured by thermomechanical analysis at a temperature rise rate of 5° C./min, is 5 ppm/° C. or more and 25 ppm/° C. or less. 3. The electromagnetic wave shielding housing according to claim 1 , wherein a flexural strength of the cured product of the thermosetting resin composition is 140 MPa or more. 4. The electromagnetic wave shielding housing according to claim 1 , wherein a 90° peel strength of the cured product of the thermosetting resin composition measured by a 90° peel under the following conditions is 4 N/cm or more peel speed: 50 mm/min adherend: copper foil. 5. The electromagnetic wave shielding housing according to claim 1 , wherein the plating layer includes a Ni-containing plating layer provided outside the Cu layer in a lamination direction. 6. The electromagnetic wave shielding housing according to claim 5 , wherein a thickness of the Ni-containing plating layer is 0.3 μm or more and 20 μm or less. 7. The electromagnetic wave shielding housing according to claim 1 , wherein the plating layer includes a permalloy layer provided outside the Cu layer in a lamination direction. 8. The electromagnetic wave shielding housing according to claim 1 , wherein the plating layer includes a Ni-containing plating layer between the Cu layer and the cured product. 9. The electromagnetic wave shielding housing according to claim 1 , wherein an electromagnetic wave shielding performance due to a structure with the cured product and the plating layer provided on the surface of the cured product is 40 dB or more at a frequency of 10 MHz. 10. The electromagnetic wave shielding housing according to claim 1 , wherein an electromagnetic wave shielding performance due to a structure with the cured product and the plating layer provided on the surface of the cured product is 60 dB or more at a frequency of 100 MHz. 11. An inverter part comprising: the electromagnetic wave shielding housing according to claim 1 . 12. An air conditioner part comprising: the electromagnetic wave shielding housing according to claim 1 . 13. An automotive part comprising: the electromagnetic wave shielding housing according to claim 1 . 14. An electromagnetic wave shielding housing comprising: a cured product of a thermosetting resin composition, wherein the thermosetting resin composition is phenol resin composition; and a plating layer laminated on a surface of the cured product, wherein the phenol resin composition includes the following components (A) and (B); (A) a phenol resin including a resol-type phenol resin and a novolac-type phenol resin, and (B) core-shell-type elastomer particles, and an electromagnetic wave shielding performance due to a structure with the cured product and the plating layer is 40 dB or more at a frequency of 10 MHz. 15. The electromagnetic wave shielding housing according to claim 14 , wherein the electromagnetic wave shielding performance due to the structure with the cured product and the plating layer is 60 dB or more at a frequency of 100 MHz.
Containers comprising an insulating or insulated base · CPC title
being rigid plastic containers having a coating of shielding material · CPC title
made from non-conductive materials comprising an electro-conductive coating (H05K9/0031 takes precedence) · CPC title
comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition · CPC title
comprising a plurality of shielding layers; combining different shielding material structure · CPC title
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