Power electronics unit having at least one semiconductor module attached by means of a plastic holder

Patent metadata

Field	Value
Publication number	US-11744052-B2
Application number	US-202017613108-A
Country	US
Kind code	B2
Filing date	May 4, 2020
Priority date	May 24, 2019
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

A power electronics unit for an electric motor of a motor vehicle drive, having a plate-like cooling element, at least one semiconductor module and a module holder which consists of plastic and secures the at least one semiconductor module relative to the cooling element. The module holder is fixed to the cooling element via an interlocking snap connection.

First claim

The invention claimed is:

1. A power electronics unit for an electric motor of a motor vehicle drive, comprising:
a plate-like cooling element,
at least one semiconductor module, and
a module holder comprised of plastic and which secures the at least one semiconductor module relative to the plate-like cooling element,
wherein the module holder is fixed to the plate-like cooling element via an interlocking snap connection,
wherein the interlocking snap connection is implemented via first interlocking elements integrally formed with the module holder and second interlocking elements formed separately from the module holder, the first and second interlocking elements each forming a snap-hook contour,
wherein the first interlocking elements are engaged with the cooling element and the second interlocking elements are engaged with the module holder and the cooling element, the first interlocking elements being arranged between the second interlocking elements.

2. The power electronics unit according to claim 1 , further comprising securing elements each engaged with one respective second interlocking element to secure the respective second interlocking element against a loosening of the snap connection.

3. The power electronics unit according to claim 1 , wherein a circuit board is attached directly to the module holder.

4. The power electronics unit according to claim 3 , wherein the circuit board is attached to the module holder by fastening elements formed separately from the module holder and the circuit board or by fastening elements formed integrally with the module holder.

5. The power electronics unit according to claim 3 , wherein the circuit board is attached to a side of the module holder facing away from the at least one semiconductor module.

6. The power electronics unit according to claim 1 , wherein the module holder is formed from multiple stiffening ribs.

7. The power electronics unit according to claim 6 , wherein the module holder is formed from a fiber-reinforced plastic.

8. A power electronics unit for an electric motor of a motor vehicle drive, comprising:
a semiconductor module;
a plate-like cooling element configured to receive the semiconductor module, the plate-like cooling element including a first receiving hole and a pair of second receiving holes at an axial end of the plate-like cooling element, the first receiving hole arranged between the pair of second receiving holes at the axial end of the plate-like cooling element;
a module holder arranged to secure the semiconductor module relative to the plate-like cooling element, the module holder including:
a first interlocking element engaged with the first receiving hole via an interlocking snap connection, the first interlocking element being integrally formed with the module holder; and
a further receiving hole aligned with one of the second receiving holes; and

a second interlocking element extending through the further receiving hole and engaged with the one of the second receiving holes via an interlocking snap connection, the second interlocking element being formed separately from the module holder and the plate-like cooling element.

9. The power electronics unit according to claim 8 , wherein the first interlocking element includes a snap-in lug arranged at an end spaced from the module holder, the snap-in lug being configured to form a snap-hook contour and engage the first receiving hole.

10. The power electronics unit according to claim 9 , wherein the snap-in lug is elongated transverse to a longitudinal direction of the module holder.

11. The power electronics unit according to claim 8 , wherein the second interlocking element includes a collar arranged at a first end and configured to rest on the module holder around the further receiving hole.

12. The power electronics unit according to claim 11 , wherein the second interlocking element includes a plurality of snap-in lugs arranged at a second end spaced from the first end, the plurality of snap-in lugs each being configured to form a snap-hook contour and to engage the second receiving hole.

13. The power electronics unit according to claim 12 , further comprising a securing pin, wherein the second interlocking element includes a central hole extending through the first end and the second end, the securing pin being arranged in the central hole and being configured to maintain the interlocking snap connection between the second interlocking element and the second receiving hole.

14. The power electronics unit according to claim 8 , further comprising a securing pin, wherein the second interlocking element includes a central hole extending axially therethrough, the securing pin being arranged in the central hole and being configured to maintain the interlocking snap connection between the second interlocking element and the second receiving hole.

15. The power electronics unit according to claim 8 , further comprising a further second interlocking element, wherein the plate-like cooling element includes a further second receiving hole arranged between the semiconductor module and the axial end of the plate-like cooling element, the further second interlocking element being configured to fix the module holder to the plate-like cooling element via an interlocking snap connection with the further second receiving hole.

16. The power electronics unit according to claim 8 , wherein the module holder includes a plurality of stiffening ribs extending in a longitudinal direction of the module holder, the plurality of stiffening ribs being arranged parallel to each other and on a side of the module holder facing the plate-like cooling element.

Assignees

• Schaeffler Technologies Ag

Inventors

• Müller Gregor

Classifications

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H01L23/4093

  Electricity · mapped topic

• H05K7/2049

  Pressing means used to urge contact, e.g. springs · CPC title

• H05K7/20927

  Liquid coolant without phase change · CPC title