High density, high speed electrical connector

Patent metadata

Field	Value
Publication number	US-11742601-B2
Application number	US-202217674631-A
Country	US
Kind code	B2
Filing date	Feb 17, 2022
Priority date	May 20, 2019
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.

First claim

What is claimed is:

1. A wafer, comprising:
a plurality of signal conductor pairs, each signal conductor pair comprising a pair of mating ends, a pair of contact tails and a pair of intermediate portions connecting the pair of mating ends to the pair of contact tails,
wherein:
the pairs of mating ends of the plurality of signal conductor pairs are positioned in a column along a column direction;
the intermediate portions of the pairs of intermediate portions of the plurality of signal conductor pairs are aligned in a direction perpendicular to the column direction and positioned for broadside coupling; and
the mating ends of the plurality of signal conductor pairs are separated along lines disposed at an angle of greater than 0 degrees and less than 90 degrees relative to the column direction.

2. The wafer of claim 1 , wherein:
the lines are disposed at an angle of greater than 30 degrees and less than 60 degrees relative to the column direction.

3. The wafer of claim 1 , wherein the lines are disposed at an angle of 45 degrees relative to the column direction.

4. The wafer of claim 3 , further comprising a housing supporting the plurality of signal conductor pairs.

5. The wafer of claim 3 , wherein the plurality of signal conductor pairs comprises a plurality of connector modules, each connector module of the plurality of connector modules further comprised of:
electromagnetic shielding disposed around the signal conductor pair, wherein portions of the electromagnetic shielding at least partially surrounds the mating ends of the signal conductors of the signal conductor pair and is rectangular with a width less than 2 mm and a length less than 3.8 mm.

6. The wafer of claim 5 , wherein:
the housing comprises a first housing member comprising a plurality of grooves; and
a connector module of the plurality of connector modules is disposed within a groove of the plurality of grooves.

7. The wafer of claim 6 , wherein the housing is formed of a lossy conductive material.

8. The wafer of claim 3 , wherein:
the column direction is a mating interface column direction;
the pairs of contact tails of the plurality of signal conductor pairs are positioned in a column along a mounting interface column direction; and
contact tails of the pairs of contact tails are separated in a mounting interface row direction perpendicular to the mounting interface column direction.

9. The wafer of claim 8 , wherein the mating interface column direction is orthogonal to the mounting interface column direction.

10. The wafer of claim 8 , wherein center-to-center spacing between adjacent pairs of contact tails in the mounting interface column direction is less than or equal to 5 mm.

11. The wafer of claim 8 , wherein center-to-center spacing between adjacent pairs of contact tails in the mounting interface column direction is less than or equal to 2.4 mm.

12. The wafer of claim 8 , wherein the mounting interface row direction is orthogonal to the mounting interface column direction.

13. The wafer of claim 3 , wherein the pairs of contact tails are configured to be inserted into holes having a diameter of less than or equal to 20 mils.

14. The wafer of claim 13 , wherein each contact tail of the pairs of contact tails has a width between 6 and 20 mils.

15. The wafer of claim 3 , wherein the pairs of contact tails are configured to be inserted into holes having a diameter of less than or equal to 10 mils.

16. The wafer of claim 15 , wherein each contact tail of the pairs of contact tails has a width between 6 and 10 mils.

17. A connector comprising:
an insulative portion;
a plurality of signal conductors held by the insulative portion; and
a plurality of shielding members,
wherein:
the plurality of signal conductors comprise elongated mating portions extending from the insulative portion;
the plurality of signal conductors comprise a plurality of pairs of signal conductors disposed in a plurality of rows extending in a row direction;
the plurality of shielding members at least partially surround pairs of the plurality of pairs; and
the mating portions of the plurality of pairs are separated along first parallel lines disposed an angle of greater than 0 degrees and less than 90 degrees relative to the row direction.

18. The connector of claim 17 , wherein the first parallel lines are disposed at an angle of greater than 30 degrees and less than 60 degrees relative to the row direction.

19. The connector of claim 17 , wherein the first parallel lines are disposed at an angle of 45 degrees relative to the row direction.

20. The connector of claim 17 , wherein the plurality of shielding members comprise electrically conductive sheets.

21. The connector of claim 17 , wherein:
the insulative portion comprises a planar portion having a first surface and a second surface, opposite the first surface;
the mating portions extend in a direction perpendicular to the first surface;
the signal conductors further comprise contact tails that extend through the second surface.

22. The connector of claim 21 , wherein the contact tails are disposed in a second plurality of rows extending in a first direction and positioned along a second direction perpendicular to the first direction in a repeating pattern with:
center-to-center spacing between adjacent pairs of contact tails in the first direction less than or equal to 5 mm; and
center-to-center spacing between adjacent pairs of contact tails in the second direction perpendicular to the first direction less than or equal to 5 mm.

23. The connector of claim 21 , wherein the contact tails are disposed in a second plurality of rows extending in a first direction and positioned along a second direction perpendicular to the first direction in a repeating pattern with:
center-to-center spacing between adjacent pairs of contact tails in the first direction less than or equal to 2.4 mm; and
center-to-center spacing between adjacent pairs of contact tails in the second direction perpendicular to the first direction less than or equal to 2.4 mm.

24. The connector of claim 21 , wherein the contact tails are configured for inserting into holes having a diameter of less than or equal to 20 mils.

25. The connector of claim 24 , wherein the contact tails have a width of between 6 and 20 mils.

26. The connector of claim 21 , wherein the contact tails are configured for inserting into holes having a diameter of less than or equal to 10 mils.

27. The connector of claim 24 , wherein the contact tails have a width of between 6 and 10 mils.

28. The connector of claim 17 , wherein:
the plurality of pairs of signal conductors further comprise intermediate portions connected to the mating portions by transition regions;
signal conductors of each pair of signal conductors are separated along the first parallel lines at a first portion of the transition region adjacent the mating portions; and
the signal conductors are separated along second parallel lines parallel to the row direction at a second portion of the transition region adjacent the intermediate portions.

Assignees

• Amphenol Corp

Inventors

• Cartier Jr Marc B
• Dunham John Robert
• Gailus Mark W
• Pitten John

Classifications

• H01R12/71

  for rigid printing circuits or like structures · CPC title

• H01R9/24 Primary

  Terminal blocks · CPC title

• H01R13/6585

  Shielding material individually surrounding or interposed between mutually spaced contacts · CPC title

• H01R13/02 Primary

  Contact members · CPC title

• H01R13/6587 Primary

  for mounting on PCBs · CPC title