System for tear analysis of films

US11754479B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11754479-B2
Application numberUS-201816630746-A
CountryUS
Kind codeB2
Filing dateApr 30, 2018
Priority dateJul 31, 2017
Publication dateSep 12, 2023
Grant dateSep 12, 2023

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method and a system for analyzing a physical characteristic of a film sample are described herein. The system includes a material holder system configured to hold the film sample; and a tear analysis device configured to tear the film sample and measure a characteristic of the tear. The movable system is configured to move the film sample in the material holder system to the tear analysis device.

First claim

Opening claim text (preview).

The invention claimed is: 1. A system for analyzing a physical characteristic of a film sample, the system comprising: a material holder system configured to hold the film sample; and a tear analysis device configured to tear the film sample by stretching the film sample and measure a characteristic of the tear; a cutter configured to cut the film sample into a plurality of film specimens, wherein a movable system is configured to move the film sample in the material holder system to the tear analysis device, the cutter comprises a film support plate configured to hold the film sample during cutting, and a pressure plate configured to press the film sample against the film support plate, wherein one of the film support plate and the pressure plate defines one or more tongues and the other of the film support plate and the pressure plate defines one or more grooves that mate with the one or more tongues, and wherein the film sample is held between film support plate and the pressure plate during cutting. 2. The system of claim 1 , wherein the movable system comprises an articulating-arm robotic arm system. 3. The system of claim 1 , wherein the movable system is configured to move the film sample to the cutter, and to move the plurality of film specimens from the cutter to at least one of a material thickness measurement system, a material image analyzer system, and the tear analysis device. 4. The system of claim 1 , wherein the material holder system includes a vacuum suction system configured to hold the film sample and film specimens through vacuum suction. 5. The system of claim 1 , further comprising a material thickness measurement system configured to measure a thickness of the film sample. 6. The system of claim 1 , wherein the material thickness measurement system comprises a probe configured to measure a thickness of the film sample over a spread area to avoid puncturing the film sample during the measurement. 7. The system of claim 1 , wherein the cutter comprises a first linear actuator in connection with a first blade for cutting the film sample in a first direction, and a second linear actuator in connection with a second blade for cutting the film sample in a second direction transverse to the first direction. 8. The system of claim 1 , wherein the tear analysis device comprises: a fixed clamp station that holds a first portion of the film sample or one of the plurality of film specimens; and a movable clamp that holds a second portion of the film sample or the one of the plurality of film specimens. 9. The system of claim 8 , further comprising a robotic arm that moves the movable clamp with respect to the fixed clamp station. 10. The system of claim 8 , further comprising a force sensor associated with one of the fixed clamp station and the movable clamp. 11. The system of claim 8 , further comprising at least one blade configured to cut a slit in the film sample or film specimen, the at least one blade located between a gripper of the fixed clamp station and the movable clamp. 12. The system of claim 1 , further comprising a material image analyzer system configured to detect a defect in the film sample. 13. A method for analyzing a physical characteristic of a film sample, the method comprising: holding the film sample by a material holder system connected to a movable system; moving the film sample by the movable system to a cutter; cutting the film sample into at least two smaller film species using the cutter; moving the film sample using the movable system to a tear analysis device; and tearing the film sample by stretching the film sample and measuring a characteristic of the tear using the tear analysis device; wherein the cutter comprises a film support plate configured to hold the film sample during cutting and a pressure plate configured to press the film sample against the film support plate, wherein one of the film support plate and the pressure plate defines one or more tongues, and wherein the film sample is held between the film support plate and the pressure plate during cutting. 14. The method of claim 13 , wherein testing the physical characteristic of the film sample comprises: holding a first portion of the film sample or film specimen using a fixed clamp; holding a second portion of the film sample film specimen using a movable arm; and moving the movable arm to tear the film sample or film specimen. 15. The method of claim 14 , further comprising cutting a slit in the film sample or the film specimen between the first portion and the second portion using a slitter blade. 16. The method of claim 13 , further comprising: moving the film sample by the movable system to a material thickness measurement system; and measuring a thickness of the film sample using the material thickness measurement system. 17. The method of claim 13 , further comprising: moving the film sample by the movable system to a material image analyzer system; and detecting a defect in the film sample using the material image analyzer system.

Assignees

Inventors

Classifications

  • G01N3/08Primary

    by applying steady tensile or compressive forces (G01N3/28 takes precedence) · CPC title

  • Paper sheets · CPC title

  • Fabric or woven textiles · CPC title

  • Resins; Plastics; Rubber; Leather · CPC title

  • Crack, flaws, fracture or rupture · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11754479B2 cover?
A method and a system for analyzing a physical characteristic of a film sample are described herein. The system includes a material holder system configured to hold the film sample; and a tear analysis device configured to tear the film sample and measure a characteristic of the tear. The movable system is configured to move the film sample in the material holder system to the tear analysis dev…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification G01N3/08. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 12 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).