Terminal material with silver coating film and terminal with silver coating film
US-2021158990-A1 · May 27, 2021 · US
Terminal material for connector
US11761109B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11761109-B2 |
| Application number | US-202117798659-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 28, 2021 |
| Priority date | Feb 20, 2020 |
| Publication date | Sep 19, 2023 |
| Grant date | Sep 19, 2023 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A terminal material for a connector comprising a base material in which at least a surface layer is made of copper or copper alloy; a nickel-plating layer made of nickel or nickel alloy and provided on a surface of the base material; a silver-nickel alloy plating layer made of silver-nickel alloy and provided on at least a part of the nickel-plating layer; and a silver-plating layer made of silver and provided on the silver-nickel alloy plating layer, wherein the silver-nickel alloy plating layer has 0.05 µm or more and less than 0.50 µm of a film thickness and 0.03 at% or more and 1.00 at% or less of nickel content. 2 . The terminal material for a connector according to claim 1 , wherein a film thickness of the silver-plating layer is 0.5 µm or more and 20.0 µm or less. 3 . The terminal material for a connector according to claim 2 , wherein the silver-plating layer is made of silver with purity 99.99% or more by mass except C, H, S, O, and N which are gas components. 4 . The terminal material for a connector according to claim 1 , wherein the silver-plating layer is made of silver with purity 99.99% or more by mass except C, H, S, O, and N which are gas components.
Assignees
Inventors
Classifications
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11761109B2 cover?
- A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silv…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification H01R13/03. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).