Fluororesin substrate laminate

US11745482B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11745482-B2
Application numberUS-202017081090-A
CountryUS
Kind codeB2
Filing dateOct 27, 2020
Priority dateOct 29, 2019
Publication dateSep 5, 2023
Grant dateSep 5, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

First claim

Opening claim text (preview).

What is claimed is: 1. A fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate comprising a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the fluororesin substrate has a dielectric loss tangent measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 0.0010 to 0.0020, and a coefficient of thermal expansion of 30 ppm/° C. or less in a direction of the fluororesin substrate, wherein the fluororesin substrate has a thickness of 120 μm to 12700 μm, and wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound. 2. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate is a substrate including polytetrafluoroethylene. 3. The fluororesin substrate laminate according to claim 1 , wherein the (B) aromatic maleimide compound has a structure having a maleimide group bonded to an aromatic ring. 4. The fluororesin substrate laminate according to claim 1 , wherein the saturated or unsaturated divalent hydrocarbon group has 8 to 100 carbon atoms. 5. The fluororesin substrate laminate according to claim 1 , wherein the saturated or unsaturated divalent hydrocarbon group is a group represented by the following Formula (II): wherein in Formula (II), R 2 and R 3 each independently represent an alkylene group having 4 to 50 carbon atoms; R 4 represents an alkyl group having 4 to 50 carbon atoms; and R 5 represents an alkyl group having 2 to 50 carbon atoms. 6. The fluororesin substrate laminate according to claim 1 , wherein the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group further has a divalent group having at least two imide bonds. 7. The fluororesin substrate laminate according to claim 6 , wherein the divalent group having at least two imide bonds is a group represented by the following Formula (I): wherein in Formula (I), R 1 represents a tetravalent organic group. 8. The fluororesin substrate laminate according to claim 1 , wherein the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group has a weight average molecular weight of 500 to 10000. 9. The fluororesin substrate laminate according to claim 1 , further comprising a metal foil on the adhesive layer. 10. The fluororesin substrate laminate according to claim 9 , wherein the metal foil has a surface roughness of 0.05 to 2 μm. 11. The fluororesin substrate laminate according to claim 1 , wherein the resin composition further comprises a cyanate ester resin. 12. The fluororesin substrate laminate according to claim 1 , wherein the resin composition further comprises a styrene-ethylene-butylene copolymer modified with maleic anhydride. 13. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate has a dielectric loss tangent measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 0.0010 to 0.0013. 14. The fluororesin substrate laminate according to claim 1 , wherein the fluororesin substrate has a dielectric constant measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 2.2 to 3.5.

Assignees

Inventors

Classifications

  • B32B27/322Primary

    comprising halogenated polyolefins, e.g. PTFE · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • comprising polyolefins · CPC title

  • Polyolefin, e.g.rubber · CPC title

  • characterised by the adhesive composition · CPC title

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What does patent US11745482B2 cover?
The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an arom…
Who is the assignee on this patent?
Showa Denko Materials Co Ltd, Resonac Corp
What technology area does this patent fall under?
Primary CPC classification B32B27/322. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 05 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).