Stress measurement device, stress measurement system, and stress measurement method

US11761833B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11761833-B2
Application numberUS-202017085403-A
CountryUS
Kind codeB2
Filing dateOct 30, 2020
Priority dateApr 26, 2017
Publication dateSep 19, 2023
Grant dateSep 19, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.

First claim

Opening claim text (preview).

What is claimed is: 1. A stress data outputting method executed by at least one processor, the stress data outputting method comprising: outputting a stress data indicating pressure occurring in a target area of a region that is different from a predetermined area of the region based on: a first thermal data indicating temperature obtained from the target area, and a relational data generated by a relation between (1) a second thermal data indicating temperature obtained from the predetermined area of the region, and (2) a measured stress data measured in the predetermined area of the region, wherein the relational data is synchronized timewise with the first thermal data, and wherein the predetermined area is a location within and is smaller than the target area. 2. The stress data outputting method according to claim 1 , wherein the relational data is generated based on a difference between the second thermal data and the measured stress data. 3. The stress data outputting method according to claim 1 , wherein the relational data expresses a disturbance of the predetermined area of the region. 4. The stress data outputting method according to claim 1 , wherein the second thermal data and the measured stress data are obtained chronologically. 5. The stress data outputting method according to claim 1 , wherein the stress data is a stress waveform indicating the pressure occurring in the target area. 6. A stress data outputting method executed by at least one processor, the stress data outputting method comprising: obtaining, from an infrared camera, a first thermal data from a target area of a region; obtaining, from the infrared camera, a second thermal data from a predetermined area of the region, the predetermined area being different from the target area; measuring, by a laser displacement meter, a stress data in the predetermined area of the region; generating a relational data generated by a relation between the second thermal data, and the measured stress data, the relational data being synchronized timewise with the first thermal data; and outputting a target stress data occurring in the target area based on the first thermal data and the relational data. 7. The stress data outputting method according to claim 6 , wherein the relational data is generated based on a difference between the second thermal data and the measured stress data. 8. The stress data outputting method according to claim 6 , wherein the relational data expresses a disturbance of the predetermined area of the region. 9. The stress data outputting method according to claim 6 , wherein the second thermal data and the measured stress data are obtained chronologically. 10. The stress data outputting method according to claim 6 , wherein the predetermined area is a location within and is smaller than the target area. 11. The stress data outputting method according to claim 6 , wherein the first thermal data indicates temperature obtained from the target area, the second thermal data indicates temperature obtained from the predetermined area, and the target stress data is a stress waveform indicating pressure occurring in the target area.

Assignees

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Classifications

  • for generating image signals from visible and infrared light wavelengths · CPC title

  • G01M5/0008Primary

    of bridges · CPC title

  • G01L1/248Primary

    using infrared (G01L1/241, G01L1/242 take precedence) · CPC title

  • by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity (calorimeters per se G01K) · CPC title

  • Investigating presence of flaws · CPC title

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What does patent US11761833B2 cover?
A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller f…
Who is the assignee on this patent?
Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification G01M5/0008. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).