Plating systems having reduced air entrainment

Patent metadata

Field	Value
Publication number	US-11739434-B2
Application number	US-202016739569-A
Country	US
Kind code	B2
Filing date	Jan 10, 2020
Priority date	Jul 10, 2017
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

First claim

What is claimed is:

1. An electroplating processing system comprising:
a recirculating tank containing a first volume of processing fluid;
a vessel configured to receive the processing fluid from the recirculating tank, wherein the vessel comprises an inner chamber and an outer chamber, wherein the inner chamber is sized to hold a second volume of processing fluid less than the first volume of processing fluid, and wherein a liquid level sensor is associated with the vessel to provide a liquid level indication in the outer chamber;
a delivery pump fluidly coupled with the recirculating tank and positioned between the recirculating tank and the vessel;
a return line positioned between an outlet of the vessel and an inlet of the recirculating tank, wherein a portion of the return line forms a restriction sized to maintain a gravity-assisted fluid flow rate less than a steady-state delivery rate of the delivery pump, and wherein the return line does not include a valve; and
a return pump fluidly coupled with the return line at a position between the outlet of the vessel and the inlet of the recirculating tank, wherein the return pump is electrically coupled with the liquid level sensor.

2. The electroplating processing system of claim 1 , wherein the return pump is configured to disengage when the liquid level sensor indicates a fluid level in the outer chamber of the vessel at or below a predetermined minimum.

3. The electroplating processing system of claim 1 , wherein the return pump comprises an integral-level control algorithm to determine pump speed based on readings from the liquid level sensor.

4. The electroplating processing system of claim 1 , wherein the return pump is chemically compatible with at least one of methanesulfonic acid, potassium hydroxide, and boric acid.

5. The electroplating processing system of claim 1 , wherein the return pump is rated at less than or about 100 Watts.

6. The electroplating processing system of claim 1 , wherein the vessel is positioned within the system at a fluid height differential from the recirculating tank of less than 24 inches.

7. The electroplating processing system of claim 1 , wherein the liquid level sensor is a first liquid level sensor disposed at a first height on the vessel; and wherein the electroplating processing system further comprises:
a second liquid level sensor disposed at a second height on the vessel.

8. The electroplating processing system of claim 1 , wherein the restriction is formed on the return line between the return pump and the recirculating tank.

9. The electroplating processing system of claim 1 , further comprising:
a container fluidly coupled with the return line between the vessel and the return pump, wherein the container is configured to receive processing fluid exiting the vessel, and wherein the container comprises a media configured to extract entrained bubbles within the processing fluid.

10. The electroplating processing system of claim 9 , wherein the media comprises a polymeric material.

11. The electroplating processing system of claim 10 , wherein the polymeric material comprises a mesh disposed within the container.

12. The electroplating processing system of claim 1 , further comprising:
a buffer vessel fluidly coupled between the vessel and the recirculating tank, wherein the buffer vessel comprises a first exit port from the buffer vessel, wherein the buffer vessel comprises a standpipe coupled with a base of the buffer vessel, and wherein the standpipe is characterized by a sloped surface of an interior edge at a top of the standpipe.

13. The electroplating processing system of claim 12 , wherein the buffer vessel comprises a channel positioned within the buffer vessel and configured to deliver processing fluid down into the buffer vessel.

14. The electroplating processing system of claim 12 , wherein the standpipe is characterized by a port proximate the base of the buffer vessel, and wherein the standpipe provides access to a second exit port from the buffer vessel.

Assignees

• Applied Materials Inc

Inventors

• Law Cameron
• Durado Daniel
• Oberlitner Thomas

Classifications

• H10P72/0476

  comprising at least one plating chamber · CPC title

• H10P14/46 Primary

  using a liquid · CPC title

• H10W20/043

  for electroplating · CPC title

• C25D17/02 Primary

  Tanks; Installations therefor · CPC title

• C25D7/12 Primary

  Semiconductors · CPC title