Holder for snap-fitting a thermal fuse to an electronic component

Patent metadata

Field	Value
Publication number	US-11764024-B2
Application number	US-202017437149-A
Country	US
Kind code	B2
Filing date	Mar 10, 2020
Priority date	Mar 12, 2019
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

The invention provides a holder for snap-fitting a thermal fuse to an electronic component, wherein the holder comprises: a bottom surface for mounting the holder to a carrier comprising the electronic component, wherein the bottom surface comprises an opening for accommodating the electronic component; a first wall parallel to a second wall, wherein the first wall and the second wall each comprise a protrusion for snap-fitting the thermal fuse to the electronic component; a third wall, wherein the third wall comprises an edge for bending around at least one lead of the thermal fuse, wherein a shortest distance between the bottom surface and said edge is larger than a shortest distance between the bottom surface and one of said protrusion.

First claim

The invention claimed is:

1. A holder for snap-fitting a thermal fuse to an electronic component, wherein the holder comprises:
a bottom surface for mounting the holder to a carrier comprising the electronic component, wherein the bottom surface comprises an opening for accommodating the electronic component;
a first wall parallel to a second wall, wherein the first wall and the second wall each comprise a protrusion for snap-fitting the thermal fuse to the electronic component;
a third wall, wherein the third wall comprises an edge for bending around at least one lead of the thermal fuse, wherein a shortest distance between the bottom surface and said edge is larger than a shortest distance between the bottom surface and one of said protrusion.

2. The holder according to claim 1 , wherein the first wall, the second wall and the third wall are perpendicular to the bottom surface and/or protrude from the bottom surface.

3. The holder according claim 1 , wherein said edge comprises at least one recess for bending around, respectively, the at least one lead of the thermal fuse.

4. The holder according to claim 1 , wherein the third wall comprises a ridge for isolating a first lead of the at least one lead of the thermal fuse from a second lead of the at least one lead of the thermal fuse.

5. The holder according to claim 1 , wherein the holder comprises a polymer material.

6. The holder according to claim 1 , wherein the electronic component is a MOSFET.

7. The holder according to claim 1 , wherein the holder comprises a soldering pin for mounting the holder to the carrier.

8. The holder according to claim 1 , wherein each of said protrusion comprises a bottom edge facing the bottom surface, wherein said bottom edge comprises a stepped profile.

9. The holder according to claim 1 , wherein said bottom surface comprises at least one hole for inserting, respectively, the at least one lead of the thermal fuse.

10. The holder according to claim 9 , wherein said at least one hole comprises a funnel shape.

11. The holder according to claim 1 , wherein the bottom surface comprises at least one protrusion for aligning, on the carrier, the holder relative to the electronic component.

12. An assembly for snap-fitting a thermal fuse to an electronic component, wherein the assembly comprises:
the holder according to claim 1 ;
the thermal fuse;
the carrier comprising the electronic component;
wherein the holder is mounted to the carrier so as the opening of the bottom surface of the holder accommodates the electronic component;
wherein the thermal fuse is snap-fitted to the electronic component between the first wall and the second wall;
wherein the thermal fuse comprises the at least one lead, wherein the at least one lead is bent around the edge of the third wall.

13. The carrier comprising the holder according to claim 1 .

14. A lighting device comprising the holder according to claim 1 .

Assignees

• Signify Holding Bv

Inventors

• Wang Zhipei
• Van Meurs Johannes Maria
• Verhoeven Mark Johannes Antonius
• Zhang Huan

Classifications

• H10W42/80

  protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60) · CPC title

• H01H37/043 Primary

  Mountings on controlled apparatus · CPC title

• H01H85/20 Primary

  Bases for supporting the fuse; Separate parts thereof · CPC title

• H01H37/04

  Bases; Housings; Mountings {(H01H37/5427 takes precedence)} · CPC title

• H01H2085/0283

  Structural association with a semiconductor device · CPC title