Right angle sidewall and button interconnects for molded SiPs

Patent metadata

Field	Value
Publication number	US-11765838-B2
Application number	US-202117407670-A
Country	US
Kind code	B2
Filing date	Aug 20, 2021
Priority date	Aug 20, 2021
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

First claim

What is claimed is:

1. An electronic module comprising:
a system-in-package including:
a routing substrate;
a first electronic component mounted on a first side of the routing substrate and encapsulated in a first molding compound layer;
a first lateral interconnect bonded to the first side of the routing substrate, wherein the first lateral interconnect extends through and is encapsulated in the first molding compound layer, and is exposed along a first side surface of the first molding compound layer; and

a flexible circuit mounted on the first side surface of the first molding compound layer, wherein a first landing pad of the flexible circuit is in electrical contact with the first lateral interconnect exposed along the first side surface of the first molding compound layer.

2. The electronic module of claim 1 , wherein the system-in-package further includes:
a second electronic component mounted on a second side of the routing substrate and encapsulated in a second molding compound layer; and
a second lateral interconnect bonded to the second side of the routing substrate, encapsulated in the second molding compound layer, and exposed along a second side surface of the second molding compound layer.

3. The electronic module of claim 2 , wherein the flexible circuit is mounted on the second side surface of the second molding compound layer, wherein a second landing pad of the flexible circuit is in electrical contact with the second lateral interconnect exposed along the second side surface of the second molding compound layer.

4. The electronic module of claim 1 , wherein the first lateral interconnect comprises a metal pin or wirebond wire.

5. The electronic module of claim 4 , wherein the first lateral interconnect has a maximum width of 25-75 μm where exposed along the first side surface of the first molding compound layer.

6. The electronic module of claim 4 , wherein the first lateral interconnect has a maximum width of 250-500 μm where exposed along the first side surface of the first molding compound layer.

7. The electronic module of claim 1 , wherein the first lateral interconnect comprises a metal stud bump.

8. The electronic module of claim 1 , wherein the first lateral interconnect comprises a solder bump.

9. The electronic module of claim 1 , wherein the flexible circuit is mounted on the first side surface of the first molding compound layer with a cured anisotropic conductive film.

10. The electronic module of claim 1 , wherein the flexible circuit is mounted on the first side surface of the first molding compound layer with a cured self-alignment paste.

11. The electronic module of claim 1 , wherein the flexible circuit is mounted on the first side surface of the first molding compound layer with a solder bump.

12. The electronic module of claim 1 , wherein the first lateral interconnect protrudes from first side surface of the first molding compound layer.

13. The electronic module of claim 12 , further comprising a solder material bonding the first lateral interconnect to the flexible circuit.

14. The electronic module of claim 1 , further comprising an integrated electronic component mounted on the flexible circuit, wherein the integrated electronic component is electrically connected with the routing substrate.

15. The electronic module of claim 14 , wherein the integrated electronic component comprises a sensor.

16. The electronic module of claim 15 , wherein the system-in-package and the flexible circuit are secured in a housing, and the sensor is oriented adjacent an opening in the housing.

Assignees

• Apple Inc

Inventors

• Kani Bilal Mohamed Ibrahim
• Ergun Ali N
• Renjan Kishore N
• Kim Kyusang
• Vadeentavida Manoj
• Grena Benjamin J
• Kindlon David M
• Hoang Lan H

Classifications

• H05K1/189 Primary

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K3/363 Primary

  by soldering · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/141

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title