Apparatus with partitioned radio frequency antenna and matching network and associated methods

US11757188B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11757188-B2
Application numberUS-202217705247-A
CountryUS
Kind codeB2
Filing dateMar 25, 2022
Priority dateAug 29, 2016
Publication dateSep 12, 2023
Grant dateSep 12, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus includes a radio frequency (RF) circuit to transmit or receive RF signals. The apparatus further includes a loop antenna to transmit or receive the RF signals. The apparatus further includes an impedance matching circuit coupled to the RF circuit and to the loop antenna. The impedance matching circuit includes lumped reactive components.

First claim

Opening claim text (preview).

The invention claimed is: 1. An apparatus comprising: a module comprising: an RF circuit to transmit or receive RF signals; and a first portion of an impedance matching circuit coupled to the RF circuit; and a first substrate coupled to the module, the first substrate comprising a second portion of the impedance matching circuit. 2. The apparatus according to claim 1 , wherein the first portion of the impedance matching circuit comprises a first set of one or more lumped reactive components. 3. The apparatus according to claim 2 , wherein the second portion of the impedance matching circuit comprises a second set of one or more lumped reactive components. 4. The apparatus according to claim 3 , wherein the first and second portions of the impedance matching circuit form a matching circuit. 5. The apparatus according to claim 4 , wherein the matching circuit comprises lumped reactive components. 6. The apparatus according to claim 5 , wherein some of the lumped reactive components of the matching circuit are included in the module. 7. The apparatus according to claim 5 , wherein some of the lumped reactive components of the matching circuit are coupled to conductive traces or patterns included in the first substrate. 8. The apparatus according to claim 1 , wherein the first substrate further comprises a loop antenna. 9. The apparatus according to claim 8 , wherein the loop antenna comprises a conductive loop of the first substrate. 10. The apparatus according to claim 1 , wherein the module comprises a second substrate, and wherein the RF circuit and the first portion of the impedance matching circuit are coupled to the second substrate. 11. A method of forming a circuit arrangement for an RF apparatus using a module that includes an RF circuit to transmit or receive RF signals and a first portion of an impedance matching circuit coupled to the RF circuit, the method comprising forming a second portion of the impedance matching circuit in a first substrate, wherein the first substrate is coupled to the module. 12. The method according to claim 11 , wherein the first portion of the impedance matching circuit comprises a first set of one or more lumped reactive components. 13. The method according to claim 12 , wherein the second portion of the impedance matching circuit comprises a second set of one or more lumped reactive components. 14. The method according to claim 13 , wherein the first and second portions of the impedance matching circuit form a matching circuit. 15. The method according to claim 14 , wherein the matching circuit comprises lumped reactive components. 16. The method according to claim 15 , wherein some of the lumped reactive components of the matching circuit are included in the module. 17. The method according to claim 15 , wherein some of the lumped reactive components of the matching circuit are coupled to conductive traces or patterns included in the first substrate. 18. The method according to claim 11 , further comprising forming a loop antenna using the first substrate. 19. The method according to claim 18 , wherein the loop antenna comprises a conductive loop of the first substrate. 20. The method according to claim 11 , wherein the module comprises a second substrate, and the method further comprises coupling the RF circuit and the first portion of the impedance matching circuit to the second substrate.

Assignees

Inventors

Classifications

  • H01Q7/00Primary

    Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title

  • Length of element or elements adjustable (telescopic elements H01Q1/10) · CPC title

  • used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal · CPC title

  • Antennas with active circuits or circuit elements integrated within them or attached to them · CPC title

  • Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

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Frequently asked questions

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What does patent US11757188B2 cover?
An apparatus includes a radio frequency (RF) circuit to transmit or receive RF signals. The apparatus further includes a loop antenna to transmit or receive the RF signals. The apparatus further includes an impedance matching circuit coupled to the RF circuit and to the loop antenna. The impedance matching circuit includes lumped reactive components.
Who is the assignee on this patent?
Silicon Lab Inc
What technology area does this patent fall under?
Primary CPC classification H01Q7/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 12 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).