Electromagnetic wave shielding housing, inverter part, air conditioner part, and automotive part

US11765872B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11765872-B2
Application numberUS-202017786056-A
CountryUS
Kind codeB2
Filing dateNov 19, 2020
Priority dateDec 24, 2019
Publication dateSep 19, 2023
Grant dateSep 19, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electromagnetic wave shielding housing comprising: a cured product of a thermosetting resin composition, wherein the thermosetting resin composition is phenol resin composition; and a plating layer provided on a surface of the cured product, wherein the phenol resin composition includes the following components (A) and (B); (A) a phenol resin including a resol-type phenol resin and a novolac-type phenol resin, and (B) core-shell-type elastomer particles, the plating layer includes a Cu layer, and a thickness of the Cu layer is 2 μm or more and 30 μm or less. 2. The electromagnetic wave shielding housing according to claim 1 , wherein, for the cured product obtained by molding and then curing the thermosetting resin composition, a linear expansion coefficient in a range of 40° C. to 150° C., as measured by thermomechanical analysis at a temperature rise rate of 5° C./min, is 5 ppm/° C. or more and 25 ppm/° C. or less. 3. The electromagnetic wave shielding housing according to claim 1 , wherein a flexural strength of the cured product of the thermosetting resin composition is 140 MPa or more. 4. The electromagnetic wave shielding housing according to claim 1 , wherein a 90° peel strength of the cured product of the thermosetting resin composition measured by a 90° peel under the following conditions is 4 N/cm or more peel speed: 50 mm/min adherend: copper foil. 5. The electromagnetic wave shielding housing according to claim 1 , wherein the plating layer includes a Ni-containing plating layer provided outside the Cu layer in a lamination direction. 6. The electromagnetic wave shielding housing according to claim 5 , wherein a thickness of the Ni-containing plating layer is 0.3 μm or more and 20 μm or less. 7. The electromagnetic wave shielding housing according to claim 1 , wherein the plating layer includes a permalloy layer provided outside the Cu layer in a lamination direction. 8. The electromagnetic wave shielding housing according to claim 1 , wherein the plating layer includes a Ni-containing plating layer between the Cu layer and the cured product. 9. The electromagnetic wave shielding housing according to claim 1 , wherein an electromagnetic wave shielding performance due to a structure with the cured product and the plating layer provided on the surface of the cured product is 40 dB or more at a frequency of 10 MHz. 10. The electromagnetic wave shielding housing according to claim 1 , wherein an electromagnetic wave shielding performance due to a structure with the cured product and the plating layer provided on the surface of the cured product is 60 dB or more at a frequency of 100 MHz. 11. An inverter part comprising: the electromagnetic wave shielding housing according to claim 1 . 12. An air conditioner part comprising: the electromagnetic wave shielding housing according to claim 1 . 13. An automotive part comprising: the electromagnetic wave shielding housing according to claim 1 . 14. An electromagnetic wave shielding housing comprising: a cured product of a thermosetting resin composition, wherein the thermosetting resin composition is phenol resin composition; and a plating layer laminated on a surface of the cured product, wherein the phenol resin composition includes the following components (A) and (B); (A) a phenol resin including a resol-type phenol resin and a novolac-type phenol resin, and (B) core-shell-type elastomer particles, and an electromagnetic wave shielding performance due to a structure with the cured product and the plating layer is 40 dB or more at a frequency of 10 MHz. 15. The electromagnetic wave shielding housing according to claim 14 , wherein the electromagnetic wave shielding performance due to the structure with the cured product and the plating layer is 60 dB or more at a frequency of 100 MHz.

Assignees

Inventors

Classifications

  • Containers comprising an insulating or insulated base · CPC title

  • H05K9/0045Primary

    being rigid plastic containers having a coating of shielding material · CPC title

  • H05K9/003Primary

    made from non-conductive materials comprising an electro-conductive coating (H05K9/0031 takes precedence) · CPC title

  • comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition · CPC title

  • comprising a plurality of shielding layers; combining different shielding material structure · CPC title

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What does patent US11765872B2 cover?
A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105))…
Who is the assignee on this patent?
Sumitomo Bakelite Co
What technology area does this patent fall under?
Primary CPC classification H05K9/0045. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).