Stand-up pouch for retort

Patent metadata

Field	Value
Publication number	US-11745483-B2
Application number	US-201615566873-A
Country	US
Kind code	B2
Filing date	Apr 20, 2016
Priority date	Apr 20, 2015
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

An object of the present invention is to provide a stand-up pouch for retort which has a high rate of gas barrier property recovery after retort processing and can stably retain high gas barrier properties. The stand-up pouch for retort of the invention comprises a laminate which comprises a base film and, disposed over one surface of the base film, a polyamide resin layer, a saponified ethylene-vinyl ester copolymer layer, and a heat-sealing resin layer, wherein the polyamide resin layer adjoins the saponified ethylene-vinyl ester copolymer layer.

First claim

The invention claimed is:

1. A stand-up pouch for retort comprising:
a laminate which comprises a base film and, disposed over one surface of the base film, a polyamide resin layer, a saponified ethylene-vinyl ester copolymer layer, and a heat-sealing resin layer,
wherein the polyamide resin layer adjoins the saponified ethylene-vinyl ester copolymer layer,
wherein a ratio (Tc/Tb) between a thickness (Tc) of the saponified ethylene-vinyl ester copolymer layer and a thickness (Tb) of the polyamide resin layer is 0.02 to 0.9,
wherein a thickness of the polyamide resin layer is more than 10 μm and less than or equal to 80 μm, and the polyamide is nylon 6,
wherein a thickness of the saponified ethylene-vinyl ester copolymer layer is 1-35 μm,
wherein the saponified ethylene-vinyl ester is a saponified ethylene-vinyl ester of which the ethylene content is 20-60% by mole, the degree of saponification of the saponified ethylene-vinyl ester is 90-100% by mole, and the melt flow rate (MFR) is 0.5-100 g/10 min,
wherein the base film is a polyester resin film, and
wherein a heat-sealing resin which constitutes the heat-sealing resin layer is polypropylene.

2. The stand-up pouch for retort according to claim 1 , comprising:
the polyamide resin layer between the base film and the saponified ethylene-vinyl ester copolymer layer.

3. The stand-up pouch for retort according to claim 1 , further comprising a second polyamide resin layer, and wherein the polyamide resin layers adjoin both surfaces of the saponified ethylene-vinyl ester copolymer layer.

4. The stand-up pouch for retort according to claim 1 , wherein the ratio (Tc/Tb) between a thickness (Tc) of the saponified ethylene-vinyl ester copolymer layer and a thickness (Tb) of the polyamide resin layer is 0.333 to 0.666.

5. The stand-up pouch for retort according to claim 1 , wherein the ratio (Tc/Tb) between a thickness (Tc) of the saponified ethylene-vinyl ester copolymer layer and a thickness (Tb) of the polyamide resin layer is 0.02 to 0.666.

6. A stand-up pouch for retort comprising:
a laminate which comprises a base film and, disposed over one surface of the base film, a polyamide resin layer, a saponified ethylene-vinyl ester copolymer layer, and a heat-sealing resin layer,
wherein the polyamide resin layer adjoins the saponified ethylene-vinyl ester copolymer layer,
wherein a ratio (Tc/Tb) between a thickness (Tc) of the saponified ethylene-vinyl ester copolymer layer and a thickness (Tb) of the polyamide resin layer is 0.02 to 0.9,
wherein a thickness of the polyamide resin layer is more than 10 μm and less than or equal to 80 μm, and the polyamide is nylon 6,
wherein a thickness of the saponified ethylene-vinyl ester copolymer layer is 1-35 μm, and
wherein the saponified ethylene-vinyl ester is a saponified ethylene-vinyl ester of which the ethylene content is 20-60% by mole, the degree of saponification of the saponified ethylene-vinyl ester is 90-100% by mole, and the melt flow rate (MFR) is 0.5-100 g/10 min,
wherein the stand-up pouch for retort exhibits an improvement in oxygen permeability from after 6 hours to after 24 hours after retort processing of 34.5% or higher, and
wherein the base film is a polyester resin film, and
wherein a heat-sealing resin which constitutes the heat-sealing resin layer is polypropylene.

Assignees

• Nippon Synthetic Chem Ind Co Ltd
• Mitsubishi Chem Corp

Inventors

• USUI Shintaro

Classifications

• B32B27/34 Primary

  comprising polyamides · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B27/00

  Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)} · CPC title

• B32B27/08

  of synthetic resin · CPC title

• B32B27/28

  comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42} · CPC title