High-frequency module

US11749873B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11749873-B2
Application numberUS-201917312046-A
CountryUS
Kind codeB2
Filing dateNov 27, 2019
Priority dateDec 11, 2018
Publication dateSep 5, 2023
Grant dateSep 5, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A plurality of waveguide structures are loaded on a top surface opposed to a bottom surface of a metal case, on which a high-frequency circuit is mounted, a height, a width, and a length of each of the plurality of waveguide structures have dimensions corresponding to a quarter-wave of a cutoff frequency indicating a frequency band of a target electromagnetic wave to be blocked, and a width and a length of each of the plurality of waveguide structures have dimensions that allow only a high-frequency wave of a mode to propagate in the frequency band.

First claim

Opening claim text (preview).

The invention claimed is: 1. A high-frequency module comprising: a metal case including a hollow rectangular box, the metal case being configured to house a high-frequency circuit in an interior space of the hollow rectangular box; and a plurality of waveguide structures on a top surface of the metal case, the top surface of the metal case being opposed to the interior space and disposed over a bottom surface of the metal case, the bottom surface of the metal case being configured to attach the high-frequency circuit, wherein a height of each of the plurality of waveguide structures has a dimension corresponding to a quarter-wave of a cutoff frequency indicating a frequency band of a target electromagnetic wave to be blocked, and wherein a width and a length of each of the plurality of waveguide structures have dimensions that allow only a high-frequency wave of a TE 10 mode to propagate in the frequency band. 2. The high-frequency module according to claim 1 , wherein the plurality of waveguide structures are on the top surface in a row at a smaller interval than the quarter-wave along a second direction orthogonal to a first direction in which the target electromagnetic wave propagates. 3. The high-frequency module according to claim 1 , wherein the plurality of waveguide structures are on the top surface in an array at a smaller interval than the quarter-wave along a first direction in which the target electromagnetic wave propagates and a second direction orthogonal to the first direction. 4. The high-frequency module according to claim 3 , wherein the plurality of waveguide structures arranged in one or more rows of the array along the second direction have a height corresponding to a quarter-wave of an individual cutoff frequency. 5. A high-frequency module comprising: a metal case including a hollow rectangular box; a high-frequency circuit housed in an interior of the hollow rectangular box, wherein the high-frequency circuit is mounted to a first surface of the metal case; and a plurality of waveguide structures on a second surface of the metal case opposite the interior of the hollow rectangular box and disposed above the first surface of the metal case, wherein a height of each of the plurality of waveguide structures has a dimension corresponding to a quarter-wave of a cutoff frequency indicating a frequency band of a target electromagnetic wave to be blocked. 6. The high-frequency module of claim 5 , wherein a width and a length of each of the plurality of waveguide structures have dimensions that allow only a high-frequency wave of a TE 10 mode to propagate in the frequency band. 7. The high-frequency module of claim 5 , wherein the plurality of waveguide structures are disposed in a row at a smaller interval than the quarter-wave along a second direction orthogonal to a first direction in which the target electromagnetic wave propagates. 8. The high-frequency module of claim 5 , wherein the plurality of waveguide structures are disposed in an array at a smaller interval than the quarter-wave along a first direction in which the target electromagnetic wave propagates and a second direction orthogonal to the first direction. 9. The high-frequency module of claim 8 , wherein the plurality of waveguide structures arranged in one or more rows of the array along the second direction have a height corresponding to a quarter-wave of an individual cutoff frequency.

Assignees

Inventors

Classifications

  • H01P1/207Primary

    Hollow waveguide filters (H01P1/212, H01P1/213, H01P1/215, H01P1/219 take precedence) · CPC title

  • Waffle-iron filters; Corrugated structures · CPC title

  • with a complex or stepped cross-section, e.g. ridged or grooved waveguides (H01P3/14 takes precedence) · CPC title

  • Cavity resonators · CPC title

  • Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) · CPC title

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Frequently asked questions

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What does patent US11749873B2 cover?
A plurality of waveguide structures are loaded on a top surface opposed to a bottom surface of a metal case, on which a high-frequency circuit is mounted, a height, a width, and a length of each of the plurality of waveguide structures have dimensions corresponding to a quarter-wave of a cutoff frequency indicating a frequency band of a target electromagnetic wave to be blocked, and a width and…
Who is the assignee on this patent?
Nippon Telegraph & Telephone
What technology area does this patent fall under?
Primary CPC classification H01P1/207. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 05 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).