Fluorocarbon resin composition and prepreg and copper foil substrate using the same
US-2020165501-A1 · May 28, 2020 · US
US11745482B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11745482-B2 |
| Application number | US-202017081090-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 27, 2020 |
| Priority date | Oct 29, 2019 |
| Publication date | Sep 5, 2023 |
| Grant date | Sep 5, 2023 |
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The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.
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What is claimed is: 1. A fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate comprising a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the fluororesin substrate has a dielectric loss tangent measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 0.0010 to 0.0020, and a coefficient of thermal expansion of 30 ppm/° C. or less in a direction of the fluororesin substrate, wherein the fluororesin substrate has a thickness of 120 μm to 12700 μm, and wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound. 2. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate is a substrate including polytetrafluoroethylene. 3. The fluororesin substrate laminate according to claim 1 , wherein the (B) aromatic maleimide compound has a structure having a maleimide group bonded to an aromatic ring. 4. The fluororesin substrate laminate according to claim 1 , wherein the saturated or unsaturated divalent hydrocarbon group has 8 to 100 carbon atoms. 5. The fluororesin substrate laminate according to claim 1 , wherein the saturated or unsaturated divalent hydrocarbon group is a group represented by the following Formula (II): wherein in Formula (II), R 2 and R 3 each independently represent an alkylene group having 4 to 50 carbon atoms; R 4 represents an alkyl group having 4 to 50 carbon atoms; and R 5 represents an alkyl group having 2 to 50 carbon atoms. 6. The fluororesin substrate laminate according to claim 1 , wherein the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group further has a divalent group having at least two imide bonds. 7. The fluororesin substrate laminate according to claim 6 , wherein the divalent group having at least two imide bonds is a group represented by the following Formula (I): wherein in Formula (I), R 1 represents a tetravalent organic group. 8. The fluororesin substrate laminate according to claim 1 , wherein the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group has a weight average molecular weight of 500 to 10000. 9. The fluororesin substrate laminate according to claim 1 , further comprising a metal foil on the adhesive layer. 10. The fluororesin substrate laminate according to claim 9 , wherein the metal foil has a surface roughness of 0.05 to 2 μm. 11. The fluororesin substrate laminate according to claim 1 , wherein the resin composition further comprises a cyanate ester resin. 12. The fluororesin substrate laminate according to claim 1 , wherein the resin composition further comprises a styrene-ethylene-butylene copolymer modified with maleic anhydride. 13. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate has a dielectric loss tangent measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 0.0010 to 0.0013. 14. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate has a dielectric constant measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 2.2 to 3.5.
comprising halogenated polyolefins, e.g. PTFE · CPC title
using interposed adhesives or interposed materials with bonding properties · CPC title
comprising polyolefins · CPC title
Polyolefin, e.g.rubber · CPC title
characterised by the adhesive composition · CPC title
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