Sealant film, laminate film, and packaging material

US11752747B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11752747-B2
Application numberUS-202218068577-A
CountryUS
Kind codeB2
Filing dateDec 20, 2022
Priority dateJan 27, 2022
Publication dateSep 12, 2023
Grant dateSep 12, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C). The release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C). The heat seal resin layer (D) contains an ethylene resin (d1).

First claim

Opening claim text (preview).

What is claimed is: 1. A sealant film comprising a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) that are laminated, wherein the adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2), the release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C), the release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C), and the heat seal resin layer (D) contains an ethylene resin (d1). 2. The sealant film according to claim 1 , wherein the heat seal resin layer (D) contains 0 to 80% by mass of a thermoplastic elastomer (d2) in a resin component contained in the heat seal resin layer (D), and a percentage of the ethylene ionomer (c2) and the thermoplastic elastomer (d2) as expressed by the following formula is 10 to 60%: [(( Wc 2/ Wct )×100)+(( Wd 2/ Wdt )×100)]/2 where Wct is a total amount (mass) of the resin component contained in the release resin layer (C), Wc2 is an amount (mass) of the ethylene ionomer (c2) in the resin component contained in the release resin layer (C), Wdt is a total amount (mass) of the resin component contained in the heat seal resin layer (D), and Wd2 is an amount (mass) of the thermoplastic elastomer (d2) in the resin component contained in the heat seal resin layer (D). 3. The sealant film according to claim 1 , wherein the thermoplastic elastomer (b1) contained in the adhesive resin layer (B) is at least one selected from styrene elastomers, ethylene elastomers, and propylene elastomers. 4. The sealant film according to claim 1 , wherein the surface resin layer (A) is a resin layer containing an olefin resin as a main resin component. 5. The sealant film according to claim 1 , wherein the sealant film is resealable after peeled at an interface between the adhesive resin layer (B) and the release resin layer (C). 6. The sealant film according to claim 1 , wherein a seal strength after resealing that is measured after the sealant film is heat-sealed and then peeled, pressure-bonded again at 23° C. and 0.2 MPa for a sealing time of 1 second, and then left for 5 minutes at 23° C. and 50% RH is 2 N/15 mm or more. 7. The sealant film according to claim 1 , wherein the film has a total thickness of 10 to 100 μm. 8. A laminate film comprising the sealant film according to claim 1 . 9. A packaging material comprising the sealant film according to claim 1 . 10. The packaging material according to claim 9 , wherein the packaging material is used for sealing an opening of a container having the opening mainly composed of an ethylene resin.

Assignees

Inventors

Classifications

  • B32B27/08Primary

    of synthetic resin · CPC title

  • B32B27/32Primary

    comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

  • Heat-shrinkability · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • permitting easy separation · CPC title

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Frequently asked questions

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What does patent US11752747B2 cover?
A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mo…
Who is the assignee on this patent?
Dainippon Ink & Chemicals
What technology area does this patent fall under?
Primary CPC classification B32B27/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 12 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).