Image processing device comprising a light receiving element on a second surface of a first substrate and plural light emitting elements on a fourth surface of a second substrate

Patent metadata

Field	Value
Publication number	US-11747198-B2
Application number	US-202117456448-A
Country	US
Kind code	B2
Filing date	Nov 24, 2021
Priority date	Nov 27, 2020
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

An image processing device includes a first substrate, a second substrate, a third substrate provided with a power source circuit, and a casing storing the first substrate, the second substrate, and the third substrate, in which the first substrate has a first surface and a second surface, and is provided between the third substrate and the second substrate in a first direction orthogonal to the first surface, a light receiving element is provided on the second surface, the second substrate has a third surface, a fourth surface, and an opening, the third surface faces the second surface, and the opening is provided to overlap the light receiving element in the first direction, a light emitting element is provided on the fourth surface to surround the opening, and the power source circuit is provided on the third substrate not to overlap the light receiving element in the first direction.

First claim

What is claimed is:

1. An image processing device comprising:
a light receiving element;
a plurality of light emitting elements;
a battery;
a power source circuit electrically coupled to the battery;
a first substrate provided with the light receiving element;
a second substrate provided with the plurality of light emitting elements;
a third substrate provided with the power source circuit; and
a casing storing the first substrate, the second substrate, and the third substrate, wherein
the first substrate has a first surface and a second surface, and is provided between the third substrate and the second substrate in a first direction orthogonal to the first surface,
the light receiving element is provided on the second surface,
the second substrate has a third surface, a fourth surface, and an opening, the third surface faces the second surface, and the opening is provided to overlap the light receiving element in the first direction,
the plurality of light emitting elements are provided on the fourth surface to surround the opening, and
the power source circuit is provided on the third substrate not to overlap the light receiving element in the first direction.

2. The image processing device according to claim 1 , further comprising:
a processor, wherein
the processor is provided on the first substrate.

3. The image processing device according to claim 2 , wherein
the processor is provided on the first substrate not to overlap the power source circuit in the first direction.

4. The image processing device according to claim 1 , wherein
the third substrate is provided between the battery and the first substrate, and
the battery overlaps the third substrate in the first direction.

5. The image processing device according to claim 1 , further comprising:
a wireless communication module; and
a fourth substrate, wherein
the wireless communication module is provided on the fourth substrate.

6. The image processing device according to claim 5 , wherein
the battery is provided between the third substrate and the fourth substrate.

7. The image processing device according to claim 1 , wherein
the image processing device is configured to be operated independently without receiving an instruction from another device and is portable.

8. The image processing device according to claim 1 , further comprising:
a wavelength variable filter, wherein
the wavelength variable filter is provided on the first substrate to overlap the light receiving element and the opening in the first direction.

Assignees

• Seiko Epson Corp

Inventors

• Sozawa Yoshitaka
• Uematsu Hidekazu
• Matsuyama Toru

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10F77/50

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title

• H10F77/953

  for devices having potential barriers · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• G01J3/027 Primary

  Control of working procedures of a spectrometer; Failure detection; Bandwidth calculation · CPC title