Radiation detectors for scanning systems, and related scanning systems

Patent metadata

Field	Value
Publication number	US-11740367-B2
Application number	US-202217571262-A
Country	US
Kind code	B2
Filing date	Jan 7, 2022
Priority date	Jan 7, 2022
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.

First claim

What is claimed is:

1. A radiation scanning system, comprising:
a radiation detection sub-assembly;
a routing sub-assembly coupled to the radiation detection sub-assembly, the routing sub-assembly comprising:
a first substrate electrically connected to the radiation detection sub-assembly; and
a second substrate electrically connected to the first substrate;

one or more radiation shields between the first substrate and the second substrate, the one or more radiation shields contacting one of the first substrate and the second substrate and separated from the other of the first substrate and the second substrate by an air gap; and
one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate.

2. The radiation scanning system of claim 1 , wherein the first substrate comprises a protrusion defining at least a portion of a bottom surface of the first substrate, sidewalls of the protrusion at least partially defining one or more cavities in which the one or more radiation shields are disposed.

3. The radiation scanning system of claim 2 , wherein a height of the protrusion is greater than a thickness of the one or more radiation shields.

4. The radiation scanning system of claim 1 , wherein an upper surface of the second substrate is spaced from a surface of the one or more radiation shields.

5. The radiation scanning system of claim 1 , wherein the one or more semiconductor dice are located within lateral boundaries defined by the one or more radiation shields.

6. The radiation scanning system of claim 1 , wherein the one or more radiation shields comprises four radiation shields.

7. The radiation scanning system of claim 1 , wherein:
the first substrate comprises one or more protrusions around a periphery thereof; and
the one or more radiation shields are disposed in one or more cavities defined at least partially by the one or more protrusions and an upper surface of the second substrate.

8. The radiation scanning system of claim 1 , wherein the radiation detection sub-assembly comprises a photodiode diode coupled to a scintillator array.

9. The radiation scanning system of claim 1 , wherein the one or more semiconductor dice are disposed within one or more ASIC packages.

10. The radiation scanning system of claim 1 , wherein the one or more semiconductor dice each individually comprises a flip chip semiconductor die.

11. The detector array of claim 10 , wherein the first substrate comprises a ceramic material.

12. A detector array for a radiation system, the detector array comprising:
a first substrate coupled to a radiation detection sub-assembly;
a second substrate vertically underlying the first substrate, the first substrate comprising a protrusion extending between the first substrate and the second substrate;
conductive structures between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate, the conductive structures coupled to the protrusion; and
one or more radiation shields within one or more cavities between the first substrate and the second substrate.

13. The detector array of claim 12 , wherein the one or more radiation shields are external to the first substrate and the second substrate.

14. The detector array of claim 12 , wherein the one or more radiation shields are coupled to the first substrate with an electrically conductive adhesive.

15. The detector array of claim 12 , wherein the protrusion exhibits a cross-shaped horizontal cross-section.

16. A radiation scanning system, comprising:
a radiation detection sub-assembly comprising:
a scintillator array; and
a photodiode array coupled to the scintillator array;

a routing sub-assembly comprising:
a first substrate coupled to the photodiode array with first conductive structures, the first substrate comprising a protrusion extending in a direction opposite the photodiode array;
a second substrate coupled to the first substrate with second conductive structures; and
one or more radiation shields between the first substrate and the second substrate, the one or more radiation shields laterally spaced from the protrusion; and

an electronics sub-assembly comprising:
one or more semiconductor dice coupled to the second substrate with third conductive structures; and
a connector configured to electrically couple to a detector module.

17. The radiation scanning system of claim 16 , wherein the one or more radiation shields comprise a single radiation shield vertically overlying two or more semiconductor dice.

18. The radiation scanning system of claim 16 , wherein a lower surface of the one or more radiation shields is closer to an upper surface of the first substrate than a lower surface of the protrusion.

19. The radiation scanning system of claim 16 , wherein the second substrate comprises an additional protrusion extending in a direction opposite the electronics sub-assembly.

20. The radiation scanning system of claim 19 , wherein the second conductive structures are directly between the protrusion of the first substrate and the additional protrusion of the second substrate.

Assignees

• Analogic Corp

Inventors

• Marsden Lane
• Luhta Randy

Classifications

• H10F39/8057

  Optical shielding · CPC title

• H10F39/1898

  Indirect radiation image sensors, e.g. using luminescent members · CPC title

• H10F39/1895

  of the hybrid type · CPC title

• H10F39/024

  of coatings or optical elements · CPC title

• H10F39/018 Primary

  of hybrid image sensors · CPC title