Fiber-reinforced thermoplastic resin forming material
US-2020398524-A1 · Dec 24, 2020 · US
Fiber-reinforced resin molding material and molded article
US11746200B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11746200-B2 |
| Application number | US-201917280564-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 24, 2019 |
| Priority date | Sep 28, 2018 |
| Publication date | Sep 5, 2023 |
| Grant date | Sep 5, 2023 |
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- Title
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Abstract
Official abstract text for this publication.
A fiber-reinforced resin molding material is obtained by impregnating a chopped fiber bundle with a matrix resin, has a layered structure including three or more layers in a thickness direction thereof, and satisfies the relationships Lao>Lam and Wao>Wam, where Lao and Wao represent the number average fiber length and the number average fiber bundle width, respectively, of the chopped fiber bundle in the outermost layer thereof, and Lam and Wam represent the number average fiber length and the number average fiber bundle width, respectively, of the chopped fiber bundle in a middle layer thereof.
First claim
Opening claim text (preview).
The invention claimed is: 1. A fiber-reinforced resin molding material [C] of a chopped fiber bundle [A] impregnated with a matrix resin [B], having a layered structure including three or more layers in a thickness direction of the fiber-reinforced resin molding material [C] and satisfying Formula (1) and Formula (3), wherein Lao and Tao are respectively a number average fiber length and a number-average fiber bundle thickness of a chopped fiber bundle [Ao] in an outermost layer, Lam and Tam are respectively a number average fiber length and a number-average fiber bundle thickness of a chopped fiber bundle [Am] in a middle layer, Lao>Lam (1) Tao>Tam (3). 2. The fiber-reinforced resin molding material according to claim 1 , further satisfying Formula (2), wherein Wao is a number average fiber bundle width of the chopped fiber bundle [Ao] in the outermost layer and Wam is a number average fiber bundle width of the chopped fiber bundle [Am] in the middle layer, Wao>Wam (2) 3. The fiber-reinforced resin molding material according to claim 2 , further satisfying Formula (6), wherein Tao is a number average fiber bundle thickness of the chopped fiber bundle [Ao] in the outermost layer and Tam is a number average fiber bundle thickness of the chopped fiber bundle [Am] in the middle layer, 1.01<Tao/Tam<2.00 (6). 4. The fiber-reinforced resin molding material according to claim 1 , further satisfying Formula (5), wherein Wao is a number average fiber bundle width of the chopped fiber bundle [Ao] in the outermost layer and Wam is a number average fiber bundle width of the chopped fiber bundle [Am] in the middle layer, 1.05<Wao/Wam<1.50 (5). 5. The fiber-reinforced resin molding material according to claim 1 , wherein a number average fiber length La of the chopped fiber bundle [A] is 3 mm or more and 100 mm or less. 6. The fiber-reinforced resin molding material according to claim 1 , wherein a number average fiber bundle width Wa of the chopped fiber bundle [A] is 0.1 mm or more and 60 mm or less. 7. The fiber-reinforced resin molding material according to claim 1 , wherein a number average fiber bundle thickness Ta of the chopped fiber bundle [A] is 0.01 mm or more and 0.50 mm or less. 8. The fiber-reinforced resin molding material according to claim 1 , wherein a cutting angle θ of the chopped fiber bundle [A] is 0°<θ<90°. 9. The fiber-reinforced resin molding material according to claim 1 , wherein the matrix resin [B] is a thermosetting resin selected from the group consisting of vinyl ester resin, epoxy resin and unsaturated polyester resin. 10. A molded article made by a compression forming of the fiber-reinforced resin molding material according to claim 1 . 11. A fiber-reinforced resin molding material [C] of a chopped fiber bundle [ A] impregnated with a matrix resin [B], having a layered structure including three or more layers in a thickness direction of the fiber-reinforced resin molding material [C] and satisfying Formula (1) and Formula (2), wherein Lao and Wao are respectively a number average fiber length and a number-average fiber bundle width of a chopped fiber bundle [Ao] in an outermost layer, Lam and Wam are respectively a number average fiber length and a number-average fiber bundle width of a chopped fiber bundle [Am] in a middle layer, further satisfying Formula (4), wherein the Lao is the number average fiber length of the chopped fiber bundle [Ao] in the outermost layer and the Lam is the number average fiber length of the chopped fiber bundle [Am] in the middle layer, Lao>Lam (1) Wao>Wam (2) 1.05<Lao/Lam<1.30 (4). 12. The fiber-reinforced resin molding material according to claim 11 , further satisfying Formula (3), wherein Tao is a number average fiber bundle thickness of the chopped fiber bundle [Ao] in the outermost layer and Tam is a number average fiber bundle thickness of the chopped fiber bundle [Am] in the middle layer, Tao>Tam (3).
Assignees
Inventors
Classifications
- C08J5/243Primary
using carbon fibres · CPC title
by first forming a mat composed of short fibres · CPC title
Elements · CPC title
Cutting off · CPC title
esters · CPC title
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Frequently asked questions
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- What does patent US11746200B2 cover?
- A fiber-reinforced resin molding material is obtained by impregnating a chopped fiber bundle with a matrix resin, has a layered structure including three or more layers in a thickness direction thereof, and satisfies the relationships Lao>Lam and Wao>Wam, where Lao and Wao represent the number average fiber length and the number average fiber bundle width, respectively, of the chopped fiber bun…
- Who is the assignee on this patent?
- Toray Industries
- What technology area does this patent fall under?
- Primary CPC classification C08J5/243. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Sep 05 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).