Semiconductor device

Patent metadata

Field	Value
Publication number	US-11742256-B2
Application number	US-202117213774-A
Country	US
Kind code	B2
Filing date	Mar 26, 2021
Priority date	Oct 2, 2018
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

A semiconductor device incudes: a semiconductor chip that includes an active area and an outer peripheral area surrounding the active area; a metal member that includes one face including a mounting portion on which the semiconductor chip is mounted and a peripheral member surrounding the mounting portion; a joining member that connects the semiconductor chip and the metal member; and a sealing resin body. The metal member includes, as the peripheral portion, an adhesive portion that surrounds the mounting portion and adheres to the sealing resin body, and a non-adhesive portion that is placed between the mounting portion and the adhesive portion. An entire width is placed in an area overlapping the semiconductor chip in a projection view in a thickness direction of the semiconductor chip.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a semiconductor chip that includes
an active area and
an outer peripheral area surrounding the active area;

a metal member that includes one face including
a mounting portion on which the semiconductor chip is mounted and
a peripheral portion surrounding the mounting portion;

a joining member that
is interposed between the semiconductor chip and the mounting portion and connects the semiconductor chip and the metal member; and

a sealing resin body that integrally seals the semiconductor chip, at least the one face of the metal member and the joining metal member,
wherein:
the metal member includes, as the peripheral portion,
an adhesive portion that
surrounds the mounting portion and
adheres to the sealing resin body, and

a non-adhesive portion that is
placed between the mounting portion and the adhesive portion,
is not connected to the joining member,
has lower adhesion to the sealing resin body than adhesion of the adhesive portion, and
has an annular shape; and

at, at least, a part of an entire length of the non-adhesive portion, an entire width is placed in an area overlapping the semiconductor chip in a projection view in a thickness direction of the semiconductor chip.

2. The semiconductor device according to claim 1 , wherein:
at, at least, a part of the entire length of the non-adhesive portion, the entire width is placed in an area overlapping the outer peripheral area.

3. The semiconductor device according to claim 1 , wherein:
a shape of a plane of the semiconductor chip is a polygonal shape; and
the non-adhesive portion is placed at at least one corner in the area overlapping the semiconductor chip.

4. The semiconductor device according to claim 1 , wherein:
the entire width of the entire length of the non-adhesive portion is placed in the area overlapping the semiconductor chip.

5. The semiconductor device according to claim 1 , wherein:
the adhesive portion is a roughened portion having a continuously uneven surface.

6. The semiconductor device according to claim 5 , wherein:
the metal member includes
a metal base and
a film formed on a surface of the metal base;

the film includes
a metal thin film formed on the surface of the metal base and
an uneven oxide film that is an oxide of an identical metal with a main component metal of the metal thin film and has a continuously uneven surface;

the uneven oxide film is placed at
an entire area of the adhesive portion and
at least a portion close to the adhesive portion in the non-adhesive portion; and

a height of a convex portion of the uneven oxide film of the adhesive portion is higher than a height of a convex portion of the uneven oxide film of the non-adhesive portion.

Assignees

• Denso Corp

Inventors

• Ooshima Masanori
• Okumura Tomomi
• Hirano Takahiro

Classifications

• H10W76/60

  Seals · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title