Forming three-dimensional (3D) electronic parts

US11760010B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11760010-B2
Application numberUS-202117561425-A
CountryUS
Kind codeB2
Filing dateDec 23, 2021
Priority dateJul 27, 2016
Publication dateSep 19, 2023
Grant dateSep 19, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming three-dimensional (3D) printed electronic parts, the method comprising: applying a build material; selectively applying an activating agent in a plurality of passes on a portion of the build material, wherein the activating agent includes a metal salt; selectively applying an electronic agent in a plurality of passes on the portion of the build material, wherein the electronic agent includes a nanomaterial that is activatable by the metal salt; selectively applying a fusing agent on the portion of the build material; exposing the build material to radiation in a plurality of heating events; wherein: during at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer; and the region of the layer exhibits an electronic property; and controlling an order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events to control a mechanical property of the layer and the electronic property of the region. 2. The method as defined in claim 1 , wherein: the portion of the build material is less than all of the build material; the method further comprises: selectively applying the fusing agent on an other portion of the build material; and selectively applying a detailing agent on the other portion of the build material; during at least one of the plurality of heating events, the other portion of the build material in contact with the fusing agent fuses to form a remaining region of the layer; and the detailing agent controls a maximum temperature at which the other portion of the build material fuses. 3. The method as defined in claim 1 , wherein: the portion of the build material is less than all of the build material; the method further comprises selectively applying a detailing agent on an other portion of the build material; the detailing agent controls a maximum temperature that the other portion of the build material achieves; and the other portion of the build material in contact with the detailing agent does not fuse. 4. The method as defined in claim 1 , wherein the selectively applying of the electronic agent in the plurality of passes, the selectively applying of the fusing agent, and the exposing of the build material to radiation in the plurality of heating events occur prior to an application of additional build material. 5. The method as defined in claim 1 , further comprising cooling the build material to a threshold temperature after at least one of the plurality of heating events and prior to at least one other of the plurality of heating events. 6. The method as defined in claim 5 , wherein the build material is a polymeric build material, a ceramic build material, a metallic build material, or a composite build material, and the threshold temperature ranges from about 10° C. to about 100° C. below a melting point the build material. 7. The method as defined in claim 2 , wherein each of the selectively applying of the activating agent, the selectively applying of the electronic agent, the selectively applying of the fusing agent, and the selectively applying of the detailing agent is accomplished in at least one of the plurality of passes by thermal inkjet printing, piezoelectric inkjet printing, or continuous inkjet printing. 8. The method as defined in claim 7 , wherein: at least one of the plurality of heating events is accomplished prior to at least one of the selectively applying of the electronic agent or the selectively applying of the fusing agent; and at least one other heating event of the plurality of heating events is accomplished subsequent to the at least one of the plurality of passes. 9. The method as defined in claim 2 , wherein the detailing agent is tinted with a colorant. 10. A method for forming three-dimensional (3D) printed electronic parts, the method comprising: applying a build material; selectively applying an electronic agent in a plurality of passes on a portion of the build material, wherein the electronic agent includes a nanomaterial that is activatable by a metal salt; selectively applying an activating agent in a plurality of passes on the portion of the build material, wherein the activating agent includes the metal salt; exposing the build material to radiation in a plurality of heating events; wherein: during at least one of the plurality of heating events, the portion of the build material in contact with the electronic agent and the activating agent fuses to form a region of a layer; and the region of the layer exhibits an electronic property; and controlling an order of each of the plurality of passes and the plurality of heating events to control a mechanical property of the layer and the electronic property of the region. 11. The method as defined in claim 10 , wherein: the portion of the build material is less than all of the build material; the method further comprises: selectively applying a fusing agent on an other portion of the build material; and selectively applying a detailing agent on the other portion of the build material; during at least one of the plurality of heating events, the other portion of the build material in contact with the fusing agent fuses to form a remaining region of the layer; and the detailing agent controls a maximum temperature at which the other portion of the build material fuses. 12. The method as defined in claim 10 , wherein the metal salt includes a chloride salt, a bromide salt, or an iodide salt.

Assignees

Inventors

Classifications

  • B29C64/165Primary

    using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber · CPC title

  • Processes of additive manufacturing · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Materials specially adapted for additive manufacturing · CPC title

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What does patent US11760010B2 cover?
In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of t…
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B29C64/165. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).