Groove engraving device and groove engraving method

Patent metadata

Field	Value
Publication number	US-11745535-B2
Application number	US-202217838296-A
Country	US
Kind code	B2
Filing date	Jun 13, 2022
Priority date	Jun 18, 2021
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

A groove engraving device and a groove engraving method are provided. The groove engraving device includes: a processing chamber for containing a piece to be processed, a cutter for groove engraving on the piece to be processed, a clamping mechanism for clamping the piece to be processed, a driving mechanism for driving the clamping mechanism to rotate, and a temperature controlling device for controlling a temperature inside the processing chamber to be within a preset temperature range. The clamping mechanism and the cutter are disposed inside the processing chamber, and the clamping mechanism is rotatable with respect to the processing chamber. The temperature controlling device is disposed inside the processing chamber. The groove engraving device can improve the processing efficiency and quality of the groove engraving on the piece to be processed.

First claim

What is claimed is:

1. A groove engraving device, comprising:
a processing chamber for containing a piece to be processed,
a cutter for groove engraving on the piece to be processed,
a clamping mechanism for clamping the piece to be processed,
a driving mechanism for driving the clamping mechanism to rotate, and
a temperature controlling device for controlling a temperature inside the processing chamber to be within a preset temperature range, wherein the temperature controlling device comprises:
a temperature sensor for detecting the temperature inside the processing chamber,
a refrigerating mechanism for regulating the temperature inside the processing chamber, and
a controller for controlling the refrigerating mechanism to operate;
wherein the temperature sensor, the refrigerating mechanism and the controller are disposed inside the processing chamber, and the temperature sensor and the refrigerating mechanism are electrically connected to the controller;
wherein the clamping mechanism and the cutter are disposed inside the processing chamber, and the clamping mechanism is rotatable with respect to the processing chamber; and
the temperature controlling device is disposed inside the processing chamber.

2. The groove engraving device according to claim 1 , wherein the preset temperature range is from minus 10 degrees Celsius to minus 4 degrees Celsius.

3. The groove engraving device according to claim 1 , wherein the refrigerating mechanism comprises at least one selected from the group consisting of a heat exchanger and a room air conditioner.

4. The groove engraving device according to claim 1 , further comprising a cooling device for cooling the piece to be processed, wherein the cooling device is disposed inside the processing chamber, and the cooling device is provided correspondingly to the cutter.

5. The groove engraving device according to claim 4 , wherein the cooling device is a coolant spraying mechanism.

6. The groove engraving device according to claim 1 , further comprising a temperature holding hood for holding a temperature of the piece to be processed, wherein the temperature holding hood is disposed inside the processing chamber.

7. The groove engraving device according to claim 6 , wherein the temperature holding hood is provided with an opening, and the opening is for the cutter to pass through, to abut the cutter on at least part of the piece to be processed.

8. The groove engraving device according to claim 6 , wherein the temperature holding hood comprises a first hood body and a second hood body, wherein the first hood body and the second hood body are rotatably connected.

9. The groove engraving device according to claim 6 , wherein the temperature holding hood comprises an inner wall and an outer wall, wherein a hollow cavity is formed between the outer wall and the inner wall, and a refrigerant medium for cooling the piece to be processed is provided inside the hollow cavity.

10. A groove engraving method using the groove engraving device according to claim 1 , comprising:
clamping a piece to be processed by using the clamping mechanism rotating with respect to the processing chamber;
controlling a temperature inside the processing chamber to be within a preset temperature range by using the temperature controlling device; and
driving the piece to be processed at the clamping mechanism to rotate with respect to the processing chamber by using the driving mechanism, to engrave a groove on the piece to be processed through the cutter.

11. The groove engraving method according to claim 10 , wherein the step of driving the piece to be processed at the clamping mechanism to rotate with respect to the processing chamber by using the driving mechanism, to engrave the groove on the piece to be processed through the cutter comprises:
controlling the cutter to advance, wherein an advancing depth of the cutter is 0.16-0.28 mm;
driving the piece to be processed at the clamping mechanism to rotate with respect to the processing chamber by using the driving mechanism, to engrave the groove on the piece to be processed through the cutter; and
controlling the cutter to retract.

12. The groove engraving method according to claim 11 , wherein the step of driving the piece to be processed at the clamping mechanism to rotate with respect to the processing chamber by using the driving mechanism, to engrave the groove on the piece to be processed through the cutter further comprises:
ejecting a coolant to a groove-engraving of the piece to be processed by using a cooling device.

13. The groove engraving method according to claim 10 , wherein the step of controlling the temperature inside the processing chamber to be within the preset temperature range by using the temperature controlling device comprises:
detecting the temperature inside the processing chamber by using the temperature sensor; and
controlling the refrigerating mechanism to regulate the temperature inside the processing chamber to the preset temperature range, when the temperature is not within the preset temperature range.

Assignees

• Longi Green Energy Technology Co Ltd

Inventors

• Mao Jianbo
• Li Jie
• Dang Pengfei

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• Y02P70/10

  Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working · CPC title

• B44B3/008 Primary

  characterised by multi-step processes · CPC title

• B26D1/02

  having a stationary cutting member (B26D1/547 takes precedence) · CPC title

• B26D3/06 Primary

  Grooving involving removal of material from the surface of the work · CPC title