Apparatus for antenna impedance-matching and associated methods

Patent metadata

Field	Value
Publication number	US-11757190-B2
Application number	US-202217705257-A
Country	US
Kind code	B2
Filing date	Mar 25, 2022
Priority date	Aug 29, 2016
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

An apparatus includes a module, which includes an impedance matching circuit. The apparatus further includes a capacitor that is external to the module, and is coupled to the impedance matching circuit. The apparatus further includes a loop antenna to transmit or receive the RF signals. The loop antenna is coupled to the capacitor.

First claim

The invention claimed is:

1. An apparatus comprising:
a module, comprising a first portion of an impedance matching circuit;
a substrate coupled to the module, the substrate comprising a second portion of the impedance matching circuit;
a first capacitor external to the module and coupled to the second portion of the impedance matching circuit; and
a loop antenna to transmit or receive the RF signals, wherein the loop antenna is coupled to the first capacitor.

2. The apparatus according to claim 1 , wherein the module further comprises a radio frequency (RF) circuit to transmit or receive RF signals.

3. The apparatus according to claim 2 , further comprising a second capacitor external to the module and coupled to the RF circuit and to the first portion of the impedance matching circuit.

4. The apparatus according to claim 1 , wherein a capacitance value of the first capacitor is tuned depending on a loop size of the loop antenna.

5. The apparatus according to claim 1 , wherein the impedance matching circuit comprises a resonant network coupled to a reactive network.

6. The apparatus according to claim 1 , wherein the impedance matching circuit comprises a first reactive network coupled to a second reactive network.

7. The apparatus according to claim 1 , wherein the loop antenna comprises a conductive loop of the substrate, and wherein the module and the first capacitor are attached to the substrate.

8. The apparatus according to claim 1 , wherein the first and second parts of the impedance matching circuit form a matching circuit.

9. The apparatus according to claim 8 , wherein the matching circuit comprises lumped reactive components.

10. The apparatus according to claim 9 , wherein some of the lumped reactive components of the matching circuit are included in the module.

11. The apparatus according to claim 9 , wherein some of the lumped reactive components of the matching circuit are coupled to conductive traces or patterns included in the substrate.

12. A method of forming an apparatus using a module that includes a first portion of an impedance matching circuit, the method comprising:
providing a substrate coupled to the module, the substrate comprising a second portion of the impedance matching circuit;
attaching to the module a first capacitor external to the module, wherein the first capacitor is coupled to the second portion of the impedance matching circuit; and
forming a loop antenna to transmit or receive the RF signals, wherein the loop antenna is coupled to the first capacitor.

13. The method according to claim 12 , wherein the module further comprises a radio frequency (RF) circuit to transmit or receive RF signals.

14. The method according to claim 13 , further comprising coupling to the module a second capacitor external to the module, wherein the second capacitor is coupled to the RF circuit and to the first portion of the impedance matching circuit.

15. The method according to claim 12 , wherein a capacitance value of the first capacitor is tuned depending on a loop size of the loop antenna.

16. The method according to claim 12 , wherein impedance matching circuit comprises a resonant network coupled to a reactive network.

17. The method according to claim 12 , wherein the impedance matching circuit comprises a first reactive network coupled to a second reactive network.

18. The method according to claim 12 , wherein the loop antenna comprises a conductive loop of the substrate, the method further comprising attaching the module and the first capacitor to the substrate.

19. The method according to claim 12 , wherein the first and second parts of the impedance matching circuit form a matching circuit.

20. The method according to claim 19 , wherein the matching circuit comprises lumped reactive components.

21. The method according to claim 20 , wherein some of the lumped reactive components of the matching circuit are included in the module and wherein some of the lumped reactive components of the matching circuit are coupled to conductive traces or patterns included in the substrate.

Assignees

• Silicon Lab Inc

Inventors

• Voor Thomas E
• Zolomy Attila
• Rahikkala Pasi

Classifications

• H01Q7/00 Primary

  Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title

• H01Q7/005 Primary

  with variable reactance for tuning the antenna · CPC title

• H01Q1/2291

  used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN] (H01Q1/241 takes precedence; WLAN in general H04W) · CPC title

• H03H7/38

  Impedance-matching networks · CPC title

• H03H7/40

  Automatic matching of load impedance to source impedance · CPC title