Techniques for measuring depth and polarization from a single sensor

Patent metadata

Field	Value
Publication number	US-11758109-B2
Application number	US-202117164679-A
Country	US
Kind code	B2
Filing date	Feb 1, 2021
Priority date	Feb 1, 2021
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

In some embodiments, an image sensor is provided. The image sensor comprises a plurality of photodiodes arranged as a photodiode array. The photodiodes of the photodiode array are arranged into a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant. A first polarization filter and a first telecentric lens are aligned with the first quadrant. A second polarization filter and a second telecentric lens are aligned with the second quadrant. A third polarization filter and a third telecentric lens are aligned with the third quadrant. A fourth telecentric lens is aligned with the fourth quadrant.

First claim

What is claimed is:

1. An image sensor, comprising:
a plurality of photodiodes arranged as a photodiode array, wherein the photodiodes of the photodiode array are arranged into a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant;
a first polarization filter and a first telecentric lens aligned with the first quadrant;
a second polarization filter and a second telecentric lens aligned with the second quadrant;
a third polarization filter and a third telecentric lens aligned with the third quadrant; and
a fourth telecentric lens aligned with the fourth quadrant.

2. The image sensor of claim 1 , further comprising computing circuitry configured to:
process signals from at least the photodiodes of the first quadrant, the photodiodes of the second quadrant, and the photodiodes of the third quadrant to obtain polarization information;
process the polarization information to obtain a set of ambiguous surface normals;
process signals from the plurality of photodiodes to obtain depth information; and
process the set of ambiguous surface normals using the depth information to obtain a three-dimensional image shape.

3. The image sensor of claim 2 , wherein processing the signals from the plurality of photodiodes to obtain the depth information includes processing signals from at least one pair of the quadrants of the photodiode array as a stereo camera system.

4. The image sensor of claim 2 , wherein the plurality of photodiodes includes a plurality of time-of-flight photodiodes, and wherein processing the signals from the plurality of photodiodes to obtain the depth information includes processing the signals from the plurality of time-of-flight photodiodes to obtain the depth information.

5. The image sensor of claim 2 , further comprising a plurality of microlenses arranged over groups of photodiodes of the fourth quadrant, and wherein processing the signals from the plurality of photodiodes to obtain the depth information includes comparing electrical signals between photodiodes that have a common corresponding microlens.

6. The image sensor of claim 2 , wherein the computing circuitry is further configured to:
process signals from the photodiodes of the fourth quadrant to obtain a two-dimensional image.

7. The image sensor of claim 1 , wherein at least one of the first polarization filter, the second polarization filter, and the third polarization filter is a polymer film.

8. The image sensor of claim 1 , wherein at least one of the first polarization filter, the second polarization filter, and the third polarization filter is a wire grid.

9. The image sensor of claim 1 , further comprising a fourth polarization filter aligned with the fourth quadrant.

10. The image sensor of claim 1 , wherein the plurality of photodiodes includes a plurality of non-isolated image sensors.

11. The image sensor of claim 10 , wherein the plurality of non-isolated image sensors includes front-side illumination photodiodes.

12. The image sensor of claim 10 , wherein the plurality of non-isolated image sensors includes back-side illumination photodiodes without deep trench isolation structures.

13. The image sensor of claim 10 , wherein the plurality of non-isolated image sensors includes back-side illumination photodiodes with partial deep trench isolation structures.

14. The image sensor of claim 1 , wherein at least one of the first telecentric lens, the second telecentric lens, and the third telecentric lens is a double plano-convex lens.

15. The image sensor of claim 1 , wherein polarization angles of the first polarization filter, the second polarization filter, and the third polarization filter are separated by 45 degrees.

16. A controller comprising computing circuitry configured to:
receive signals from a plurality of photodiodes of a photodiode array of an image sensor, wherein the photodiodes of the photodiode array are arranged in a first quadrant associated with a first polarization filter and a first set of photodiodes from the plurality of photodiodes, a second quadrant associated with a second polarization filter and a second set of photodiodes from the plurality of photodiodes, a third quadrant associated with a third polarization filter and a third set of photodiodes from the plurality of photodiodes, and a fourth quadrant associated with a fourth set of photodiodes from the plurality of photodiodes;
process the signals from the photodiodes of the first quadrant, the second quadrant, and the third quadrant to obtain polarization information;
process the polarization information to obtain a set of ambiguous surface normals;
process signals from the plurality of photodiodes to obtain depth information; and
process the set of ambiguous surface normals using the depth information to obtain a three-dimensional image shape.

17. The controller of claim 16 , wherein processing the signals from the plurality of photodiodes to obtain the depth information includes processing signals from at least one pair of quadrants of the photodiode array as a stereo camera system.

18. The controller of claim 16 , wherein the plurality of photodiodes includes a plurality of time-of-flight photodiodes, and wherein processing the signals from the plurality of photodiodes to obtain the depth information includes processing the signals from the plurality of time-of-flight photodiodes to obtain the depth information.

19. The controller of claim 16 , wherein the image sensor comprises a plurality of microlenses arranged over groups of photodiodes of the fourth quadrant, and wherein processing the signals from the plurality of photodiodes to obtain the depth information includes comparing electrical signals between photodiodes that have a common corresponding microlens.

20. The controller of claim 16 , wherein the computing circuitry is further configured to:
process signals from the photodiodes of the fourth quadrant to obtain a two-dimensional image.

Assignees

• Omnivision Tech Inc

Inventors

• Chen Wenshou
• Ren Yiyi
• Liu Guansong
• Padmanabhan Badri
• Bonakdar Alireza
• Mann Richard

Classifications

• H10F39/807

  Pixel isolation structures · CPC title

• H10F39/8063 Primary

  Microlenses · CPC title

• H04N13/218 Primary

  using spatial multiplexing · CPC title

• G01S7/499

  using polarisation effects · CPC title

• G01S17/894

  Three-dimensional [3D] imaging with simultaneous measurement of time-of-flight at a two-dimensional [2D] array of receiver pixels, e.g. time-of-flight cameras or flash lidar · CPC title