Apparatus and method for manufacturing assembly having multiple separated conductors embedded within a substrate

Patent metadata

Field	Value
Publication number	US-11749427-B2
Application number	US-202117319686-A
Country	US
Kind code	B2
Filing date	May 13, 2021
Priority date	May 15, 2018
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

An apparatus includes an extruding device configured to dispense a dielectric material though an orifice, a wire feed device configured to feed a conductive wire through the orifice, and a cutting device configured to sever the wire. It also includes an electronic controller configured to control the extruding device, the wire feed device, and the cutting device. The electronic controller commands the extruding device to dispense the dielectric material though the orifice, the wire feed device to feed the wire through the orifice, and the cutting device to sever the wire, thereby forming a dielectric substrate encasing a plurality of wires. The electronic controller further commands the extruding device to form an opening defined in the substrate in which plurality of electrically conductive wires is exposed and a location feature on the substrate located with a positional tolerance less than or equal to 1 mm relative to the opening.

First claim

We claim:

1. An apparatus, comprising;
an extruding device configured to selectively dispense a dielectric material though an orifice;
a wire feed device configured to selectively feed a conductive wire through the orifice;
a cutting device configured to selectively sever the conductive wire after it is fed through the orifice; and
an electronic controller configured to control the extruding device, the wire feed device, and the cutting device, wherein the electronic controller commands the extruding device to selectively dispense the dielectric material though the orifice, the wire feed device to selectively feed the conductive wire through the orifice, and the cutting device to selectively sever the conductive wire, thereby forming a dielectric substrate encasing the conductive wire, wherein the electronic controller further commands the extruding device to form an opening defined in the substrate in which a plurality of electrically conductive wires is exposed and a fiducial mark in the form of an object placed in the substrate configured to use as a point of reference for an automated assembly robot to determine a location of the opening relative to the object, wherein a position tolerance of the opening relative to the object is 1 millimeter or less.

2. The apparatus according to claim 1 , further comprising:
a curved surface upon which the extruding device dispenses the dielectric material.

3. The apparatus according to claim 2 , further comprising:
a cooling device configured to cool a portion of the curved surface, wherein the electronic controller commands the cooling device to selectively cool the portion of the curved surface.

4. The apparatus according to claim 2 , further comprising:
a heating device configured to heat a portion of the curved surface, wherein the electronic controller commands the heating device to selectively heat the portion of the curved surface.

5. The apparatus according to claim 1 , wherein the fiducial mark is selected from a list consisting of an edge of the substrate, a corner of the substrate, a notch in the substrate, a slot in the substrate, and a hole in the substrate.

6. A method of forming a wiring harness assembly, comprising:
selectively dispensing a dielectric material though an orifice in a dispensing head of an extruding device;
selectively feeding a conductive wire through the orifice by operating a wire feed device;
forming a plurality of electrically conductive wires by operating the wire feed device and selectively severing the conductive wire by operating a cutting device;
forming a substrate of the dielectric material encasing the plurality of electrically conductive wires by operating the extruding device;
forming an opening in the substrate having a predetermined size and shape in which a portion of plurality of electrically conductive wires is exposed by operating the extruding device; and
forming a fiducial mark in the substrate by operating the extruding device, wherein the fiducial mark in the form of an object placed in the substrate configured to use as a point of reference for an automated assembly robot to determine a location of the opening relative to the object, wherein a position tolerance of the opening relative to the object is 1 millimeter or less.

7. The method according to claim 6 , further comprising selectively dispensing the dielectric material onto a curved surface by operating the extruding device.

8. The method according to claim 7 , further comprising selectively cooling a portion of the curved surface.

9. The method according to claim 7 , further comprising selectively heating a portion of the curved surface.

10. The method according to claim 6 , wherein the fiducial mark is selected from a list consisting of an edge of the substrate, a corner of the substrate, a notch in the substrate, a slot in the substrate, and a hole in the substrate.

11. A non-transitory computer readable storage medium having data stored therein representing software executable by a computer, the software including instructions to:
command an extruding device to selectively dispense a dielectric material though an orifice;
command a wire feed device to selectively feed a conductive wire through the orifice;
command a cutting device to selectively sever the conductive wire, thereby forming a dielectric substrate encasing a plurality of electrically conductive wires; and
command the extruding device to form an opening in the substrate in which the plurality of electrically conductive wires is exposed and a fiducial mark in the form of an object placed in the substrate configured to use as a point of reference for an automated assembly robot to determine a location of the opening relative to the object, wherein a position tolerance of the opening relative to the object is 1 millimeter or less.

12. The non-transitory computer readable storage medium according to claim 11 , the software further including instructions to:
command the extruding device to selectively dispense the dielectric material though the orifice upon a curved surface.

13. The non-transitory computer readable storage medium according to claim 12 , the software further including instructions to:
command a cooling device to cool a portion of the curved surface.

14. The non-transitory computer readable storage medium according to claim 12 , the software further including instructions to:
command a heating device to heat a portion of the curved surface.

15. The non-transitory computer readable storage medium according to claim 12 , the software further including instructions to form the fiducial mark in a shape selected from a list consisting of an edge of the substrate, a corner of the substrate, a notch in the substrate, a slot in the substrate, or a hole in the substrate.

16. The non-transitory computer readable storage medium according to claim 11 , the software further including instructions to:
command the extruding device to form the fiducial mark in a shape selected from a list consisting of an edge of the substrate, a corner of the substrate, a notch in the substrate, a slot in the substrate, and a hole in the substrate.

Assignees

• Aptiv Tech Ltd

Inventors

• Bilas Jared
• Peterson David R
• Rhinehart Jr Gerald A

Classifications

• B29C64/393 Primary

  for controlling or regulating additive manufacturing processes · CPC title

• B29C64/118

  using filamentary material being melted, e.g. fused deposition modelling [FDM] · CPC title

• G05B19/042

  using digital processors (G05B19/05 takes precedence) · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title