Antenna package and image display device including the same

Patent metadata

Field	Value
Publication number	US-11764458-B2
Application number	US-202117526240-A
Country	US
Kind code	B2
Filing date	Nov 15, 2021
Priority date	Nov 17, 2020
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a first circuit board electrically connected to the antenna device. The first circuit board includes a first core layer, a first circuit wiring layer formed on one surface of the first core layer and electrically connected to the antenna unit, a first connector connected to an end portion of the first circuit wiring layer on the one surface of the first core layer, and a first shielding barrier disposed on the other surface opposite to the one surface of the first core layer. The first shielding barrier at least partially covers the first connector in a planar view.

First claim

What is claimed is:

1. An antenna package, comprising:
an antenna device comprising an antenna unit; and
a first circuit board electrically connected to the antenna device, the first circuit board comprising:
a first core layer;
a first circuit wiring layer formed on one surface of the first core layer and electrically connected to the antenna unit;
a first connector connected to an end portion of the first circuit wiring layer on the one surface of the first core layer; and
a first shielding barrier disposed on the other surface opposite to the one surface of the first core layer, the first shielding barrier at least partially covering the first connector in a planar view.

2. The antenna package of claim 1 , wherein the first circuit board further comprises a first ground layer disposed on the other surface of the first core layer to overlap the first circuit wiring layer in a planar view.

3. The antenna package of claim 2 , wherein a thickness of the first shielding barrier is greater than a thickness of the first ground layer.

4. The antenna package of claim 2 , wherein the first ground layer and the first shielding barrier are integrally connected.

5. The antenna package of claim 2 , wherein the antenna unit comprises a radiator, a transmission line extending from the radiator, a signal pad connected to a terminal portion of the transmission line, and a ground pad disposed around the signal pad and spaced apart from the transmission line and the signal pad.

6. The antenna package of claim 5 , wherein the first circuit wiring layer comprises an antenna signal wiring electrically bonded to the signal pad and a bonding ground pad electrically bonded to the ground pad, respectively.

7. The antenna package of claim 6 , wherein the first circuit board further comprises a first via structure passing through the first core layer and connecting the bonding ground pad and the first ground layer with each other.

8. The antenna package of claim 2 , wherein the first circuit board further comprises a first cover-lay film covering the first ground layer; and
the first shielding barrier is disposed on the first cover-lay film.

9. The antenna package of claim 1 , further comprising:
a second circuit board electrically coupled to the first circuit board through the first connector of the first circuit board; and
an antenna driving integrated circuit chip mounted on the second circuit board.

10. The antenna package of claim 9 , wherein the second circuit board comprises:
a second core layer;
a second connector mounted on one surface of the second core layer and coupled to the first connector;
a second circuit wiring layer connecting the second connector and the antenna driving IC chip with each other on the one surface of the second core layer; and
a second shielding barrier disposed on the other surface opposite to the one surface of the second core layer, the second shielding barrier at least partially covering the second connector in a planar view.

11. The antenna package of claim 10 , wherein the second circuit board further comprises a second ground layer disposed on the other surface of the second core layer to overlap the second circuit wiring layer in a planar view.

12. The antenna package of claim 11 , wherein a thickness of the second shielding barrier is greater than a thickness of the second ground layer.

13. The antenna package of claim 11 , wherein the second ground layer and the second shielding barrier are integrally connected.

14. The antenna package of claim 11 , wherein the second circuit board further comprises a second cover-lay film covering the second ground layer; and
the second shielding barrier is disposed on the second cover-lay film.

15. The antenna package of claim 10 , wherein the first connector and the second connector are coupled to each other to define a connector-combined structure, and the connector-combined structure is sandwiched by the first shielding barrier and the second shielding barrier.

16. The antenna package of claim 10 , wherein the first connector is a plug connector and the second connector is a receptacle connector.

17. The antenna package of claim 10 , wherein the first circuit board is a flexible printed circuit board and the second circuit board is a rigid printed circuit board.

18. An image display device, comprising:
a display panel; and
the antenna package of claim 1 disposed on the display panel.

19. The image display device of claim 18 , further comprising:
a main board disposed under the display panel; and
an antenna driving integrated circuit chip mounted on the main board,
wherein the antenna package is bent under the display panel and is coupled to the main board through the first connector to be electrically connected to the antenna driving integrated circuit chip.

Assignees

• Dongwoo Fine Chem Co Ltd

Inventors

• Choi Byung Jin
• Kim Na Yeon
• Kim Young Ju
• Ryu Han Sub

Classifications

• H01Q1/241 Primary

  used in mobile communications, e.g. GSM (H01Q1/247, H01Q1/248 take precedence) · CPC title

• H01Q1/22 Primary

  by structural association with other equipment or articles · CPC title

• H01Q1/38 Primary

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title