Contact layer on the surface of a metal element in relative movement against another metal element and an articulation joint provided with such a contact layer

US11761478B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11761478-B2
Application numberUS-202016905540-A
CountryUS
Kind codeB2
Filing dateJun 18, 2020
Priority dateJun 25, 2019
Publication dateSep 19, 2023
Grant dateSep 19, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A contact layer is formed by a deposition method on an inner surface of a first metal element by a centrifuging process, and preferably includes an inner layer of copper alloy and an outer layer of tin alloy. Such a contact layer is used in an articulation joint including a first metal element having a surface provided with the contact layer, and a second metal element with a second surface. The first and second elements are relatively movable such that first and second surfaces slide against each other.

First claim

Opening claim text (preview).

We claim: 1. A method of forming a contact layer on a surface of a first metal element, the surface being intended to be slidable against a surface of a second metal element, the method comprising the steps of: providing a copper alloy, a tin alloy and the first metal element formed of titanium or a titanium alloy and having an inner surface; inserting the first metal element into a mold without removal of oxidation from the inner surface such that the surface is spaced from the interior of the mold; introducing the copper alloy into the mold; rotating the mold such that the copper alloy is impregnated on the surface of the first element by centrifugal force to form a first layer on the surface; hardening the first layer on the first element; introducing the tin alloy into the mold; rotating the mold such that the tin alloy is impregnated on the first layer by centrifugal force to form a second, outer layer; and hardening the second layer on the first layer. 2. The method of claim 1 , wherein the step of providing the copper alloy includes providing a copper alloy having a copper content of between fifty percent (50%) by weight and ninety percent (90%) by weight. 3. The method of claim 1 further comprising the step of extracting the first metal element from the mold prior to the step of introducing the tin alloy into the mold. 4. The method of claim 1 wherein the first layer has a thickness of between one hundred micrometers (100 μm) and three hundred micrometers (300 μm) and the second layer has a thickness between two micrometers (2 μm) and twenty micrometers (20 μm).

Assignees

Inventors

Classifications

  • the female part of the joint being open on two sides · CPC title

  • F16C23/045Primary

    for radial load mainly, e.g. radial spherical plain bearings · CPC title

  • B22D13/04Primary

    of shallow solid or hollow bodies, e.g. wheels or rings, in moulds rotating around their axis of symmetry · CPC title

  • with linings · CPC title

  • the two co-operative parts each having both convex and concave interfaces · CPC title

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What does patent US11761478B2 cover?
A contact layer is formed by a deposition method on an inner surface of a first metal element by a centrifuging process, and preferably includes an inner layer of copper alloy and an outer layer of tin alloy. Such a contact layer is used in an articulation joint including a first metal element having a surface provided with the contact layer, and a second metal element with a second surface. Th…
Who is the assignee on this patent?
Skf Ab, Skf Aerospace France Sas
What technology area does this patent fall under?
Primary CPC classification F16C11/0614. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Sep 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).