Liquid discharge head and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11749363-B2
Application number	US-202117362248-A
Country	US
Kind code	B2
Filing date	Jun 29, 2021
Priority date	Apr 26, 2019
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

A liquid discharge head having an element board including an element configured to discharge a liquid includes a first storage element and a second storage element. The first storage element is a fuse element or an anti-fuse element. The second storage element is a semiconductor memory capable of holding a larger capacity than the first storage element. The second storage element is provided on an area other than the element board.

First claim

What is claimed is:

1. A liquid discharge head having an element board including an element configured to discharge a liquid, the liquid discharge head comprising:
a first storage element, wherein the first storage element is a fuse element or an anti-fuse element; and
a second storage element, wherein the second storage element is a semiconductor memory with a larger capacity than a capacity of the first storage element,
wherein the first storage element is provided on the element board, and
wherein the second storage element is provided on an area other than the element board.

2. The liquid discharge head according to claim 1 , further comprising:
a first electric wiring board including a first terminal electrically connected to the first storage element; and
a second electric wiring board including the second storage element.

3. The liquid discharge head according to claim 2 ,
wherein the liquid discharge head includes a housing,
wherein the second electric wiring board includes a second terminal electrically connected to the second storage element, and
wherein the first terminal and the second terminal are arranged on a same surface of the housing.

4. The liquid discharge head according to claim 2 , wherein the first electric wiring board and the second electric wiring board are flexible boards.

5. The liquid discharge head according to claim 1 , wherein the second electric wiring board is arranged in a vertical upper direction of the first electric wiring board, in a posture in which the liquid discharge head is mounted in a recording device body.

6. The liquid discharge head according to claim 4 ,
wherein the housing includes a first concave part on a surface on which the second storage element is arranged, and
wherein the second storage element is inserted into the first concave part.

7. The liquid discharge head according to claim 4 ,
wherein the housing includes a second concave part on a same surface,
wherein an end of the first electric wiring board on a side where a wiring included in the first electric wiring board is exposed protrudes from an opening of the second concave part, and
wherein an end of the second electric wiring board on a side where a wiring included in the second electric wiring board is exposed protrudes from the opening of the second concave part.

8. A method of manufacturing a liquid discharge head, comprising:
preparing an element board provided with a first storage element that is a fuse element or an anti-fuse element, the element board being configured to discharge a liquid;
inspecting the element board; and
mounting a second storage element, after inspecting the element board, which is a semiconductor memory with a larger capacity than the first storage element, on an area other than the element board.

9. The method of manufacturing a liquid discharge head according to claim 8 , further comprising writing information stored in the first storage element into the second storage element after mounting the second storage element.

10. The method of manufacturing a liquid discharge head according to claim 8 , wherein the liquid discharge head further comprising:
a first electric wiring board including a first terminal electrically connected to the first storage element; and
a second electric wiring board including the second storage element.

11. The method of manufacturing a liquid discharge head according to claim 8 ,
wherein the liquid discharge head includes a housing,
wherein the second electric wiring board includes a second terminal electrically connected to the second storage element, and
wherein the first terminal and the second terminal are arranged on a same surface of the housing.

12. The method of manufacturing a liquid discharge head according to claim 8 , wherein the first electric wiring board and the second electric wiring board are flexible boards.

13. The method of manufacturing a liquid discharge head according to claim 12 ,
wherein the housing includes a first concave part on a surface on which the second storage element is arranged, and
wherein the method further comprises, in mounting the second storage element, inserting the second storage element into the first concave part.

14. The method of manufacturing a liquid discharge head according to claim 13 , further comprising, in mounting the second storage element, inserting the second storage element into the first concave part after a sealing material is injected into the first concave part.

15. The method of manufacturing a liquid discharge head according to claim 12 , further comprising:
arranging the first electric wiring board on a same surface of the housing so that an end on a side where a wiring included in the first electric wiring board is exposed protrudes from an opening of the second concave part, after preparing the element board; and
arranging the second electric wiring board on the same surface of the housing so that an end on a side where a wiring included in the second electric wiring board is exposed protrudes from an opening of the second concave part, in mounting the second storage element,
wherein the housing includes a second concave part on the same surface.

Assignees

• Canon Kk

Inventors

• Yamada Hiroshi
• Udagawa Kenta
• Takahashi Wataru
• Ikebe Norihiro

Classifications

• G11C17/165 Primary

  Memory cells which are electrically programmed to cause a change in resistance, e.g. to permit multiple resistance steps to be programmed rather than conduct to or from non-conduct change of fuses and antifuses (digital stores using resistance random access memory elements G11C13/0002) · CPC title

• B41J2/04541

  Specific driving circuit · CPC title

• G11C17/18

  Auxiliary circuits, e.g. for writing into memory · CPC title

• B41J2/14016 Primary

  Structure of bubble jet print heads · CPC title

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title